Data Sheet ADIS16240
Rev. C | Page 15 of 20
Table 27. XACCL_OFF, YACCL_OFF, ZACCL_OFF
1
Bit Description (Default = 0x0000)
[15:10] Unused
[9:0] Offset, twos complement, 51.4 mg/LSB
1
The XACCL_OFF register is located at Address 0x21[15:8] and Address 0x20[7:0].
The YACCL_OFF register is located at Address 0x23[15:8] and Address 0x22[7:0].
The ZACCL_OFF register is located at Address 0x25[15:8] and Address 0x24[7:0].
Diagnostics
For all of the error flags in the DIAG_STAT register (see Table 28),
a 1 identifies an error condition, and a 0 signals normal operation.
All of the flags return to 0 after reading DIAG_STAT. If the power
supply is still out of range during the next sample cycle, DIAG_
STAT[0] and DIAG_STAT[1] return to 1. DIAG_STAT[9:8] pro-
vide flags to check for the alarms with respect to the conditions in
the ALM_CTRL and ALM_MAGx registers. DIAG_STAT[6]
contains the internal memory checksum result. If the sum of the
firmware program memory does not does not match the expected
value, this flag reports a 1. The SPI communication flag (DIAG_
STAT[3]) changes to 1 when the number of SCLK pulses during
a SPI transfer is not a multiple of 16 when
CS
goes high.
Table 28. DIAG_STAT Register Bit Descriptions
1
Bit Description (Default = 0x0000)
[15:10] Unused
9 Alarm 2 status: 1 = alarm active, 0 = alarm inactive
8 Alarm 1 status: 1 = alarm active, 0 = alarm inactive
7 Capture buffer full: 1 = capture buffer is full
6 Flash test, checksum flag: 1 = mismatch, 0 = match
5 Power-on, self-test flag: 1 = failure, 0 = pass
4 Power-on self-test: 1 = in-progress, 0 = complete
3 SPI communications failure: 1 = error, 0 = normal
2
Flash update failure: 1 = failure, 0 = pass
1 Power supply above 3.625 V: 1 = above, 0 = below
0 Power supply below 2.225 V: 1 = below, 0 = above
1
The DIAG_STAT register is located at Address 0x1B[15:8] and Address 0x1A[7:0].
Clock
The CLK_TIME, CLK_DATE, and CLK_YEAR registers provide
an internal clock that enables a time entry into the event header
and for user access. If CLK_TIME = 0x2231, the time is 22:31,
or 10:31 p.m. The CLK_DATE and CLK_YEAR registers follow
a similar binary-coded, decimal format.
Table 29. CLK_TIME Register Bit Descriptions
1
Bit Description
[15:14] Unused
[13:12] Hours, 10s digit
[11:8] Hours, 1s digit
7
Unused
[6:4] Minutes, 10s digit
[3:0] Minutes, 1s digit
1
The CLK_TIME register is located at Address 0x2F[15:8] and Address 0x2E[7:0].
Table 30. CLK_DATE Register Bit Descriptions
1
Bit Description (Default = 0x0000)
[15:13] Unused
12 Month, 10s digit
[11:8] Month, 1s digit
[7:6] Unused
[5:4] Day, 10s digit
[3:0] Day, 1s digit
1
The CLK_DATE register is located at Address 0x31[15:8] and Address 0x30[7:0].
Table 31. CLK_YEAR Register Bit Descriptions
1
Bit Description (Default = 0x0000)
[15:8] Unused
[7:4] Year, 10s digit
[3:0] Year, 1s digit
1
The CLK_YEAR register is located at Address 0x33[15:8] and Address 0x32[7:0].
The WAKE_TIME and WAKE_DATE registers enable users
to program a specific time for the ADIS16240 to exit standby
mode. Enable this function by writing the wake-up time and
date to these registers.
Table 32. WAKE_TIME Register Bit Descriptions
1
Bit Description (Default = 0x0000)
15 Wake time enable (1 = enabled, 0 = disabled)
14 Unused
[13:12] Hours, 10s digit
[11:8] Hours, 1s digit
7 Unused
[6:4] Minutes, 10s digit
[3:0] Minutes, 1s digit
1
The WAKE_TIME register is located at Address 0x35[15:8] and Address 0x34[7:0].
Table 33. WAKE_DATE Register Bit Descriptions
1
Bit Description (Default = 0x0000)
[15:14] Unused
[13:12] Month, 10s digit
[11:8] Month, 1s digit
[7:6] Unused
[5:4] Day, 10s digit
[3:0] Day, 1s digit
1
The WAKE_DATE register is located at Address 0x37[15:8] and Address 0x36[7:0].
Checksum
Table 34. CHK_SUM Register Bit Descriptions
1
Bit Description
[15:0] Sum of memory locations used to verify code integrity
1
The CHK_SUM register is located at Address 0x1F[15:8] and Address 0x1E[7:0].
ADIS16240 Data Sheet
Rev. C | Page 16 of 20
Flash Memory Endurance Management
The FLASH_CNT register (see Table 35) tracks the number of
flash memory write cycles, to help manage the flash endurance
of the ADIS16240 (see Table 1). This register contains a binary
counter that increments after every flash memory write cycle,
with one exception: event storage. Each event capture will
automatically update in its particular flash memory location,
but only the first event capture will trigger a complete flash
update (all user control registers) and result in the FLASH_CNT
incrementing the counter. In addition to the first event
capture/storage, activating the auto-null (GLOB_CMD[0]),
factory reset (GLOB_CMD[1]), and manual flash update
GLOB_CMD[3] will also result in a manual flash write cycle
that causes FLASH_CNT to increment.
Table 35. FLASH_CNT Register Bit Descriptions
1
Bit Description
[15:0] Binary code, increments with every flash memory write
cycle.
1
The FLASH_CNT register is located at Address 0x01[15:8] and Address
0x00[7:0].
Data Sheet ADIS16240
Rev. C | Page 17 of 20
APPLICATIONS INFORMATION
ASSEMBLY
When developing a process flow for installing the ADIS16240
devices on PCBs, see the JEDEC standard document J-STD-020C
for reflow temperature profile and processing information. The
ADIS16240 can use the Sn-Pb eutectic process and the Pb-free
eutectic process from this standard. See JEDEC J-STD-033 for
moisture sensitivity (MSL) handling requirements. The MSL
rating for these devices is marked on the antistatic bags, which
protect these devices from ESD during shipping and handling.
Prior to assembly, review the process flow for information about
introducing shock levels that exceed the absolute maximum
ratings for the ADIS16240. PCB separation and ultrasonic
cleaning processes can introduce high levels of shock and
damage the MEMS element. Bowing or flexing the PCB after
solder reflow can also place large pealing stress on the pad
structure and can damage the device. If this is unavoidable,
consider using an underfill material to help distribute these
forces across the bottom of the package. Figure 23 provides
a PCB pad design example for this package style.
08133-023
NOTES
1. 12 × 12mm miniBGA PACKAGE
2. 11 × 11 BALL ARRAY – 121 SOLDER BALLS
3. 0.5 mm DIAMETER SOLDER BALLS – 1mm BALL PITCH
4. ALL DIMENSIONS IN MILLIMETERS.
1.00mm
1.00mm
10.00mm
10.00mm
11 × 11 ARRAY PATTERN
METAL PAD
0.60mm
SM OPEN
0.400mm
DETAIL A
PAD DIMENSION
SOLDER MASK OPENING
RECOMMEND SOLDER MASK
DEFINED ATTACH PAD
Figure 23. Recommended Pad Layout (Units in Millimeters)
INTERFACE PRINTED CIRCUIT BOARD (PCB)
The ADIS16240/PCBZ includes one ADIS16240ABCZ IC on
a 1.2 inch × 1.3 inch PCB. The interface PCB simplifies the IC
connection of these devices to an existing processor system. The
four mounting holes accommodate either M2 (2 mm) or 2-56
machine screws. These boards are made of IS410 material and
are 0.063 inches thick. The second-level assembly uses a SAC305-
compatible solder composition, which has a pre-solder reflow
thickness of approximately 0.005 inches.
The pad pattern on these PCBs matches that shown in Figure 24.
J1 and J2 are dual-row, 2 mm (pitch) connectors that work with
a number of ribbon cable systems, including 3M Part Number
152212-0100-GB (ribbon crimp connector) and 3M Part Number
3625/12 (ribbon cable). The schematic and connector pin
assignments for the ADIS16240/PCBZ are in Figure 25.
iSensor
U1
J
1
C1
J2
1.
050
2 × 0.92
5
2
× 0.673
2
× 0
.000
0.1
50
0.200
0.035
2 × 0.000
0.865
2 × 0.900
1.100
4 × Ø0.087
M2 ×
0.4
08133-025
*
PIN 1 IDENTIFIER
*
*
*
Figure 24. PCB Assembly View and Dimensions
08133-024
ADIS16240ABCZ
RST
DIO2
DIO1
R2
10kΩ
C1
10µF
R1
10kΩ
AN
GND
CMP1
CMP2
SCLK
CS
DOUT
DIN
GND
VDD
1
J2
2
3
4
5
6
7
8
9
10
11
12
1
J1
2
3
4
5
6
7
8
9
10
11
12
Figure 25. Electrical Schematic

ADIS16240ABCZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Accelerometers Low Pwr Prgm Impact Sensor & Recorder
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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