22©2016 Integrated Device Technology, Inc. Revision C, February 26, 2016
813N322I-02 Datasheet
Package Outline and Package Dimensions
Package Outline - K Suffix for 32 Lead VFQFN
Table 8. Package Dimensions
Reference Document: JEDEC Publication 95, MO-220
NOTE: The following package mechanical drawing is a generic
drawing that applies to any pin count VFQFN package. This drawing
is not intended to convey the actual pin count or pin layout of this
device. The pin count and pin out are shown on the front page. The
package dimensions are in Table 8.
To p View
Index Area
D
Chamfer 4x
0.6 x 0.6 max
OPTIONAL
Anvil
Singula tion
A
0. 08 C
C
A3
A1
S eating Plane
E2
E2
2
L
(N
-1)x e
(Ref.)
(Ref.)
N & N
Even
N
e
D2
2
D2
(Ref.)
N & N
Odd
1
2
e
2
(Ty p.)
If N & N
are Even
(N -1)x e
(Re f.)
b
Th er mal
Base
N
OR
Anvil
Singulation
N-1N
CHAMFER
1
2
N-1
1
2
N
RADIUS
4
4
Bottom View w/Type C IDBottom View w/Type A ID
There are 2 methods of indicating pin 1 corner at the back of the VFQFN package:
1. Type A: Chamfer on the paddle (near pin 1)
2. Type C: Mouse bite on the paddle (near pin 1)
JEDEC Variation: VHHD-2/-4
All Dimensions in Millimeters
Symbol Minimum Nominal Maximum
N 32
A 0.80 1.00
A1 00.05
A3 0.25 Ref.
b 0.18 0.25 0.30
N
D
& N
E
8
D & E 5.00 Basic
D2 & E2 3.0 3.3
e 0.50 Basic
L 0.30 0.40 0.50
