Micrel, Inc. MICRF002/RF022
July 2008 13
M9999-070808
C
AGC
Pin
VDDBB
VSSBB
675µA
67.5µA
Compa-
rator
1.5µA
15µA
Timout
CAG
C
Figure 3. CAGC Pin
Figure 3 illustrates the C
AGC
pin interface circuit. The AGC
control voltage is developed as an integrated current into a
capacitor C
AGC
. The attack current is nominally 15µA, while
the decay current is a 1/10th scaling of this, nominally
1.5µA, making the attack/decay time constant ratio a fixed
10:1. Signal gain of the RF/IF strip inside the IC diminishes
as the voltage at C
AGC
decreases. Modification of the
attack/decay ratio is possible by adding resistance from the
C
AGC
pin to either V
DDBB
or V
SSBB
, as desired.
Both the push and pull current sources are disabled during
shutdown, which maintains the voltage across C
AGC
, and
improves recovery time in duty-cycled applications. To
further improve duty-cycle recovery, both push and pull
currents are increased by 45 times for approximately 10ms
after release of the SHUT pin. This allows rapid recovery of
any voltage droop on C
AGC
while in shutdown.
DO and WAKEB Pins
VDDBB
VSSBB
Compa-
rator
10µA
10µA
DO
Figure 4. DO and WAKEB Pins
The output stage for DO (digital output) and WAKEB
(wakeup output) is shown in Figure 4. The output is a 10µA
push and 10µA pull switched-current stage. This output
stage is capable of driving CMOS loads. An external buffer-
driver is recommended for driving high-capacitance loads.
REFOSC Pin
250
200k
Active
Bias
REFOSC
30pF
30pF
30µA
VDDBB
VSSBB
VSSB
B
Figure 5. REFOSC Pin
The REFOSC input circuit is shown in Figure 5. Input
impedance is high (200k). This is a Colpitts oscillator with
internal 30pF capacitors. This input is intended to work with
standard ceramic resonators connected from this pin to the
V
SSBB
pin, although a crystal may be used when greater
frequency accuracy is required. The nominal dc bias
voltage on this pin is 1.4V.
SEL0, SEL1, SWEN, and SHUT Pins
to Interna
l
Circuits
VDDBB
VSSBB
SEL0,
SEL1,
SWEN
Q2
Q3
Q1
VSSBB
SHUT
Q4
Figure 6a. SEL0, SEL1, SWEN Pins
to Interna
l
Circuits
VDDBB
VSSBB
SHUT
Q2
Q3
Q1
VSSBB
Figure 6b. SHUT Pin
Control input circuitry is shown in Figures 6a and 6b. The
standard input is a logic inverter constructed with minimum
geometry MOSFETs (Q2, Q3). P-channel MOSFET Q1 is
a large channel length device which functions essentially
as a “weak” pullup to V
DDBB
. Typical pull-up current is 5µA,
leading to an impedance to the V
DDBB
supply of typically
1M.
Micrel, Inc. MICRF002/RF022
July 2008 14
M9999-070808
Applications Example
315MHz Receiver/Decoder Application
Figure 7 illustrates a typical application for the MICRF002
UHF Receiver IC. This receiver operates continuously (not
duty cycled) in sweep mode, and features 6-bit address
decoding and two output code bits.
Operation in this example is at 315MHz, and may be
customized by selection of the appropriate frequency
reference (Y1), and adjustment of the antenna length. The
value of C4 would also change if the optional input filter is
used. Changes from the 1kb/s data rate may require a
change in the value of R1. A bill of materials accompanies
the schematic.
SEL0SEL0 SWEN
VSSRF REFOSC
VSSRF SEL1
ANT CAGC
VDDRF WAKEB
VDDBB SHUT
CTH DO
NC VSSBB
C2
2.2µF
4.8970MHz
Y1
U1 MICRF002
4.7µF
Optional Filter
8.2pF, 16.6nH
pcb foil inductor
1in of 30mil trace
C4
L1
+5V
Supply
Input
C1
4.7µF
A0 VDD
A1 VT
A2 OSC1
A3 OSC2
A4 DIN
A5 D11
A6 D10
A7 D9
U2 HT-12D
VSS D8
R1
68k
R2
1k
Code Bit 0
Code Bit 1
RF
(Analog)
Ground
Baseband
(Digital)
Ground
0.4λ monopole
antenna (11.6in)
6-bit
address
Figure 7. 315MHz, 1kbps On-Off Keyed Recwiver/Decoder
Bill of Materials
Item Part Number Manufacturer Description Qty.
C1 Vishay
(1)
4.7µF, Dipped Tantalum Capacitor 1
C2 Vishay
(1)
2.2µF, Dipped Tantalum Capacitor 1
C3 Vishay
(1)
4.7µF, Dipped Tantalum Capacitor 1
C4 Vishay
(1)
8.2pF, COG Ceramic Capacitor 1
CR1 CSA6.00MG Murata
(2)
6.00MHz, Ceramic Resonator 1
D1 SSF-LX100LID Lumex
(3)
RED LED 1
R1 68k, 1/4W, 5% 1
R2 Vishay
(1)
1k, 1/4W, 5% 1
U1 MICRF002 Micrel, Inc.
(4)
300-440MHz QwikRadio
®
ASK Receiver 1
U2 HT-12D Holtek
(5)
Logic Decoder 1
Notes:
1. Vishay Tel: (203) 268-6261
2. Murata Tel: (800) 241-6574, Fx: (770) 436-3030
3. Lumex Tel: (800) 278-5666, Fx: (847) 359-8904
5. Micrel, Inc.: (408) 944-0800
5. Holtek Tel: (408) 894-9046, Fx: (408) 894-0838
Micrel, Inc. MICRF002/RF022
July 2008 15
M9999-070808
PCB Layout Information
The MICRF002 evaluation board was designed and
characterized using two sided 0.031 inch thick FR4
material with 1 ounce copper clad. If another type of printed
circuit board material were to be substituted, impedance
matching and characterization data stated in this document
may not be valid. The gerber files for this board can be
downloaded from the Micrel website at www.micrel.com.
PCB Silk Screen
PCB Component Side Layout
PCB Solder Side Layout
R2
10k
C3(CTH)
0.047µF
C2
0.1µF
C1
4.7µF
C4(C
AGC
)
4.7µF
Y1
6.7458MHz
MICRF002
REF.OSC.
GND
SHUT
GND
DO
GND
J2
JP2
J5
J4
C5
(Not Placed)
JP3JP1
+5V
GND
J3
J1
RF INPUT
Z2
Squelch
Resistor
(Not Placed)
5
6
7
8
12
11
10
9
1
2
3
4
16
15
14
13
SEL0
VSSRF
VSSRF
ANT
VDDRF
VDDBB
CTH
NC
SWEN
REFOSC
SEL1
CAGC
WAKEB
SHUT
DO
VSSBB
Z1
R1
Z4Z3

MICRF002YM

Mfr. #:
Manufacturer:
Microchip Technology / Micrel
Description:
RF Receiver (Not Recommended for New Designs)300-440MHz RF Receiver With Shutdown
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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