Package and PCB thermal data VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
22/37 Doc ID 7383 Rev 4
4.2 SOT-223 thermal data
Figure 40. SOT-223 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area=58 mm x 58 mm, PCB
thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.11 cm
2
, 1 cm
2
, 2 cm
2
).
Figure 41. R
thj-amb
vs PCB copper area in open box free air condition
C2 (W.s/°C) 9.00E-04
C3 (W.s/°C) 7.50E-03
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2
Table 5. SO-8 thermal parameter (continued)
Area/island (cm
2
)Footprint2
60
70
80
90
100
110
120
130
140
00.511.522.5
Cu area (cm^2)
RTH j-amb (°C/W)
VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Package and PCB thermal data
Doc ID 7383 Rev 4 23/37
Figure 42. SOT-223 thermal impedance junction ambient single pulse
Figure 43. Thermal fitting model of an OMNIFET II in SOT-223
Equation 2 Pulse calculation formula
where
Table 6. SOT-223 thermal parameter
Area/island (cm
2
)Footprint2
R1 (°C/W) 0.2
R2 (°C/W) 1.1
R3 (°C/W) 4.5
R4 (°C/W) 24
R5 (°C/W) 0.1
R6 (°C/W) 100 45
C1 (W.s/°C) 3.00E-04
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
T_amb
C1
R1 R2
C2
R3
C3
R4
C4
R5
C5
R6
C6
Pd
Tj
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
δ t
p
T=
Package and PCB thermal data VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
24/37 Doc ID 7383 Rev 4
4.3 DPAK thermal data
Figure 44. DPAK PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area=60 mm x 60 mm, PCB
thickness=2 mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8 cm2).
Figure 45. R
thj-amb
vs PCB copper area in open box free air condition
C2 (W.s/°C) 9.00E-04
C3 (W.s/°C) 3.00E-02
C4 (W.s/°C) 0.16
C5 (W.s/°C) 1000
C6 (W.s/°C) 0.5 2
Table 6. SOT-223 thermal parameter (continued)
Area/island (cm
2
)Footprint2
30
40
50
60
70
80
90
0246810
PCB CU heatsink area (cm^2)
RTH j_amb (ºC/W)

VND7NV0413TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers N-Ch 42V 6A OmniFET
Lifecycle:
New from this manufacturer.
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