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TEF6721HL/V1S,557

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48
TEF6721HL_4 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 20 December 2005 46 of 48
Philips Semiconductors
TEF6721HL
Car radio tuner front-end for digital IF
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
19. Revision history
Table 35: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
TEF6721HL_4 20051220 Product data sheet - - TEF6721HL_3
Modifications:
• Table 29: Changed the ‘Crystal oscillator’ section; the driving of two tuners with one crystal is
shown in
Figure 10.
TEF6721HL_3 20050719 Product data sheet - 9397 750 15042 TEF6721HL_2
TEF6721HL_2 20040629 Product specification - 9397 750 13472 TEF6721HL_1
TEF6721HL_1 20031021 Preliminary specification - 9397 750 11379 -
Philips Semiconductors
TEF6721HL
Car radio tuner front-end for digital IF
TEF6721HL_4 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 20 December 2005 47 of 48
20. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
21. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
22. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
23. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
I
2
C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
24. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status
[1]
Product status
[2] [3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 20 December 2005
Document number: TEF6721HL_4
Published in The Netherlands
Philips Semiconductors
TEF6721HL
Car radio tuner front-end for digital IF
25. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 7
7.1 FM in-phase/quadrature-phase mixer. . . . . . . . 7
7.2 Buffer output for weather band flag. . . . . . . . . . 7
7.3 VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.4 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7
7.5 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7.6 DAA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7.7 FM keyed AGC . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.8 AM mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.9 AM RF AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.10 FM/AM RF AGC buffer . . . . . . . . . . . . . . . . . . 10
8I
2
C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . . 10
8.1 I
2
C-bus specification. . . . . . . . . . . . . . . . . . . . 10
8.1.1 Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.1.2 Frequency setting . . . . . . . . . . . . . . . . . . . . . . 11
8.1.3 Restriction of the I
2
C-bus characteristic . . . . . 11
8.2 I
2
C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 11
8.2.1 Data transfer mode and IC address . . . . . . . . 11
8.2.2 Write mode: data byte 0 . . . . . . . . . . . . . . . . . 12
8.2.3 Write mode: data byte 1 . . . . . . . . . . . . . . . . . 12
8.2.4 Write mode: data byte 2 . . . . . . . . . . . . . . . . . 13
8.2.5 Write mode: data byte 3 . . . . . . . . . . . . . . . . . 13
8.2.6 Write mode: data byte 4 . . . . . . . . . . . . . . . . . 14
8.2.7 Write mode: data byte 5 . . . . . . . . . . . . . . . . . 15
8.2.8 Read mode: data byte 0 . . . . . . . . . . . . . . . . . 15
9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 15
10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 23
11 Thermal characteristics. . . . . . . . . . . . . . . . . . 23
12 Static characteristics. . . . . . . . . . . . . . . . . . . . 23
13 Dynamic characteristics . . . . . . . . . . . . . . . . . 25
14 Overall system parameters. . . . . . . . . . . . . . . 37
15 Application information. . . . . . . . . . . . . . . . . . 38
16 Test information. . . . . . . . . . . . . . . . . . . . . . . . 40
17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 43
18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
18.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
18.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 44
18.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 44
18.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 45
18.5 Package related soldering information. . . . . . 45
19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
20 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 47
21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
23 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
24 Contact information . . . . . . . . . . . . . . . . . . . . 47
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48

TEF6721HL/V1S,557

Mfr. #:
Buy TEF6721HL/V1S,557
Manufacturer:
NXP Semiconductors
Description:
RF RECEIVER AM/FM/WB 64LQFP
Lifecycle:
New from this manufacturer.
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