VJ....31X RoHS Automotive MLCC
www.vishay.com
Vishay Vitramon
Revision: 29-May-18
16
Document Number: 45226
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 - INSPECTION CRITERIA
The supplier shall carry out visual examination with suitable equipment with approximately 10 x magnification and lighting
appropriate to the specimen under test and the required quality level.
Chipping
The components shall be free of cracks or fissures. Small damages which do not deteriorate the performance of the component
shall be less than 50 % of the surface of the MLCC as defined in EIA 595.
Delamination or Exposed Electrodes
No visible separation or delamination between layers of the capacitor and no exposed electrodes between the two terminals of
the capacitor must be seen.
Metallization
For the metallization, no visible detachment of the metallized terminals and no exposed electrodes must be seen. Defects and
gaps in the metallization on each sides of the terminal must not exceed 10 % of the total area (e.g. A, B, C, …). Leaching shall
not exceed 25 %.
Electrode Distance
The ceramic body shall be free of any conducting material between the terminals which reduces the distance of the electrodes.
The minimum distance “D” is 400 μm for all package sizes, except 0402. For the component package 0402 the minimum
distance is 200 μm.
C
A
B
D
VJ....31X RoHS Automotive MLCC
www.vishay.com
Vishay Vitramon
Revision: 29-May-18
17
Document Number: 45226
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
6 - BOARD FLEX TEST CONDITIONS
6.1 BOARD FLEX DEFINITIONS OF TEST
PCB thickness = (1.6 ± 0.1) mm
Copper thickness = 35 μm
Material FR4 (EP-GC 02 according to DIN 40 802)
Note
LL = total length; LB = width of the pad; LEL = single pad length
6.2 SOLDERING INSTRUCTIONS
6.3 TYPICAL TEMPERATURE PROFILE FOR REFLOW SOLDERING (Boardflex test)
LAYOUT / PAD DESIGN (Dimensions in mm)
CASE CODE
PAD SIZE
LL LB LEL
0603 2.20 1.00 0.75
0805 3.40 1.30 1.20
1206 4.50 1.80 1.20
1210 4.50 2.80 1.30
1812 4.75 3.60 1.50
THICKNESS, RECOMMENDED FOR SOLDER PASTE (Reflow soldering)
CASE CODE THICKNESS in μm
0402 75 to 90
0603 150 to 200
0805 150 to 200
1206 150 to 200
1210 150 to 200
1812 150 to 200
LEL
LL
LB
TEMPERATURE (°C)
300
250
200
150
100
0 50 100 150 200 250 300 350 400
TIME (s)
LEAD (Pb)-FREE SOLDERING PROFILE
MIN. 300 s
MAX. 260 °C
MIN. 255 °C
T (SOLID) MIN. 217 °C
MIN. 190 °C
MIN. 40 s
MIN. 90 s
RAMP UP
TO 150 °C
MAX. 3 K/s
RAMP DOWN
FROM T (SOLID)
MAX. 6 K/s
MIN. 110 s
50
0
VJ....31X RoHS Automotive MLCC
www.vishay.com
Vishay Vitramon
Revision: 29-May-18
18
Document Number: 45226
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
6.4 MOUNTING, DIMENSIONS, AND TESTING
Mounting
Testing
6.5 PERFORMANCE OF THE TEST(S)
A) Electrical test according to component specification (Cap, DF, IR)
B) Mounting to PCB
C) Storage at room temperature (min. 10 h)
D) Board flex test
6.6 DETAILS
6.7 FAILURE CRITERIA
X7R, X8R PCB to be deflected continuously, speed 1 mm/s (± 0.5 mm/s)
C0G
PCB to be deflected in steps until cracks or other damages are visible or can be measured.
Dwell time between steps: (5 ± 1) s
X7R, X8R Piezoelectric sensor, no failure up to min. 2 mm
C0G C/C < 1 % or < 1 pF, no failure up to min. 2 mm
Both Electrical test according to component specification
SMD under test
Solder
Support
1.6 ± 0.1
90 ± 1
45 ± 2
Printed board
before test
R = 3
++
+
+
Material: Aluminum
20
Printed board
during test
Width = actual width
of substrate + 5 mm
on both sides
Radius
1 to 2
Width
Displacement
D = min. 2 mm
All dimensions in mm
10 ± 0.1

VJ1210A562JXBAT

Mfr. #:
Manufacturer:
Vishay / Vitramon
Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 5600PF 100V 5%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union