ADG3308/ADG3308-1 Data Sheet
Rev. E | Page 20 of 20
A
B
C
D
E
2.56
2.50
2.44
2.06
2.00
1.94
1
23
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.50
BSC
0.650
0.590
0.530
SIDE VIEW
0.280
0.240
0.200
0.360
0.320
0.280
2.00 REF
1.50 REF
COPLANARITY
0.05
SEATING
PLANE
0.370
0.350
0.330
10-25-2012-A
Figure 44. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG3308BRUZ −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG3308BRUZ-REEL −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG3308BRUZ-REEL7 −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG3308BCPZ-REEL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
ADG3308BCPZ-REEL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
ADG3308BCBZ-1-RL7 −40°C to +85°C 20-Ball Wafer Level Chip Scale Package [WLCSP] CB-20-2
ADG3308BCBZ-1-REEL −40°C to +85°C 20-Ball Wafer Level Chip Scale Package [WLCSP] CB-20-2
1
Z = RoHS Compliant Part.
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D04865-0-3/16(E)
