AD7854/AD7854L
16
REV. B
REFERENCE SECTION
For specified performance, it is recommended that when using
an external reference, this reference should be between 2.3 V
and the analog supply AV
DD
. The connections for the reference
pins are shown below. If the internal reference is being used,
the REF
IN
/REF
OUT
pin should be decoupled with a 100 nF
capacitor to AGND very close to the REF
IN
/REF
OUT
pin. These
connections are shown in Figure 16.
If the internal reference is required for use external to the ADC,
it should be buffered at the REF
IN
/REF
OUT
pin and a 100 nF
capacitor should be connected from this pin to AGND. The typical
noise performance for the internal reference, with 5 V supplies is
150 nV/Hz @ 1 kHz and dc noise is 100 µV p-p.
AV
DD
DV
DD
C
REF1
C
REF2
REF
IN
/REF
OUT
AD7854/
AD7854L
ANALOG
SUPPLY
+3V TO +5V
0.1
F
0.1
F10
F
0.1
F
0.01
F
0.1
F
Figure 16. Relevant Connections Using Internal Reference
The REF
IN
/REF
OUT
pin may be overdriven by connecting it to
an external reference. This is possible due to the series resis-
tance from the REF
IN
/REF
OUT
pin to the internal reference.
This external reference can be in the range 2.3 V to AV
DD
.
When using AV
DD
as the reference source, the 10 nF capacitor
from the REF
IN
/REF
OUT
pin to AGND should be as close as
possible to the REF
IN
/REF
OUT
pin, and also the C
REF1
pin
should be connected to AV
DD
to keep this pin at the same volt-
age as the reference. The connections for this arrangement are
shown in Figure 17. When using AV
DD
it may be necessary to
add a resistor in series with the AV
DD
supply. This has the effect
of filtering the noise associated with the AV
DD
supply.
Note that when using an external reference, the voltage present
at the REF
IN
/REF
OUT
pin is determined by the external refer-
ence source resistance and the series resistance of 150 k from
the REF
IN
/REF
OUT
pin to the internal 2.5 V reference. Thus, a
low source impedance external reference is recommended.
AV
DD
DV
DD
C
REF1
C
REF2
REF
IN
/REF
OUT
AD7854/
AD7854L
ANALOG
SUPPLY
+3V TO +5V
0.1
F0.1
F
10
F
0.1
F
0.01
F
0.01
F
Figure 17. Relevant Connections, AV
DD
as the Reference
AD7854/AD7854L PERFORMANCE CURVES
Figure 18 shows a typical FFT plot for the AD7854 at 200 kHz
sample rate and 10 kHz input frequency.
FREQUENCY kHz
0
20
120
0 10020
SNR dB
40 60
40
60
80
80
100
AV
DD
= DV
DD
= 3.3V
F
SAMPLE
= 200kHz
F
IN
= 10kHz
SNR = 72.04dB
THD = 88.43dB
Figure 18. FFT Plot
Figure 19 shows the SNR versus frequency for different supplies
and different external references.
INPUT FREQUENCY kHz
74
73
69
0 10020
S(N+D) RATIO dB
40 80
72
71
70
60
AV
DD
= DV
DD
WITH 2.5V REFERENCE
UNLESS STATED OTHERWISE
5.0V SUPPLIES, WITH 5V REFERENCE
5.0V SUPPLIES
5.0V SUPPLIES, L VERSION
3.3V SUPPLIES
Figure 19. SNR vs. Frequency
Figure 20 shows the power supply rejection ratio versus fre-
quency for the part. The power supply rejection ratio is defined
as the ratio of the power in ADC output at frequency f to the
power of a full-scale sine wave:
PSRR (dB) = 10 log (Pf/Pfs)
Pf = Power at frequency f in ADC output, Pfs = power of a full-
scale sine wave. Here a 100 mV peak-to-peak sine wave is
coupled onto the AV
DD
supply while the digital supply is left
unaltered. Both the 3.3 V and 5.0 V supply performances are
shown.
AD7854/AD7854L
REV. B
17
POWER-UP TIMES
Using an External Reference
When the AD7854/AD7854L are powered up, the parts are
powered up from one of two conditions. First, when the power
supplies are initially powered up and, secondly, when the parts
are powered up from a software power-down (see last section).
When AV
DD
and DV
DD
are powered up, the AD7854/AD7854L
enters a mode whereby the CONVST signal initiates a timeout
followed by a self-calibration. The total time taken for this time-
out and calibration is approximately 70 mssee Calibration on
Power-Up in the calibration section of this data sheet. The power-
up calibration mode can be disabled if the user writes to the control
register before a CONVST signal is applied. If the timeout and
self-calibration are disabled, then the user must take into account
the time required by the AD7854/AD7854L to power up before
a self-calibration is carried out. This power-up time is the time
taken for the AD7854/AD7854L to power up when power is
first applied (300 µs typ) or the time it takes the external refer-
ence to settle to the 12-bit levelwhichever is the longer.
The AD7854/AD7854L powers up from a full software power-
down in 5 µs typ. This limits the throughput which the part is
capable of to 100 kSPS for the AD7854 and 60 kSPS for the
AD7854L when powering down between conversions. Figure 21
shows how a full power-down between conversions is implemented
using the CONVST pin. The user first selects the power-down
between conversions option by setting the power management
bits, PMGT1 and PMGT0, to 0 and 1 respectively in the control
register (see last section). In this mode the AD7854/AD7854L
automatically enters a full power-down at the end of a conver-
sion, i.e., when BUSY goes low. The falling edge of the next
CONVST pulse causes the part to power up. Assuming the
external reference is left powered up, the AD7854/AD7854L
should be ready for normal operation 5 µs after this falling edge.
The rising edge of CONVST initiates a conversion so the
CONVST pulse should be at least 5 µs wide. The part auto-
matically powers down on completion of the conversion. Where
the software convert start is used, the part may be powered up in
software before a conversion is initiated.
t
CONVERT
5
s
4.6
s
POWER-UP
TIME
NORMAL
OPERATION
FULL
POWER-DOWN
POWER-UP
TIME
POWER-UP ON FALLING EDGE
START CONVERSION ON RISING EDGE
BUSY
CONVST
Figure 21. Using the
CONVST
Pin to Power Up the AD7854
for a Conversion
INPUT FREQUENCY kHz
78
80
90
0 10020
PSRR dB
40 60
82
84
86
88
80
AV
DD
= DV
DD
= 3.3V/5.0V,
100mV pk-pk SINE WAVE ON AV
DD
3.3V
5.0V
Figure 20. PSRR vs. Frequency
POWER-DOWN OPTIONS
The AD7854/AD7854L provides flexible power management to
allow the user to achieve the best power performance for a given
throughput rate. The power management options are selected
by programming the power management bits, PMGT1 and
PMGT0, in the control register. Table VI summarizes the power-
down options that are available and how they can be selected by
programming the power management bits in the control register.
The AD7854/AD7854L can be fully or partially powered down.
When fully powered down, all the on-chip circuitry is powered
down and I
DD
is 10 µA typ. If a partial power-down is selected,
then all the on-chip circuitry except the reference is powered
down and I
DD
is 400 µA typ with the external clock running.
Additional power savings may be made if the external clock is off.
The choice of full or partial power-down does not give any
significant improvement in the throughput rate which can be
achieved with a power-down between conversions. This is dis-
cussed in the next sectionPower-Up Times. But a partial
power-down does allow the on-chip reference to be used exter-
nally even though the rest of the AD7854/AD7854L circuitry is
powered down. It also allows the AD7854/AD7854L to be pow-
ered up faster after a long power-down period when using the
on-chip reference (See Power-Up Times sectionUsing the
Internal (On-Chip) Reference).
As can be seen from Table VI, the AD7854/AD7854L can be
programmed for normal operation, a full power-down at the end
of a conversion, a partial power-down at the end of a conversion
and finally a full power-down whether converting or not. The
full and partial power-down at the end of a conversion can be
used to achieve a superior power performance at slower through-
put rates, in the order of 50 kSPS (see Power vs. Throughput Rate
section of this data sheet).
Table VI. Power Management Options
PMGT1 PMGT0
Bit Bit Comment
0 0 Normal Operation
0 1 Full Power-Down After a Conversion
1 0 Full Power-Down
1 1 Partial Power-Down After a Conversion
AD7854/AD7854L
18
REV. B
Using The Internal (On-Chip) Reference
As in the case of an external reference the AD7854/AD7854L can
power up from one of two conditions, power-up after the sup-
plies are connected or power-up from a software power-down.
When using the on-chip reference and powering up when AV
DD
and DV
DD
are first connected, it is recommended that the power-
up calibration mode be disabled as explained above. When using
the on-chip reference, the power-up time is effectively the time
it takes to charge up the external capacitor on the REF
IN
/
REF
OUT
pin. This time is given by the equation:
t
UP
= 9 × R × C
where R 150K and C = external capacitor.
The recommended value of the external capacitor is 100 nF;
this gives a power-up time of approximately 135 ms before a
calibration is initiated and normal operation should commence.
When C
REF
is fully charged, the power-up time from a software
power-down reduces to 5 µs. This is because an internal switch
opens to provide a high impedance discharge path for the refer-
ence capacitor during power-downsee Figure 22. An added
advantage of the low charge leakage from the reference capacitor
during power-down is that even though the reference is being
powered down between conversions, the reference capacitor
holds the reference voltage to within 0.5 LSBs with throughput
rates of 100 samples/second and over with a full power-down
between conversions. A high input impedance op amp like the
AD707 should be used to buffer this reference capacitor if it is
being used externally. Note, if the AD7854/AD7854L is left in
its powered-down state for more than 100 ms, the charge on
C
REF
will start to leak away and the power-up time will increase.
If this longer power-up time is a problem, the user can use a
partial power-down for the last conversion so the reference
remains powered up.
SWITCH OPENS
DURING POWER-DOWN
TO OTHER CIRCUITRY
REF
IN/OUT
EXTERNAL
CAPACITOR
ON-CHIP
REFERENCE
BUF
AD7854/
AD7854L
Figure 22. On-Chip Reference During Power-Down
POWER VS. THROUGHPUT RATE
The main advantage of a full power-down after a conversion is
that it significantly reduces the power consumption of the part
at lower throughput rates. When using this mode of operation,
the AD7854/AD7854L is only powered up for the duration of
the conversion. If the power-up time of the AD7854/AD7854L
is taken to be 5 µs and it is assumed that the current during
power-up is 4.5 mA/1.5 mA typ, then power consumption as a
function of throughput can easily be calculated. The AD7854
has a conversion time of 4.6 µs with a 4 MHz external clock,
and the AD7854L has a conversion time of 9 µs with a 1.8 MHz
clock. This means the AD7854/AD7854L consumes 4.5 mA/
1.5 mA typ for 9.6 µs/14 µs in every conversion cycle if the parts
are powered down at the end of a conversion. The four graphs,
Figures 24, 25, 26 and 27, show the power consumption of the
AD7854 and AD7854L for V
DD
= 3 V as a function of through-
put. Table VII lists the power consumption for various throughput
rates.
Table VII. Power Consumption vs. Throughput
Power Power
Throughput Rate AD7854 AD7854L
1 kSPS 130 µW65µW
10 kSPS 1.3 mW 650 µW
20 kSPS 2.6 mW 1.25 mW
50 kSPS 6.48 mW 3.2 mW
4MHz/1.8MHz
OSCILLATOR
AV
DD
DV
DD
AIN(+)
AIN()
C
REF1
C
REF2
DB11
DB0
CONVST
AGND
DGND
CLKIN
REF
IN
/REF
OUT
AD7854/
AD7854L
ANALOG
SUPPLY
+3V TO +5V
0.1
F
0.1
F
10
F
0.1
F
0.01F
CONVERSION
START SIGNAL
0.1nF EXTERNAL REFERENCE
0.1
F ON-CHIP REFERENCE
0V TO 2.5V
INPUT
OPTIONAL
EXTERNAL
REFERENCE
CS
RD
WR
BUSY
AD780/
REF192
C/P
HBEN
FULL POWER-DOWN
AFTER A CONVERSION
PMGT1 = 0
PMGT0 = 1
Figure 23. Typical Low Power Circuit

AD7854LARZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 3-5V SGL Supply 200kSPS 12B Parallel
Lifecycle:
New from this manufacturer.
Delivery:
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