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X40015S8I-A

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
13
FN8111.0
March 28, 2005
Word Address
The word address is either supplied by the master or
obtained from an internal counter. The internal counter
is undefined on a power up condition.
Operational Notes
The device powers-up in the following state:
– The device is in the low power standby state.
– The WEL bit is set to ‘0’. In this state it is not possi-
ble to write to the device.
– SDA pin is the input mode.
– RESET/RESET
Signal is active for t
PURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
– The WEL bit must be set to allow write operations.
– The proper clock count and bit sequence is required
prior to the stop bit in order to start a nonvolatile
write cycle.
– A three step sequence is required before writing into
the Control Register to change Watchdog Timer or
Block Lock settings.
Figure 14. Sequential Read Sequence
Data
(2)
S
t
o
p
Slave
Address
Data
(n)
A
C
K
A
C
K
SDA Bus
Signals from
the Slave
Signals from
the Master
1
Data
(n-1)
A
C
K
A
C
K
(n is any integer greater than 1)
Data
(1)
X40010, X40011, X40014, X40015
14
FN8111.0
March 28, 2005
ABSOLUTE MAXIMUM RATINGS
Temperature under bias.................... -65°C to +135°C
Storage temperature ......................... -65°C to +150°C
Voltage on any pin with
respect to V
SS
...................................... -1.0V to +7V
D.C. output current...............................................5mA
Lead temperature (soldering, 10 seconds)........ 300°C
COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature Min. Max.
Commercial 0°C 70°C
Industrial –40°C +85°C
Table 2:
Version
Chip Supply Volt-
age
Monitored*
Voltages
X40010/11
-A or -B
2.7V to 5.5V 2.6V to 5V
X40010/11-C 2 7V to 5 5V 1V to 3 6V
D.C. OPERATING CHARACTERISTICS
(Over the recommended operating conditions unless otherwise specified)
Symbol Parameter Min. Typ.
(4)
Max. Unit Test Conditions
I
CC1
(1)
Active Supply Current (V
CC
) Read 1.5 mA V
IL
= V
CC
x 0.1
V
IH
= V
CC
x 0.9,
f
SCL
= 400kHz
I
CC2
(1)
Active Supply Current (V
CC
) Read 3.0 mA
I
SB1
(1)(6)
Standby Current (V
CC
) AC (WDT off) 6 10 µA V
IL
= V
CC
x 0.1
VIH =
V
CC
x 0.9
f
SCL
, f
SDA
= 400kHz
I
SB2
(2)(6)
Standby Current (V
CC
) DC (WDT on) 25 30 µA V
SDA
= V
SCL
= V
CC
Others = GND or V
CC
I
LI
Input Leakage Current (SCL) 10 µA V
IL
= GND to V
CC
I
LO
Output Leakage Current (SDA,
V2FAIL
, WDO, RESET)
10 µA V
SDA
= GND to V
CC
Device is in Standby
(2)
V
IL
(3)
Input LOW Voltage (SDA, SCL) -0.5 V
CC
x 0.3 V
V
IH
(3)
Input HIGH Voltage (SDA, SCL) V
CC
x 0.7 V
CC
+ 0.5 V
V
HYS
(6)
Schmitt Trigger Input Hysteresis
• Fixed input level
•
V
CC
related level
0.2
.05 x V
CC
V
V
V
OL
Output LOW Voltage (SDA, RE-
SET/RESET
, V2FAIL, WDO)
0.4 V I
OL
= 3.0mA (2.7-5.5V)
I
OL
= 1.8mA (2.7-3.6V)
V
OH
Output (RESET) HIGH Voltage V
CC
- 0.8
V
CC
- 0.4
VI
OH
= -1.0mA (2.7-5.5V)
I
OH
= -0.4mA (2.7-3.6V)
V
CC
Supply
V
TRIP1
(5)
V
CC
Trip Point Voltage Range 2.0 4.75 V
4.55 4.6 4.65 V X40010/11-A
4.35 4.4 4.45 V X40010/11-B
2.85 2.9 2.95 V X40010/11-C,
X40014/15-A&C
2.55 2.6 2.65 V X40014/15-B
t
RPD2
(6)
V
TRIP2
to V2FAIL 5µS
X40010, X40011, X40014, X40015
15
FN8111.0
March 28, 2005
Notes: (1) The device enters the Active state after any start, and remains active until: 9 clock cycles later if the Device Select Bits in the Slave
Address Byte are incorrect; 200ns after a stop ending a read operation; or t
WC
after a stop ending a write operation.
(2) The device goes into Standby: 200ns after any stop, except those that initiate a high voltage write cycle; t
WC
after a stop that initiates a
high voltage cycle; or 9 clock cycles after any start that is not followed by the correct Device Select Bits in the Slave Address Byte.
(3) V
IL
Min. and V
IH
Max. are for reference only and are not tested.
(4) At 25°C, V
CC
= 5V.
(5) See Ordering Information for standard programming levels. For custom programmed levels, contact factory.
(6) Based on characterization data.
EQUIVALENT INPUT CIRCUIT FOR VxMON (x = 1, 2)
CAPACITANCE
Note: (1) This parameter is not 100% tested.
Second Supply Monitor
I
V2
V2MON Current 15 µA
V
TRIP2
(5)
V2MON Trip Point Voltage Range 1.7
0.9
4.75
3.5
V
V
X40010/11
X40014/15
2.85 2.9 2.95 V X40010/11-A
2.55 2.6 2.65 V X40010/11-B
1.65 1.7 1.75 V X40010/11-C
1.25 1.3 1.35 V X40014/15-A&B
0.95 1.0 1.05 V X40014/15-C
D.C. OPERATING CHARACTERISTICS (Continued)
(Over the recommended operating conditions unless otherwise specified)
Symbol Parameter Min. Typ.
(4)
Max. Unit Test Conditions
+
–
V
REF
t
RPDX
= 5µs worst case
Output Pin
VxMON
R
C
∆V = 100mV
∆V
V
ref
Symbol Parameter Max. Unit Test Conditions
C
OUT
(1)
Output Capacitance (SDA, RESET, RESET, V2FAIL,
WDO
)
8pFV
OUT
= 0V
C
IN
(1)
Input Capacitance (SCL) 6 pF V
IN
= 0V
X40010, X40011, X40014, X40015
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

X40015S8I-A

Mfr. #:
Buy X40015S8I-A
Manufacturer:
Renesas / Intersil
Description:
IC VOLTAGE MONITOR DUAL 8-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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