Data Sheet ADRF5132
Rev. A | Page 9 of 12
APPLICATIONS INFORMATION
EVALUATION BOARD
The ADRF5132-EVALZ can handle high power levels and
temperatures at which the device operates.
The ADRF5132-EVALZ evaluation board is constructed with
eight metal layers and dielectrics between each layer as shown
in Figure 13. Each metal layer has 1 oz (1.3 mil) copper
thickness, whereas the external layers are 1.5 oz copper.
The top dielectric material is 10 mil Rogers RO4350, which
exhibits a very low thermal coefficient, offering control over the
thermal rise of the board. The dielectrics between the other
metal layers are FR4. The total board thickness achieved is
60 mil.
W = 18mil
G = 13mil
T = 2.1 mil
TOTAL THICKNESS = 60mil
H = 10mil
1.5oz Cu (2.1mil)
RO4350 = 10mil
FR4
FR4
FR4
FR4
FR4
FR4
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1.5oz Cu (2.1mil)
1.5oz Cu (2.1mil) 1.5oz Cu (2.1mil)
16424-013
Figure 13. ADRF5132-EVALZ Evaluation Board Cross Sectional View
The top copper layer has all RF and dc traces, whereas the other
seven layers provide sufficient ground and help to handle the
thermal rise on the ADRF5132-EVALZ. In addition, via holes
are provided around transmission lines and under the exposed
pad of package, as shown in Figure 15, for proper thermal
grounding. RF transmission lines on the evaluation board are
coplanar wave guide design with a width of 18 mil and ground
spacing of 13 mil.
To ensure maximum heat dissipation and reduce thermal rise
on the evaluation board, some application considerations are
essential. Attach the ADRF5132-EVALZ to a copper support
plate at the bottom of the evaluation board. The ADRF5132-
EVALZ comes with this support plate attachment. Attach the
ADRF5132-EVALZ with its support plate to a big heat sink
using thermal grease during all high power operations. Figure 14
shows the evaluation board temperature vs. RF power input
tested with the preceding conditions and precautions
(evaluation board and support plate attached to a big heat sink).
The temperature rise is less than 5°C up to 43 dBm RF power
input, which provides the required thermal dissipation when
operated at high power levels.
81
80
79
78
77
76
75
38.0 38.5 39.0 39.5 40.0 40.5 41.0 41.5 42.0 42.5 43.0
BOARD TEMPERATURE (°C)
RF POWER INPUT (dBm)
16424-014
Figure 14. ADRF5132-EVALZ Evaluation Board Temperature Rise
(Oven Temperature Set to 75°C)
16424-015
Figure 15. ADRF5132-EVALZ Evaluation Board Layout
