7
IDT70T633/1S
High-Speed 2.5V 512/256K x 18 Asynchronous Dual-Port Static RAM Industrial and Commercial Temperature Ranges
Recommended Operating
Temperature and Supply Voltage
(1)
Recommended DC Operating
Conditions with V
DDQ at 2.5V
Absolute Maximum Ratings
(1)
NOTES:
1. V
IL (min.) = -1.0V for pulse width less than tRC/2 or 5ns, whichever is less.
2. V
IH (max.) = VDDQ + 1.0V for pulse width less than tRC/2 or 5ns, whichever is
less.
3. To select operation at 2.5V levels on the I/Os and controls of a given port, the
OPT pin for that port must be set to V
SS (0V), and VDDQX for that port must be
supplied as indicated above.
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. This is a steady-state DC parameter that applies after the power supply has
reached its nominal operating value. Power sequencing is not necessary;
however, the voltage on any Input or I/O pin cannot exceed V
DDQ during power
supply ramp up.
3. Ambient Temperature under DC Bias. No AC Conditions. Chip Deselected.
NOTE:
1. This is the parameter T
A. This is the "instant on" case temperature.
Grade
Ambient
Temperature GND V
DD
Commercial 0
O
C to +70
O
C0V2.5V
+
100mV
Industrial -40
O
C to +85
O
C0V2.5V
+
100mV
5670 tbl 04
Symbol Rating Commercial
& Industrial
Unit
V
TERM
(V
DD
)
V
DD
Te rmin al Vo l ta g e
with Respect to GND
-0.5 to 3.6 V
V
TERM
(2)
(V
DDQ
)
V
DDQ
Terminal Voltage
with Respect to GND
-0.3 to V
DDQ
+ 0.3 V
V
TE RM
(2)
(INPUTS and I/O's)
Input and I/O Te rminal
Voltage with Respect to GND
-0.3 to V
DDQ
+ 0.3 V
T
BIAS
(3)
Temperature
Under Bias
-55 to +125
o
C
T
STG
Storage
Temperature
-65 to +150
o
C
T
JN
Junction Temperature +150
o
C
I
OUT
(For V
DDQ
=
3.3V) DC Output Current 50 mA
I
OUT
(For V
DDQ
=
2.5V) DC Output Current 40 mA
5670 tbl 07
Symbol Parameter Min. Typ. Max. Unit
V
DD
Core Supply Voltage 2.4 2.5 2.6 V
V
DDQ
I/O Supply Voltage
(3)
2.4 2.5 2.6 V
V
SS
Ground 0 0 0 V
V
IH
Input High Voltage
(Address, Control &
Data I/O Inputs)
(3)
1.7
____
V
DDQ
+ 100mV
(2)
V
V
IH
Input High Voltage
_
JTAG
1.7
____
V
DD
+ 100mV
(2)
V
V
IH
Input High Voltage -
ZZ, OPT, M/S
V
DD
- 0.2V
____
V
DD
+ 100mV
(2)
V
V
IL
Input Low Voltage -0.3
(1)
____
0.7 V
V
IL
Input Low Voltage -
ZZ, OPT, M/S
-0.3
(1)
____
0.2 V
5670 tbl 05
NOTES:
1. These parameters are determined by device characterization, but are not
production tested.
2. 3dV references the interpolated capacitance when the input and output switch
from 0V to 3V or from 3V to 0V.
3. C
OUT also references CI/O.
Capacitance
(1)
(TA = +25°C, F = 1.0MHZ) TQFP ONLY
Symbol Parameter Conditions
(2)
Max. Unit
C
IN
Input Capacitance V
IN
= 3dV 8 pF
C
OUT
(3)
Output Capacitance V
OUT
= 3dV 10.5 pF
5670 tbl 08
Recommended DC Operating
Conditions with V
DDQ at 3.3V
NOTES:
1. V
IL (min.) = -1.0V for pulse width less than tRC/2 or 5ns, whichever is less.
2. V
IH (max.) = VDDQ + 1.0V for pulse width less than tRC/2 or 5ns, whichever is
less.
3. To select operation at 3.3V levels on the I/Os and controls of a given port, the
OPT pin for that port must be set to V
DD (2.5V), and VDDQX for that port must be
supplied as indicated above.
Symbol Parameter Min. Typ. Max. Unit
V
DD
Core Supply Voltage 2.4 2.5 2.6 V
V
DDQ
I/O Supply Voltage
(3)
3.15 3.3 3.45 V
V
SS
Ground 0 0 0 V
V
IH
Input Hig h Voltage
(Address, Control
&Data I/O Inputs)
(3)
2.0
____
V
DDQ
+ 150mV
(2)
V
V
IH
Input Hig h Voltage
_
JTAG
1.7
____
V
DD
+ 100mV
(2)
V
V
IH
Input High Voltage -
ZZ, OPT, M/S
V
DD
- 0.2V
____
V
DD
+ 100mV
(2)
V
V
IL
Input Low Voltage -0.3
(1)
____
0.8 V
V
IL
Input Low Voltage -
ZZ, OPT, M/S
-0.3
(1)
____
0.2 V
5670 tbl 06
IDT70T633/1S
High-Speed 2.5V 512/256K x 18 Asynchronous Dual-Port Static RAM Industrial and Commercial Temperature Ranges
8
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(VDD = 2.5V ± 100mV)
Symbol Parameter Test Conditions
70T633/1S
UnitMin. Max.
|I
LI
| Input Leakage Current
(1)
V
DDQ
= Max., V
IN
= 0V to V
DDQ
___
10 µA
|I
LI
| JTAG & ZZ Input Leakage Current
(1,2)
V
DD =
Max.
,
V
IN
= 0V to V
DD
___
+30 µA
|I
LO
| Output Leakage Current
(1,3)
CE
0
= V
IH
or CE
1
= V
IL
, V
OUT
= 0V to V
DDQ
___
10 µA
V
OL
(3.3V) Output Low Voltage
(1)
I
OL
= +4mA, V
DDQ
= Min.
___
0.4 V
V
OH
(3.3V) Output High Voltage
(1)
I
OH
= -4mA, V
DDQ
= Min. 2.4
___
V
V
OL
(2.5V) Output Low Voltage
(1)
I
OL
= +2mA, V
DDQ
= Min.
___
0.4 V
V
OH
(2.5V) Output High Voltage
(1)
I
OH
= -2mA, V
DDQ
= Min. 2.0
___
V
5670 tbl 09
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(VDD = 2.5V ± 100mV)
NOTES:
1. At f = f
MAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, using "AC TEST CONDITIONS".
2. f = 0 means no address or control lines change. Applies only to input at CMOS level standby.
3. V
DD = 2.5V, TA = 25°C for Typ. values, and are not production tested. IDD DC(f=0) = 100mA (Typ).
4. CE
X = VIL means CE0X = VIL and CE1X = VIH
CEX = VIH means CE0X = VIH or CE1X = VIL
CEX < 0.2V means CE0X < 0.2V and CE1X > VDDQX - 0.2V
CE
X > VDDQX - 0.2V means CE0X > VDDQX - 0.2V or CE1X - 0.2V
"X" represents "L" for left port or "R" for right port.
5. I
SB1, ISB2 and ISB4 will all reach full standby levels (ISB3) on the appropriate port(s) if ZZL and /or ZZR = VIH.
NOTES:
1. V
DDQ is selectable (3.3V/2.5V) via OPT pins. Refer to page 5 for details.
2. Applicable only for TMS, TDI and TRST inputs.
3. Outputs tested in tri-state mode.
70T633/1S10
Com'l
& Ind
(6)
70T633/1S12
Com'l
& Ind
70T633/1S15
Com'l Only
Symbol Parameter Test Condition Version Typ.
(4)
Max. Typ.
(4)
Max. Typ.
(4)
Max. Unit
I
DD
Dynamic Operating
Current (Both
Ports Active)
CE
L
and CE
R
= V
IL
,
Outputs Disabled
f = f
MAX
(1)
COM'L S 300 405 300 355 225 305
mA
IND S 300 445 300 395
____ ____
I
SB1
(6)
Standby Current
(Both Ports - TTL
Leve l Inputs)
CE
L
= CE
R
= V
IH
f = f
MAX
(1)
COM'L S 90 120 75 105 60 85
mA
IND S 90 145 75 130
____ ____
I
SB2
(6)
Standby Current
(One Port - TTL
Leve l Inputs)
CE
"A"
= V
IL
and CE
"B"
= V
IH
(5)
Active Port Outputs Disabled,
f = f
MAX
(1)
COM'L S 200 265 180 230 150 200
mA
IND S 200 290 180 255
____ ____
I
SB3
Full Standby Current
(Both Ports - CMOS
Leve l Inputs)
Both Ports CE
L
and
CE
R
> V
DDQ
- 0.2V,
V
IN
> V
DDQ
- 0.2V or V
IN
< 0.2V,
f = 0
(2)
COM'L S 2 10 2 10 2 10
mA
INDS220220
____ ____
I
SB4
(6)
Full Standby Current
(One Port - CMOS
Leve l Inputs)
CE
"A"
< 0.2V and
CE
"B"
> V
DDQ
- 0.2V
(5)
,
V
IN
> V
DDQ
- 0.2V or V
IN
< 0.2V,
Active Port, Outputs Disabled,
f = f
MAX
(1)
COM'L S 200 265 180 230 150 200
mA
IND S 200 290 180 255
____ ____
I
ZZ
Sleep Mode Current
(Both Ports - TTL
Leve l Inputs)
ZZ
L =
ZZ
R =
V
IH
f = f
MAX
(1)
COM'L S 2 10 2 10 2 10
mA
INDS220220
____ ____
5670 tbl 10
9
IDT70T633/1S
High-Speed 2.5V 512/256K x 18 Asynchronous Dual-Port Static RAM Industrial and Commercial Temperature Ranges
AC Test Conditions (VDDQ = 3.3V/2.5V)
Figure 1. AC Output Test load.
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
GND to 3.0V / GND to 2.5V
2ns Max.
1.5V/1.25V
1.5V/1.25V
Figure 1
5670 tbl 11
1.5V/1.25
50Ω
50Ω
5670 drw 03
10pF
(Tester)
DATA
OUT
,
Figure 3. Typical Output Derating (Lumped Capacitive Load).

70T631S12BCI

Mfr. #:
Manufacturer:
IDT
Description:
SRAM 256K X 18 STD-PWR 2.5V DUAL PORT RAM
Lifecycle:
New from this manufacturer.
Delivery:
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