NCP308, NCV308
www.onsemi.com
11
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
SEATING
PLANE
D
E
0.10 C
A3
A
A1
0.10 C
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE O
DIM
A
MIN MAX
MILLIMETERS
0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 2.00 BSC
D2 1.50 1.70
0.90 1.10
E
2.00 BSC
E2
e
0.65 BSC
0.20
0.40
L
PIN ONE
REFERENCE
0.05 C
0.05 C
NOTE 4
A0.10 C
NOTE 3
L
e
D2
E2
b
B
3
6
6X
1
4
0.05 C
MOUNTING FOOTPRINT*
BOTTOM VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
A
B
TOP VIEW
C
SIDE VIEW
---
0.15
L1
6X
0.45
2.30
1.12
1.72
0.65
PITCH
6X
0.40
1
PACKAGE
OUTLINE
6X
M
M
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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