Obsolete Product(s) - Obsolete Product(s)
Package information STLC7550
22/24 Rev 9
6 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 13. TQFP48 (7 x 7 x 1.4mm) Mechanical Data & Package Dimensions
Body: 7 x 7 x 1.40mm
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.60 0.063
A1 0.05 0.15 0.002 0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.17 0.22 0.27 0.006 0.008 0.010
C 0.09 0.20 0.004 0.008
D 9.00 0.354
D1 7.00 0.276
D3 5.50 0.217
e 0.50 0.020
E 9.00 0.354
E1 7.00 0.276
E3 5.50 0.217
L 0.45 0.60 0.75 0.018 0.024 0.030
L1 1.00 0.039
K (min.), 3.5˚(typ.), 7°(max.)
TQFP48
OUTLINE AND
MECHANICAL DATA
Obsolete Product(s) - Obsolete Product(s)
STLC7550 Revision history
Rev 9 23/24
7 Revision history
Table 17. Document revision history
Date Revision Changes
14-Jan-2004 8 Initial release.
06-Feb-2006 9
Removed the TQFP44 package and the respective ordering
part number.
Inserted the new part number E-STLC7550TQF7 (ECOPACK).
Obsolete Product(s) - Obsolete Product(s)
STLC7550
24/24 Rev 9
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E-STLC7550TQF7

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC AFE 1 CHAN 16BIT 48TQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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