NCN5193
www.onsemi.com
14
PACKAGE DIMENSIONS
CASE 488AM
ISSUE A
SEATING
NOTE 4
K
0.15 C
(A3)
A
A1
D2
b
1
9
17
32
E2
32X
8
L
32X
BOTTOM VIEW
TOP VIEW
SIDE VIEW
D
A
B
E
0.15
C
PIN ONE
LOCATION
0.10 C
0.08 C
C
25
e
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PLANE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
3.35
0.30
3.35
32X
0.63
32X
5.30
5.30
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL B
DETAIL A
DIM
A
MIN
MILLIMETERS
0.80
A1 −−−
A3 0.20 REF
b 0.18
D 5.00 BSC
D2 2.95
E 5.00 BSC
2.95
E2
e 0.50 BSC
0.30
L
K
0.20
1.00
0.05
0.30
3.25
3.25
0.50
−−−
MAX
−−−
L1
0.15
e/2
NOTE 3
PITCH
DIMENSION: MILLIMETERS
RECOMMENDED
A
M
0.10 BC
M
0.05 C
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