VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Package and PCB thermal data
Doc ID 7383 Rev 4 25/37
Figure 46. DPAK thermal impedance junction ambient single pulse
Figure 47. Thermal fitting model of an OMNIFET II in DPAK
Equation 3 Pulse calculation formula
where
Table 7. DPAK thermal parameter
Area/island (cm
2
)Footprint6
R1 (°C/W) 0.1
R2 (°C/W) 0.35
R3 (°C/W) 1.20
R4 (°C/W) 2
R5 (°C/W) 15
R6 (°C/W) 61 24
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
T_amb
C1
R1 R2
C2
R3
C3
R4
C4
R5
C5
R6
C6
Pd
Tj
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
δ t
p
T=
Package and PCB thermal data VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
26/37 Doc ID 7383 Rev 4
C1 (W.s/°C) 0.0006
C2 (W.s/°C) 0.0021
C3 (W.s/°C) 0.05
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.45
C6 (W.s/°C) 0.8 5
Table 7. DPAK thermal parameter (continued)
Area/island (cm
2
)Footprint6
VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1 Package and packing information
Doc ID 7383 Rev 4 27/37
5 Package and packing information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK® is an ST trademark.
5.1 TO-251 (IPAK) mechanical data
Table 8. TO-251 (IPAK) mechanical data
Symbol
millimeters
Min. Typ. Max.
A2.2 2.4
A1 0.9 1.1
A3 0.7 1.3
B 0.64 0.9
B2 5.2 5.4
B3 0.85
B5 0.3
B6 0.95
C 0.45 0.6
C2 0.48 0.6
D6 6.2
E6.4 6.6
G4.4 4.6
H15.9 16.3
L9 9.4
L1 0.8 1.2
L2 0.8 1

VND7NV0413TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers N-Ch 42V 6A OmniFET
Lifecycle:
New from this manufacturer.
Delivery:
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