PDF: 09005aef82d283a8/Source: 09005aef82d28271 Micron Technology, Inc., reserves the right to change products or specifications without notice.
HTS72C1Gx72.fm - Rev. A 8/07 EN
13 ©2007 Micron Technology, Inc. All rights reserved.
8GB (x72, ECC, QR) 240-Pin DDR2 SDRAM RDIMM
Serial Presence-Detect
Notes: 1. The
t
RC SPD values shown are JEDEC DDR2 device specification values. The actual Micron
DDR2 device specification is
t
RC = 55ns for all speed grades.
33
Address and command hold time,
t
IH
b
-667
-53E
-40E
27
37
47
34
Data/data mask input setup time,
t
DS
b
-667/-53E
-40E
10
15
35
Data/data mask input hold time,
t
DH
b
-667
-53E
-40E
17
22
27
36
Write recovery time,
t
WR
–3C
37
WRITE-to-READ command delay,
t
WTR
-667/-53E
-40E
1E
28
38
READ-to-PRECHARGE command delay,
t
RTP
–1E
39
Memory analysis probe
–00
40
Extension for bytes 41 and 42
–00
41
MIN active-to-active/refresh time,
t
RC
1
-667/-53E
-40E
3C
37
42
MIN AUTO REFRESH-to-ACTIVE/AUTO REFRESH command
period,
t
RFC
–C5
43
SDRAM device MAX cycle time,
t
CK (MAX)
–80
44
SDRAM device MAX DQS–DQ skew time,
t
DQSQ
-667
-53E
-40E
18
1E
23
45
SDRAM device MAX read data hold skew factor,
t
QHS
-667
-53E
-40E
22
28
2D
46
PLL relock time
–0F
47–61
Optional features, not supported
–00
62
SPD revision
Release 1.2 12
63
Checksum for bytes 0–62;
(with/without heat spreader; HTS/HTZS)
-667
-53E
-40E
22/25
CD/DO
34/37
64
Manufacturer’s JEDEC ID code
MICRON 2C
65–71
Manufacturer’s JEDEC ID code
(continued) 00
72
Manufacturing location
1–12 01–0C
73–90
Module part number (ASCII)
–Variable data
91
PCB identification code
1–9 01–09
92
PCB identification code (continued)
000
93
Year of manufacture in BCD
–Variable data
94
Week of manufacture in BCD
–Variable data
95–98
Module serial number
–Variable data
99–127
Reserved for manufacturer-specific data
–00
128–255
Reserved for customer-specific data
–FF
Table 14: Serial Presence-Detect Matrix (continued)
Byte Description Entry (Version) 8GB
