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Table 1
PGOOD PIN CONDITION
DC Voltage: 0V to 0.7V No Power Good Indication
Burst Mode Operation Disabled/Forced
Continuous Current Reversal Enabled
Resistor Pull-Up to Power Good Indication
INT
VCC
(or Other DC Burst Mode, No Current Reversal
Voltage Less Than INTV
CC
) When Power is Good
Resistor to Ext Clock: No Power Good Indication
(0V to 1.5V) Burst Mode Operation Disabled
No Current Reversal
The circuit shown in Figure 7 provides a power good
output and forces continuous operation. Transistor Q1
keeps the voltage at the PGOOD pin below 0.8V thus
disabling Burst Mode operation. When the window com-
parator indicates the output voltage is not within its 7.5%
window, the base of Q1 is pulled to ground and the power
good output appearing at the collector of Q2 goes low.
and control currents. V
IN
current results in a small
(<0.1%) loss that increases with V
IN
.
2. INTV
CC
current is the sum of the MOSFET driver and
control currents. The MOSFET driver current results
from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
from INTV
CC
to ground. The resulting dQ/dt is a current
out of INTV
CC
that is typically much larger than the
control circuit current. In continuous mode, I
GATECHG
=
f(Q
T
+ Q
B
), where Q
T
and Q
B
are the gate charges of the
topside and bottom-side MOSFETs.
By powering EXTV
CC
from an output-derived source (or
other high efficiency source), the additional V
IN
current
resulting from the driver and control currents will be
scaled by a factor of (Duty Cycle)/(Efficiency). For
example, in a 15V to 1.8V application, 10mA of INTV
CC
current results in approximately 1.2mA of V
IN
current.
This reduces the midcurrent loss from 10% or more (if
the driver was powered directly from V
IN
) to only a few
percent.
3. I
2
R losses are predicted from the DC resistances of the
MOSFETs, inductor and current shunt. In continuous
mode, the average output current flows through L and
R
SENSE
, but is “chopped” between the topside main
MOSFET and the synchronous MOSFET. If the two
MOSFETs have approximately the same R
DS(ON)
, then
the resistance of one MOSFET can simply be summed
with the resistances of L and R
SENSE
to obtain I
2
R
losses. For example, if each R
DS(ON)
= 0.02, R
L
=
0.03, and R
SENSE
= 0.01, then the total resistance is
0.06. This results in losses ranging from 3% to 17%
as the output current increases from 1A to 5A for a 1.8V
output, or 4% to 20% for a 1.5V output. Efficiency
varies as the inverse square of V
OUT
for the same
external components and power level. I
2
R losses cause
the efficiency to drop at high output currents.
4. Transition losses apply only to the topside MOSFET(s),
and only become significant when operating at high
input voltages (typically 12V or greater). Transition
losses can be estimated from:
Transition Loss = (1.7) V
IN
2
I
O(MAX)
C
RSS
f
Figure 7. Forced Continuous Operation with Power Good Indication
PIN 4
PGOOD
470k
Q1
Q2
100k
1735-1 F07
INTV
CC
10k
POWER
GOOD
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can be
expressed as:
%Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc., are the individual losses as a percent-
age of input power.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of the
losses in LTC1735-1 circuits: 1) LTC1735-1 V
IN
current,
2) INTV
CC
current, 3) I
2
R losses, 4) Topside MOSFET
transition losses.
1. The V
IN
current is the DC supply current given in the
electrical characteristics which excludes MOSFET driver
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Other “hidden” losses such as copper trace and internal
battery resistances can account for an additional 5% to
10% efficiency degradation in portable systems. It is very
important to include these “system” level losses in the
design of a system. The internal battery and fuse resistance
losses can be minimized by making sure that C
IN
has
adequate charge storage and a very low ESR at the
switching frequency. A 25W supply will typically require
a minimum of 20µF to 40µF of capacitance having a
maximum of 0.01 to 0.02 of ESR. Other losses
including Schottky conduction losses during dead-time
and inductor core losses generally account for less than
2% total additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
load current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
(ESR), where ESR is the effective
series resistance of C
OUT
. I
LOAD
also begins to charge or
discharge C
OUT
generating the feedback error signal that
forces the regulator to adapt to the current change and
return V
OUT
to its steady-state value. During this recovery
time V
OUT
can be monitored for excessive overshoot or
ringing, which would indicate a stability problem.
OPTI-LOOP compensation allows the transient response
to be optimized over a wide range of output capacitance
and ESR values. The availability of the I
TH
pin not only
allows optimization of control loop behavior but also
provides a DC coupled and AC filtered closed-loop response
test point. The DC step, rise time and settling at this test
point truly reflects the closed loop response. Assuming a
predominantly second order system, phase margin and/or
damping factor can be estimated using the percentage of
overshoot seen at this pin. The bandwidth can also be
estimated by examining the rise time at the pin. The I
TH
external components shown in the Figure 1 circuit will
provide an adequate starting point for most applications.
The I
TH
series R
C
-C
C
filter sets the dominant pole-zero
loop compensation. The values can be modified slightly
(from 0.5 to 2 times their suggested values) to optimize
transient response once the final PC layout is done and the
particular output capacitor type and value have been
determined. The output capacitors need to be decided
upon because the various types and values determine the
loop feedback factor gain and phase. An output current
pulse of 20% to 100% of full load current having a rise time
of 1µs to 10µs will produce output voltage and I
TH
pin
waveforms that will give a sense of the overall loop
stability without breaking the feedback loop. The initial
output voltage step may not be within the bandwidth of the
feedback loop, so the standard second order overshoot/
DC ratio cannot be used to determine phase margin. The
gain of the loop will be increased by increasing R
C
and the
bandwidth of the loop will be increased by decreasing C
C
.
If R
C
is increased by the same factor that C
C
is decreased,
the zero frequency will be kept the same, thereby keeping
the phase shift the same in the most critical frequency
range of the feedback loop. The output voltage settling
behavior is related to the stability of the closed-loop
system and will demonstrate the actual overall supply
performance. For a detailed explanation of optimizing the
compensation components, including a review of control
loop theory, refer to Application Note 76.
Improve Transient Response and Reduce Output
Capacitance with Active Voltage Positioning
Fast load transient response, limited board space and low
cost are normal requirements of microprocessor power
supplies. Active voltage positioning improves transient
response and reduces the output capacitance required to
power a microprocessor where a typical load step can be
from 0.2A to 15A in 100ns or 15A to 0.2A in 100ns. The
voltage at the microprocessor must be held to about
±0.1V of nominal in spite of these load current steps.
Since the control loop cannot respond this fast, the output
capacitors must supply the load current until the control
loop can respond. Capacitor ESR and ESL primarily deter-
mine the amount of droop or overshoot in the output
voltage. Normally, several capacitors in parallel are re-
quired to meet microprocessor transient requirements.
Active voltage positioning is a form of deregulation. It
sets the output voltage high for light loads and low for
heavy loads. When load current suddenly increases, the
output voltage starts from a level higher than nominal so
the output voltage can droop more and stay within the
specified voltage range. When load current suddenly
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LTC1735-1
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decreases the output voltage starts at a level lower than
nominal so the output voltage can have more overshoot
and stay within the specified voltage range. Less output
capacitance is required when voltage positioning is used
because more voltage variation is allowed on the output
capacitors.
Active voltage positioning can be implemented using the
OPTI-LOOP architecture of the LTC1735-1 and two resis-
tors connected to the I
TH
pin. An input voltage offset is
introduced when the error amplifier has to drive a resistive
load. This offset voltage is limited to ±30mV at the input
of the error amplifier. The resulting change in output
voltage is the product of input offset voltage and the
feedback voltage divider ratio.
Figure 8 shows a CPU-core-voltage regulator with active
voltage positioning. Resistors R1 and R5 force the input
voltage offset that adjusts the output voltage according to
the load current level. To select values for R1 and R5, first
determine the amount of output deregulation allowed. The
actual specification for a typical microprocessor allows
the output to vary ±0.112V. The LTC1735-1 reference
accuracy is ±1%. Using 1% tolerance resistors, the total
feedback divider accuracy is about 1% because both
feedback resistors are close to the same value. The result-
ing setpoint accuracy is ±2% so the output transient
voltage cannot exceed ±0.082V. For V
OUT
= 1.5V, the
maximum output voltage change controlled by the I
TH
pin
would be:
∆=
=
±
V
Input Offset Voltage V
V
V
V
mV
OSENSE
OUT
REF
.•.
.
003 15
08
56
With optimum resistor values at the I
TH
pin, the output
voltage will swing from 1.55V at minimum load to 1.44V
at full load. At this output voltage, active voltage position-
ing provides an additional ±56mV to the allowable tran-
sient voltage on the output capacitors, a 68% improvement
over the ±82mV allowed without active voltage
positioning.
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
C
OSC
RUN/SS
I
TH
PGOOD
SENSE
SENSE
+
V
OSENSE
SGND
TG
BOOST
SW
V
IN
INTV
CC
BG
PGND
EXTV
CC
U1
LTC1735-1
C2
0.1µF
C8
0.22µF
C4
100pF
C6
47pF
C3
100pF
R2
100k
R1
27k
PGOOD
R6
0.003
GND
V
OUT
1.5V
15A
V
IN
7.5V TO
24V
GND
C5
1000pF
C1
39pF
+
C10
4.7µF
10V
C9
1µF
C11
330pF
C19
1µF
+
C15 TO
C18
180µF
4V
C7
0.1µF
Q1
FDS6680A
Q2, Q3
FDS6680A
×2
C9, C19: TAIYO YUDEN JMK107BJ105
C10: KEMET T494A475M010AS
C12 TO C14: TAIYO YUDEN GMK325F106
C15 TO C18: PANASONIC EEFUE0G181R
D1: CENTRAL SEMI CMDSH-3
D2: MOTOROLA MBRS340
L1: PANASONIC ETQP6F1R0SA
Q1 TO Q3: FAIRCHILD FDS6680A
R5: IRC LRF2512-01-R003-J
U1: LINEAR TECHNOLOGY LTC1735CS-1
1735-1 F08
D1
CMDSH-3
5V (OPTIONAL)
R7
10k
R8
11.5k
D2
MBRS340
C12 TO C14
10µF
35V
L1
1µH
R5 100k
R4 100k
R3 680k
Figure 8. CPU-Core-Voltage Regulator with Active Voltage Positioning

LTC1735CGN-1#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Hi Eff Sync Buck Sw Reg
Lifecycle:
New from this manufacturer.
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