KAF16200
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4
HORIZONTAL REGISTER
Output Structure
Figure 3. Output Architecture (Left or Right)
Floating
Diffusion
HCCD
Charge
Transfer
Source
Follower
#1
Source
Follower
#2
Source
Follower
#3
RD
RG
OG
H1L
H1
H2
VDD
VSS
VOUTX
X= L or R
Note: Represents either the left or the right output. The designation is omitted in the figure.
The output consists of a floating diffusion capacitance
connected to a threestage source follower. Charge
presented to the floating diffusion (FD) is converted into a
voltage and is current amplified in order to drive offchip
loads. The resulting voltage change seen at the output is
linearly related to the amount of charge placed on the FD.
Once the signal has been sampled by the system electronics,
the reset gate (RG) is clocked to remove the signal and FD
is reset to the potential applied by reset drain (RD).
Increased signal at the floating diffusion reduces the voltage
seen at the output pin. To activate the output structures, an
offchip current source must be added to the VOUT pins of
the device. See Figure 4.
KAF16200
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5
Output Load
Figure 4. Recommended Output Structure Load Diagram
2N3904
or Equiv.
Buffered
Video
Output
Iout = 5 mA
VDD = +15 V
0.1 μF
VOUT
140 W
1 kW
Note: Component values may be revised based on operating conditions and other design considerations.
KAF16200
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6
PHYSICAL DESCRIPTION
Pin Description and Device Orientation
Figure 5. Pinout Diagram
Note: As viewed from the bottom.
Table 3. PINOUT
Pin Name Description
1 VSUB Substrate
2 H1LAST Last Horizontal Phase
3 OG Output Gate
4 RG Reset Gate
5 RD Reset Drain
6 VSS Amplifier Return
7 VOUT Video Output
8 VDD Amplifier Supply
9 H2 Horizontal Phase 2
10 H1 Horizontal Phase 1
11 VSUB Substrate
12 VSUB Substrate
13 VSUB Substrate
14 H1 Horizontal Phase 1
15 H2 Horizontal Phase 2
16 VSUB Substrate
Pin Name Description
17 VSUB Substrate
18 LODB Lateral Overflow Drain, Bottom of Die
19 V1 Vertical Phase 1
20 V1 Vertical Phase 1
21 V2 Vertical Phase 2
22 V2 Vertical Phase 2
23 LODT Lateral Overflow Drain, Top of Die
24 VSUB Substrate
25 VSUB Substrate
26 LODT Lateral Overflow Drain, Top of Die
27 V2 Vertical Phase 2
28 V2 Vertical Phase 2
29 V1 Vertical Phase 1
30 V1 Vertical Phase 1
31 LODB Lateral Overflow Drain, Bottom of Die
32 VSUB Substrate

KAF-16200-ABA-CD-B2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC CCD IMAGE SENS 16.2MP 32CDIP
Lifecycle:
New from this manufacturer.
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