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KMA200,115

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33
KMA200 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 7 December 2011 25 of 33
NXP Semiconductors
KMA200
Programmable angle sensor
[1] DI[2:0]: diagnosis of input stage: default value: 000
000 level 0: A
Meas
A
Soll
<6.24mV/V
001 level 1: A
Meas
A
Soll
<4.68mV/V
010 level 2: A
Meas
A
Soll
<3.12mV/V
011 level 3: A
Meas
A
Soll
<1.56mV/V
100 level 4: A
Meas
A
Soll
<0.78mV/V
[2] FB: automatic fallback into normal operation mode: default value: 1
0 disabled
1 enabled
This bit is evaluated only if the CRC checksum is valid.
[3] ETS: enable temperature supervision: default value: 1
0 disabled
1 enabled
[4] TC[1:0]: error counter temperature supervision: default value: 00
00 0
01 2
10 4
11 8
[5] EDO: enable diagnosis output stage: default value: 0
0 disabled
1 enabled
[6] CO[1:0]: error counter diagnosis output stage: default value: 00
00 0
01 2
10 4
11 8
[7] EDI: enable diagnosis input stage: default value: 1
0 disabled
1 enabled
[8] CI[1:0]: error counter diagnosis input stage: default value: 00
00 0
01 2
10 4
11 8
Table 13. Format of ctrl2
MSB LSB
15 14 13 12 11
[1]
10 9
[2]
8
[3]
7
[4]
6
[4]
5
[5]
4
[6]
3
[6]
2
[7]
1
[8]
0
[8]
0 0 0 0 DI2 1 FB ETS TC1 TC0 EDO CO1 CO0 EDI CI1 CI0
Table 14. Format of V
(CL)l
and V
(CL)u
Lower clamping level output voltage = 5 %V
DD
+V
(CL)l
0.1 %V
DD
and
upper clamping level output voltage = 69.5 %V
DD
+V
(CL)u
0.1 %V
DD
.
MSB LSB
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
V
(CL)l
V
(CL)u
2
7
2
6
2
5
2
4
2
3
2
2
2
1
2
0
2
7
2
6
2
5
2
4
2
3
2
2
2
1
2
0
KMA200 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 7 December 2011 26 of 33
NXP Semiconductors
KMA200
Programmable angle sensor
14. ElectroMagnetic Interference (EMI)
The following tests are performed with the sensor system KMA200. Details of the
measurements and behavior are available on request.
14.1 Emission (CISPR 25)
Conducted radio disturbance: tests according CISPR 25, chapter 11 (artificial network).
Radiated radio disturbance: test according CISPR 25, chapter 13 (anechoic chamber -
component/module).
14.2 Radiated disturbances (ISO 11452-2, ISO 11452-5)
Immunity against mobile phones and Absorber Lined Chamber and Strip line (ALCS); strip
line measurements are performed up to 1 GHz.
14.3 Transients - pulses (ISO 7637-1, ISO 7637-3)
Galvanic: line conducted pulses on the supply lines according ISO 7637-1 pulses 1, 2, 3a,
3b, 4 and 5 (for pulse no. 5 a suitable protection circuit must be used).
Coupled: transient transmission by capacitive and inductive coupling via lines other than
supply lines (interface, analog output) according ISO 7637-3 pulses 3a and 3b.
15. ElectroStatic Discharge (ESD)
15.1 Human body model
The KMA200 must not be damaged at 4000 V, 100 pF, 1.5 k to the human body model.
The test is according to MIL-STD-883D method 3015.7. This protection must be ensured
at all external pins (CLK/OUT2, CS
and DATA/OUT1) including device supply (V
DD
, GND).
For the interconnects (pins between upper and lower package part), the protection is up to
1500 V.
15.2 Machine model
The KMA200 must not be damaged at 400 V to the machine model. The test is according
to MIL-STD-883D method 3015.7. This protection must be ensured at all external pins
(CLK/OUT2, CS
and DATA/OUT1) including device supply (V
DD
, GND). For the
interconnects (pins between upper and lower package part), the protection is up to 100 V.
16. Terminals
Device terminals shall be compatible with laser welding and electrical welding.
Lead frame material: CuZr with 0.1 % Zr, 99.9 % Cu
Lead finish: pure tin, 7 m thickness 11 m
KMA200 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 7 December 2011 27 of 33
NXP Semiconductors
KMA200
Programmable angle sensor
17. Marking
Package is SOT637
Marking paint: laser on package head and package body
Letter height: 0.8 mm
Marking of package head: batch number
Marking of package body: type no., date code (x yyy z); x: m for manufacturing Manila,
y: day of the year, z: year of production
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33

KMA200,115

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NXP Semiconductors
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Motion & Position Sensors Board Mount Motion & Position Sensors SNSR MAGNETIC TAPE-7
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