PDF: 09005aef8492173b Micron Technology, Inc., reserves the right to change products or specifications without notice.
m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
4 ©2011 Micron Technology, Inc. All rights reserved.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
Ball Assignments and Descriptions
Figure 2: 133-Ball TFBGA (Top View, Balls Down)
Notes: 1. A
F
23 is NC for the 128Mb Flash memory (the M58LR128KCD).
2. A
D
12 is NC for 128Mb LPDDR.
AI12003c
K
F
W
F
H
D
C
NC
V
DDD
B
V
DDQD
A
87654321
DQ15
NC
G
F
E
A
F
19
DU
V
SSD
A
F
17
A
F
22
LDQM
D
V
DDD
9
V
SSD
V
SSQD
M
L
K
J
RP
F
NC
A
D
3NC
V
SSF
A
D
10
V
DDQD
DQ11
DQ13 DQ10
DQ12
UDQS
D
A
D
6
UDQM
D
V
SSQD
A
F
18
A
D
9
KE
D
V
SSD
W
D
DU
V
SSQD
DQ9
V
DDQD
DQ8
V
SSD
V
DDD
V
DDD
NC
A
F
23
1
NC
V
PPF
E
F
A
F
20
NC
A
F
16
DQ14
V
DDF
WP
F
A
F
21
L
F
NC
E
D
14131110 12
ADQ10
ADQ13
ADQ2
ADQ11
V
DDQF
ADQ12
DQ0
V
DDQD
DQ2
V
SSF
ADQ4
DU
V
DDD
DU
V
SSD
V
SSF
V
SSF
V
SSF
DQ1
ADQ3
ADQ9
WAIT
F
V
SSQD
DU
ADQ5
G
F
ADQ8
ADQ1 ADQ0
ADQ7 ADQ6
ADQ15 ADQ14
NCA
D
1NC
NC
V
DDQF
P
N
V
SSD
NC
DU
BA
D
0A
D
4 A
D
7
RAS
D
K
D
V
DDD
DU
DU
V
DDD
A
D
5A
D
8
CAS
D
K
D
BA
D
1A
D
11
DUDU
V
DDF
DU
V
SSD
A
D
0
V
DDD
A
D
2A
D
12
2
NC
DQ7
DQ6 DQ4
DQ3
LDQS
D
DQ5DU
PDF: 09005aef8492173b Micron Technology, Inc., reserves the right to change products or specifications without notice.
m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
5 ©2011 Micron Technology, Inc. All rights reserved.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
Signal Descriptions
Signal Descriptions
Flash Memory Address Inputs (ADQ
F
[15:0] and A
F
[MAX:16])
The address inputs select the cells in the Flash memory array to access during bus READ
operations. During bus WRITE operations they control the commands sent to the
command interface of the Flash memory’s program/erase controller.
A
F
MAX is A
F
23 for 256Mb Flash memory and it is A
F
22 for 128Mb Flash memory.
FLash Memory Data I/Os (ADQ
F
[15:0])
The Flash memory data I/O output the data stored at the selected address during a bus
READ operation or input a command or the data to be programmed during a bus WRITE
operation.
Flash Memory Chip Enable (E
F
)
The chip enable input activates the Flash memory control logic, input buffers, decoders
and sense amplifiers. When chip enable is at V
IL
and reset is at V
IH
, the device is in active
mode. When chip enable is at V
IH
the memory is deselected, the outputs are High-Z, and
the power consumption is reduced to the standby level.
Flash Memory Output Enable (G
F
)
The output enable input controls data outputs during the bus READ operation of the
memory.
Flash Memory Write Enable (W
F
)
The write enable input controls the bus WRITE operation of the memory’s command
interface. The data and address inputs are latched on the rising edge of chip enable or
write enable, whichever occurs first.
Flash Memory RESET (RP
F
)
Reset provides a hardware reset of the memory. When reset is at V
IL
, the memory is in
reset mode, where the outputs are High-Z, and the current consumption is reduced to
the reset supply current I
DD2
. Refer to the M58LRxxxKCD data sheet for the value of I
DD2
.
After reset, all blocks are in the locked state and the configuration register is reset. When
reset is at V
IH
, the device is in normal operation. Upon exiting reset mode, the device
enters asynchronous read mode, but a negative transition of chip enable or latch enable
is required to ensure valid data outputs.
Flash Memory Write Protect (WP
F
)
Write protect is an input that provides an additional hardware protection for each block.
When write protect is at V
IL
, the lock-down is enabled and the protection status of the
locked-down blocks cannot be changed. When write protect is at V
IH
, the lock-down is
disabled and the locked-down blocks can be locked or unlocked (refer to the
M58LRxxxKCD data sheet).
Flash Memory Clock (K
F
)
The clock input synchronizes the memory to the microcontroller during synchronous
READ operations; the address is latched on a clock edge (rising or falling, according to
the configuration settings) when latch enable is at V
IL
. Clock is ignored during asynchro-
nous READ and in WRITE operations.
PDF: 09005aef8492173b Micron Technology, Inc., reserves the right to change products or specifications without notice.
m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
6 ©2011 Micron Technology, Inc. All rights reserved.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
Signal Descriptions
Flash Memory Latch Enable (L
F
)
Latch enable latches the ADQ
F
[15:0] and A
F
[MAX:16] address bits on its rising edge. The
address latch is transparent when Latch Enable is at V
IL
and it is inhibited when latch
enable is at V
IH
.
Flash Memory Wait (WAIT
F
)
Wait is an output signal used during synchronous read to indicate whether the data on
the output bus are valid. This output is High-Z when chip enable is at V
IH
or reset is at
V
IL
. It can be configured to be active during the wait cycle or one clock cycle in advance.
The WAIT
F
signal is forced de-asserted when output enable is at V
IH
.
Flash Memory V
DDF
Supply Voltage
V
DDF
provides the power supply to the internal core of the memory device. It is the main
power supply for all operations (READ, PROGRAM, and ERASE).
Flash Memory V
DDQF
Supply Voltage
V
DDQF
provides the power supply to the I/O pins and enables all outputs to be powered
independently from V
DDF
. V
DDQF
can be tied to V
DDF
or can use a separate supply.
Flash Memory V
PPF
Program Supply Voltage
V
PPF
is both a control input and a power supply pin. The two functions are selected by
the voltage range applied to the pin.
If V
PPF
is kept in a low voltage range (0 V to V
DDQF
), V
PPF
is seen as a control input. In this
case a voltage lower than V
PPLK
gives absolute protection against program or erase,
while V
PPF
in the V
PP1
range enables these functions (see the M58LRxxxKCD data sheet
for the relevant values). V
PPF
is only sampled at the beginning of a program or erase; a
change in its value after the operation has started does not have any effect and
PROGRAM or ERASE operations continue.
If V
PPF
is in the range of V
PPH
it acts as a power supply pin. In this situation V
PPF
must be
stable until the program/erase algorithm is completed.
Flash Memory V
SSF
Ground
V
SSF
ground is the reference for the core supply. It must be connected to the system
ground.
LPDDR Address Inputs (A
D
[MAX:0])
The A
D
[MAX:0] address inputs select the LPDDR row or column to be made active.
For 128Mb LPDDR:
If a row is selected, all twelve address inputs, A
D
[11:0], are used.
If a column is selected, only the nine least significant address inputs, A
D
[8:0], are
used.
For 512Mb LPDDR:
If a row is selected, all thirteen address inputs, A
D
[12:0], are used.
If a column is selected, only the ten least significant address inputs, A
D
[9:0], are used.
In this latter case, A10
D
determines whether auto precharge is used:
During a READ or WRITE operation:

M39L0R8090U3ZE6F TR

Mfr. #:
Manufacturer:
Micron
Description:
IC FLASH RAM 256M PAR 133VFBGA
Lifecycle:
New from this manufacturer.
Delivery:
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