FEBRUARY 8, 2017 7 2-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER
9DBL0242 / 9DBL0252 DATASHEET
Electrical Characteristics–DIF Low-Power HCSL Outputs
Electrical Characteristics–Current Consumption
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
dV/dt Scope averaging on, fast setting 2 2.8 4
V/ns
1,2,3
dV/dt Scope averaging on, slow setting 1.2 1.9 3.1
V/ns
1,2,3
Slew rate matching
Δ
dV/dt Slew rate matching 7 20
%
1,2,4
Voltage High V
HIGH
660 768 850 7
Voltage Low V
LOW
-150 -11 150 7
Max Voltage Vmax 811 1150 7
Min Voltage Vmin -300 -49 7
Crossing Voltage (abs) Vcross_abs Scope averaging off 250 357 550 mV 1,5
Crossing Voltage (var)
Δ
-Vcross Scope averaging off 14 140 mV 1,6
2
Measured from differential waveform
7
At default SMBus settings.
Slew rate
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
mV
Measurement on single ended signal using
absolute value. (Scope averaging off)
mV
1
Guaranteed by design and characterization, not 100% tested in production.
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross
absolute) allowed. The intent is to limit Vcross induced modulation by setting
Δ
-Vcross to be smaller than Vcross absolute.
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
I
DDA
VDDA, PLL Mode @100MHz 7 10 mA
I
DDDIG
VDDDIG, PLL Mode @100MHz 3.4 5 mA
I
DDO+R
VDDO+VDDR, PLL Mode, All outputs @100MHz 20 25 mA
I
DDRPD
VDDA, CKPWRGD_PD# = 0 0.6 1.0 mA 1
I
DDDIGPD
VDDDIG, CKPWRGD_PD# = 0 3.0 4.3 mA 1
I
DDAOPD
VDDO+VDDR, CKPWRGD_PD# = 0 0.9 1.3 mA 1
1
Input clock stopped.
Operating Supply Current
Powerdown Current
2-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER 8 FEBRUARY 8, 2017
9DBL0242 / 9DBL0252 DATASHEET
Electrical Characteristics–Output Duty Cycle, Jitter, Skew and PLL Characteristics
Electrical Characteristics–Filtered Phase Jitter Parameters - PCIe Common Clocked
(CC) Architectures
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
-3dB point in High BW Mode (100MHz) 2 3.3 4 MHz 1,5
-3dB point in Low BW Mode (100MHz) 1 1.5 2 MHz 1,5
PLL Jitter Peaking t
JPEAK
Peak Pass band Gain (100MHz) 0.8 2 dB 1
Duty Cycle t
D
C
Measured differentially, PLL Mode 45 50 55 % 1
Duty Cycle Distortion t
DCD
Measured differentially, Bypass Mode -1 0.0 1 % 1,3
t
p
dBYP
Bypass Mode, V
T
= 50% 2500 3406 4500 ps 1
t
p
dPLL
PLL Mode V
T
= 50% -100 8 100 ps 1,4
Skew, Output to Output t
sk3
V
T
= 50% 21 55 ps 1,4
PLL mode 15 50 ps 1,2
Additive Jitter in Bypass Mode 0.1 1 ps 1,2
1
Guaranteed by design and characterization, not 100% tested in production.
2
Measured from differential waveform
3
Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode.
4
All outputs at default slew rate
5
The MIN/TYP/MAX values of each BW setting track each other, i.e., Low BW MAX will never occur with Hi BW MIN.
Skew, Input to Output
Jitter, Cycle to cycle t
jcyc-cyc
PLL Bandwidth BW
T
AMB
= over the specified operating range. Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT
UNITS Notes
t
jp
hPCIeG1-CC
PCIe Gen 1 23 32 86 ps (p-p) 1,2,3,5
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
0.6 0.8 3
ps
(rms)
1,2,5
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
1.7
2.1 3.1
ps
(rms)
1,2,5
t
jphPCIeG3-CC
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.4
0.48 1
ps
(rms)
1,2,5
t
jphPCIeG4-CC
PCIe Gen 4
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.4
0.48 0.5
ps
(rms)
1,2,5
t
jphPCIeG1-CC
PCIe Gen 1 0.0 0.01
ps
(p-p)
1,2,5
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
0.0 0.01
ps
(rms)
1,2,4,5
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
0.0 0.01
ps
(rms)
1,2,4,5
t
jphPCIeG3-CC
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.0 0.01
ps
(rms)
1,2,4,5
t
jphPCIeG4-CC
PCIe Gen 4
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.0 0.01
ps
(rms)
1,2,4,5
1
Applies to all outputs.
5
Driven by 9FGL0841 or equivalent
3
Sample size of at least 100K cycles. This fi
g
ures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
For RMS values additive jitter is calculated by solvin
g
the followin
g
equation for b [a^2+b^2=c^
2
] where a is rms input jitter and c is rms total jitter.
Phase Jitter,
PLL Mode
t
jphPCIeG2-CC
Additive Phase Jitter,
Bypass mode
n/a
t
jphPCIeG2-CC
2
Based on PCIe Base Specification Rev4.0 version 0.7draft. See http://www.pcisi
g
.com for latest specifications.
FEBRUARY 8, 2017 9 2-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER
9DBL0242 / 9DBL0252 DATASHEET
Electrical Characteristics–Filtered Phase Jitter Parameters - PCIe Separate
Reference Independent Spread (SRIS) Architectures
5
Electrical Characteristics–Unfiltered Phase Jitter Parameters
T
AMB
= over the specified operating range. Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT
UNITS Notes
t
jphPCIeG2-
SRIS
PCIe Gen 2
(PLL BW of 16MHz , CDR = 5MHz)
1.2 1.5 2
ps
(rms)
1,2,5
t
jphPCIeG3-
SRIS
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.7
ps
(rms)
1,2,5,6
t
jphPCIeG2-
SRIS
PCIe Gen 2
(PLL BW of 16MHz , CDR = 5MHz)
0.0 0.01
ps
(rms)
1,2,4,5
t
jphPCIeG3-
SRIS
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.0
0.01
ps
(rms)
1,2,4,5
1
Guaranteed by desi
g
n and characterization, not 100% tested in production.
6
Certain customers have su
gg
ested a 0.7ps spec limit for Gen3 SRIS The device supports PCIe Gen3 SRIS in bypass mode.
Additive Phase Jitter,
Bypass mode
n/a
2
Based on PCIe Base Specification Rev3.1a. These filters are different than Common Clock filters. See http://www.pcisi
g
.com for latest specifications.
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
For RMS values, additive jitter is calculated by solving the following equation for b [a^2+b^2=c^2 ] where a is rms input jitter and c is rms total jitter.
5
As of PCIe Base Specification Rev4.0 draft 0.7, SRIS is defined as "implementation dependent", with no firm specifcations.
Phase Jitter, PLL Mode
n/a
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT UNITS Notes
t
jph156M
156.25MHz, 1.5MHz to 10MHz, -20dB/decade
rollover < 1.5MHz, -40db/decade rolloff > 10MHz
159 N/A
fs
(rms)
1,2,3
t
jph156M12k-
20
156.25MHz, 12kHz to 20MHz, -20dB/decade
rollover <12kHz, -40db/decade rolloff > 20MHz
363 N/A
fs
(rms)
1,2,3
1
Guaranteed by design and characterization, not 100% tested in production.
3
For RMS figures, additive jitter is calculated by solving the following equation: Additive jitter = SQRT[(total jitter)^2 - (input jitter)^2]
Additive Phase Jitter,
Fanout Mode
2
DRiven by Rohde&Schartz SMA100

9DBL0252BKILF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer 3.3V LP-HCSL PCIE ZDB FOB
Lifecycle:
New from this manufacturer.
Delivery:
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