LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 16 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
P2[12]/EINT2/
MCIDAT2/
I2STX_WS
51
[6]
K10
[6]
I/O P2[12] — General purpose digital input/output pin.
I EINT2
External interrupt 2 input.
O MCIDAT2Data line for SD/MMC interface. (LPC2367/68 only)
I/O I2STX_WS — Transmit Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I
2
S-bus
specification.
P2[13]/EINT3
/
MCIDAT3/
I2STX_SDA
50
[6]
J9
[6]
I/O P2[13] — General purpose digital input/output pin.
I EINT3
External interrupt 3 input.
O MCIDAT3Data line for SD/MMC interface. (LPC2367/68 only)
I/O I2STX_SDA — Transmit data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I
2
S-bus specification.
P3[0] to P3[31] I/O Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 3 pins depends upon the pin function selected via
the pin connect block. Pins 0 through 24, and 27 through 31 of this port are
not available.
P3[25]/MAT0[0]/
PWM1[2]
27
[1]
H3
[1]
I/O P3[25] — General purpose digital input/output pin.
O MAT0[0] — Match output for Timer 0, channel 0.
O PWM1[2] — Pulse Width Modulator 1, output 2.
P3[26]/MAT0[1]/
PWM1[3]
26
[1]
K1
[1]
I/O P3[26] — General purpose digital input/output pin.
O MAT0[1] — Match output for Timer 0, channel 1.
O PWM1[3] — Pulse Width Modulator 1, output 3.
P4[0] to P4[31] I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 4 pins depends upon the pin function selected via
the pin connect block. Pins 0 through 27, 30, and 31 of this port are not
available.
P4[28]/MAT2[0]/
TXD3
82
[1]
C7
[1]
I/O P4[28] — General purpose digital input/output pin.
O MAT2[0] — Match output for Timer 2, channel 0.
O TXD3 — Transmitter output for UART3.
P4[29]/MAT2[1]/
RXD3
85
[1]
E6
[1]
I/O P4[29] — General purpose digital input/output pin.
O MAT2[1] — Match output for Timer 2, channel 1.
I RXD3 — Receiver input for UART3.
DBGEN - D4
[1][8]
I DBGEN — JTAG interface control signal. Also used for boundary scanning.
Note: This pin is available in LPC2364FET100 and LPC2368FET100
devices only (TFBGA package).
TDO 1
[1][7]
A1
[1][7]
O TDO — Test Data out for JTAG interface.
TDI 2
[1][8]
C3
[1][8]
I TDITest Data in for JTAG interface.
TMS 3
[1][8]
B1
[1][8]
I TMSTest Mode Select for JTAG interface.
TRST
4
[1][8]
C2
[1][8]
I TRSTTest Reset for JTAG interface.
TCK 5
[1][7]
C1
[1][7]
I TCK — Test Clock for JTAG interface. This clock must be slower than
1
6
of
the CPU clock (CCLK) for the JTAG interface to operate
RTCK 100
[1][8]
B2
[1][8]
I/O RTCK — JTAG interface control signal.
Note: LOW on this pin while RESET
is LOW enables ETM pins (P2[9:0]) to
operate as trace port after reset.
Table 4. Pin description …continued
Symbol Pin Ball Type Description
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 17 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
[3] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4] Open-drain 5 V tolerant digital I/O pad, compatible with I
2
C-bus 400 kHz specification. This pad requires an external pull-up to provide
output functionality. When power is switched off, this pin connected to the I
2
C-bus is floating and does not disturb the I
2
C lines.
Open-drain configuration applies to all functions on this pin.
[5] Pad provides digital I/O and USB functions (LPC2364/66/68 only). It is designed in accordance with the USB specification, revision 2.0
(Full-speed and Low-speed mode only).
[6] 5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7] This pin has no built-in pull-up and no built-in pull-down resistor.
[8] This pin has a built-in pull-up resistor.
[9] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[10] Pad provides special analog functionality.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
RSTOUT 14 - O RSTOUTThis is a 3.3 V pin. LOW on this pin indicates
LPC2364/65/66/67/68 being in Reset state.
Note: This pin is available in LPC2364FBD100, LPC2365FBD100,
LPC2366FBD100, LPC2367FBD100, and LPC2368FBD100 devices only
(LQFP100 package).
RESET
17
[9]
F3
[9]
I External reset input: A LOW on this pin resets the device, causing I/O
ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1 22
[10][11]
H2
[10][11]
I Input to the oscillator circuit and internal clock generator circuits.
XTAL2 23
[10][11]
G3
[10][11]
O Output from the oscillator amplifier.
RTCX1 16
[10][12]
F2
[10][12]
I Input to the RTC oscillator circuit.
RTCX2 18
[10]
G1
[10]
O Output from the RTC oscillator circuit.
V
SS
15, 31,
41, 55,
72, 97,
83
[13]
B3, B7,
C9, F1,
G7, J6,
K3
[13]
I ground: 0 V reference.
V
SSA
11
[14]
E1
[14]
I analog ground: 0 V reference. This should nominally be the same voltage
as V
SS
, but should be isolated to minimize noise and error.
V
DD(3V3)
28, 54,
71,
96
[15]
A3, C10,
H9,
K2
[15]
I 3.3 V supply voltage: This is the power supply voltage for the I/O ports.
V
DD(DCDC)(3V3)
13, 42,
84
[16]
A7, E4,
H6
[16]
I 3.3 V DC-to-DC converter supply voltage: This is the supply voltage for
the on-chip DC-to-DC converter only.
V
DDA
10
[17]
E2
[17]
I analog 3.3 V pad supply voltage: This should be nominally the same
voltage as V
DD(3V3)
but should be isolated to minimize noise and error. This
voltage is used to power the ADC and DAC.
VREF 12
[17]
E3
[17]
I ADC reference: This should be nominally the same voltage as V
DD(3V3)
but
should be isolated to minimize noise and error. Level on this pin is used as
a reference for ADC and DAC.
VBAT 19
[17]
G2
[17]
I RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
Table 4. Pin description
…continued
Symbol Pin Ball Type Description
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 18 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[12] If the RTC is not used, these pins can be left floating.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Pad provides special analog functionality.
[16] Pad provides special analog functionality.
[17] Pad provides special analog functionality.
7. Functional description
7.1 Architectural overview
The LPC2364/65/66/67/68 microcontroller consists of an ARM7TDMI-S CPU with
emulation support, the ARM7 local bus for closely coupled, high-speed access to the
majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals,
and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2364/65/66/67/68 implements two AHB in order to allow the Ethernet block to
operate without interference caused by other system activity. The primary AHB, referred
to as AHB1, includes the VIC and GPDMA controller.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,
and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2
are the ARM7 and the Ethernet block.
AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB
ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the
AHB address space. Lower speed peripheral functions are connected to the APB. The
AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a
2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is
allocated a 16 kB address space within the APB address space.
The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers
high performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed complex
instruction set computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.

LPC2368FET100,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU 16/32 bit micro
Lifecycle:
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