16©2016 Integrated Device Technology, Inc Revision B March 3, 2016
810001-21 Data Sheet
Package Outline and Package Dimensions
Package Outline - K Suffix for 32 Lead VFQFN
Table 7. Package Dimensions
Reference Document: JEDEC Publication 95, MO-220
NOTE: The following package mechanical drawing is a generic
drawing that applies to any pin count VFQFN package. This drawing
is not intended to convey the actual pin count or pin layout of this
device. The pin count and pinout are shown on the front page. The
package dimensions are in Table 7.
To p View
Index Area
D
Cham fer 4x
0.6 x 0.6 max
OPTIONAL
Anvil
Singula tion
A
0. 08 C
C
A3
A1
S eating Plan e
E2
E2
2
L
(N
-1)x e
(R ef.)
(Ref.)
N & N
Even
N
e
D2
2
D2
(Ref.)
N & N
Odd
1
2
e
2
(Ty p.)
If N & N
are Even
(N -1)x e
(Re f.)
b
Th er mal
Base
N
OR
Anvil
Singulation
N-1N
CHAMFER
1
2
N-1
1
2
N
RADIUS
4
4
Bottom View w/Type C IDBottom View w/Type A ID
There are 2 methods of indicating pin 1 corner at the back of the VFQFN package:
1. Type A: Chamfer on the paddle (near pin 1)
2. Type C: Mouse bite on the paddle (near pin 1)
JEDEC Variation: VHHD-2/-4
All Dimensions in Millimeters
Symbol Minimum Nominal Maximum
N 32
A 0.80 1.00
A1 00.05
A3 0.25 Ref.
b 0.18 0.25 0.30
N
D
& N
E
8
D & E 5.00 Basic
D2 & E2 3.0 3.3
e 0.50 Basic
L 0.30 0.40 0.50
