Products and specifications discussed herein are subject to change by Micron without notice.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
Features
PDF: 09005aef8492173b Micron Technology, Inc., reserves the right to change products or specifications without notice.
m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
1 ©2011 Micron Technology, Inc. All rights reserved.
NOR Flash with Mobile LPDDR
133-Ball MCP
M39L0Rx0x0U3
Features
Multichip Package
One die of 128Mb or 256Mb (MUX I/O, multiple
bank, multilevel interface, burst) Flash memory
One die of 128Mb or 512Mb LPDDR
Supply voltages:
V
DDF
= V
DDQF
= 1.7–1.95V
V
PPF
= 9V for fast program
V
DDD
= V
DDQD
= 1.7–1.95V
Electronic signature:
Manufacturer code: 20h
Top device codes:
M58LR128KC = 882Eh
M58LR256KC = 881Ch
Bottom device codes:
M58LR128KD = 882Fh
M58LR256KD = 881Dh
133-ball VFBGA package
RoHS-compliant
Flash Memory
Multiplexed address/data
Synchronous/asynchronous read
Synchronous burst read mode: 66 MHz
Random access: 70ns
Synchronous burst read suspend
•Programming time
2.5µs typical word program time using buffer
enhanced factory program command
Memory organization
Multiple bank memory array: 16Mb banks
Parameter blocks (top or bottom location)
•Dual operations
Program/erase in one bank while read in others
No delay between READ and WRITE operations
Block locking
All blocks locked at power-up
Any combination of blocks can be locked with zero
latency
WP
F
for block lock-down
Absolute write protection with V
PPF
= V
SSF
•Security
64-bit unique device number
2112-bit user programmable OTP Cells
CFI (common Flash interface)
100,000 PROGRAM/ERASE cycles per block
LPDDR
Synchronous dynamic RAM
128Mb organized as 4 banks of 2 MWords, each 16
bits wide, 1K page
512Mb organized as 4 banks of 8 MWords, each 16
bits wide, 2K page
DDR
Two data transfers/clock cycle
Clock rate: 128Mb = 133 MHz (MAX)
512Mb = 166 MHz (MAX)
Synchronous burst read and write
•Automatic precharge
Byte write controlled by LDQM
D
and UDQM
D
Low-power features:
Partial array self refresh (PASR)
Automatic temperature-compensated self refresh
(ATCSR)
Driver strength (DS)
PDF: 09005aef8492173b Micron Technology, Inc., reserves the right to change products or specifications without notice.
m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
2 ©2011 Micron Technology, Inc. All rights reserved.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
General Description
General Description
This MCP combines the following two memory devices:
128Mb or 256Mb multiplexed I/Os, multiple bank, multilevel interface, burst Flash
memory (M58LRxxxKC/D)
128Mb or 512Mb LPDDR (M65KGxxxAM)
This document describes how the two memory components operate with respect to
each other. It must be read in conjunction with the M58LRxxxKCD and M65KGxxxAM
data sheets, where all specifications required to operate the Flash and LPDDR compo-
nents are fully detailed. These data sheets are available from your local Micron distrib-
utor.
The M39L0Rx0x0U3 devices are offered in a stacked 133-ball VFBGA, 8mm × 8mm
package, which is supplied with all the bits erased (set to 1).
Figure 1: Logic Diagram
Notes: 1. AFMAX is AF22 for 128Mb and is AF23 for 256Mb Flash memory.
2. A
D
MAX is A
D
11 for 128Mb and is A
D
12 for 512Mb LPDDR.
AI14205b
A
F
[MAX:16]
1
W
F
ADQ
F
[15:0]
V
DDF
M39L0Rx0x0U3
E
F
V
SSF
16
G
F
RP
F
WP
F
V
DDQF
V
PPF
L
F
K
F
WAIT
F
A
D
[MAX:0]
2
DQ
D
[15:0]
V
DDD
E
D
CAS
D
V
SSD
16
RAS
D
V
DDQD
BA
D
[1:0]
2
K
D
KE
D
W
D
V
SSQD
UDQM
D
LDQM
D
K
D
UDQS
D
LDQS
D
PDF: 09005aef8492173b Micron Technology, Inc., reserves the right to change products or specifications without notice.
m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
3 ©2011 Micron Technology, Inc. All rights reserved.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
Ball Assignments and Descriptions
Ball Assignments and Descriptions
Table 1: Signal Names
Symbol Type Description
Shared Signals
NC
Not connected internally
DU
Do not use
NOR Flash
A
F
[MAX:16] Inputs
Address inputs
E
F
Input
Chip enable
G
F
Input
Output enable
W
F
Input
Write enable
RP
F
Input
Reset
WP
F
Input
Write protect
K
F
Input
Clock
L
F
Input
Latch enable
ADQ
F
[15:0] I/O
Data I/O or address inputs, command inputs
WAIT
F
Output
Wait
V
DDF
Supply voltage
V
DDQF
Supply voltage for I/O buffers
V
PPF
Optional supply voltage for fast program and erase
V
SSF
Ground
LPDDR
A
D
[MAX:0] Inputs
address inputs
BA
D
[1:0] Inputs
Bank select inputs
K
D
, K
D
Inputs
Clock inputs
KE
D
Input
Clock enable input
E
D
Input
Chip enable input
W
D
Input
Write enable input
RAS
D
Input
Row address strobe input
CAS
D
Input
Column address strobe input
UDQM
D
Input
Upper data input mask
LDQM
D
Input
Lower data input mask
DQ
D
[15:0] I/O
Data inputs/outputs
UDQS
D
I/O
Upper data read/ write strobe I/O
LDQS
D
I/O
Lower data read/write strobe I/O
V
DDD
Supply voltage
V
DDQD
I/O supply voltage
V
SSD
Ground
V
SSQD
I/O ground

M39L0R8090U3ZE6F TR

Mfr. #:
Manufacturer:
Micron
Description:
IC FLASH RAM 256M PAR 133VFBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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