2013 - 2015 Microchip Technology Inc. DS00001726B-page 37
USB2422
Note 5-4 Output leakage is measured with the current pins in high impedance.
Note 5-5 See USB 2.0 Specification 1. for USB DC electrical characteristics.
Note 5-6 1000 μA for commercial temperature part, and 1200 μA for industrial temperature part.
Note 5-7 800 μA for commercial temperature part, and 1000 μA for industrial temperature part.
Note 5-8 Current measured during peak USB traffic and does not reflect the average current draw.
5.2.1 PIN CAPACITANCE
O12, I/O12 & I/OSD12 Type Buffer
Low Output Level V
OL
0.4 V I
OL
= 12 mA @
VDD33 = 3.3 V
High Output Level V
OH
2.4 V I
OH
= -12 mA @
VDD33 = 3.3 V
Output Leakage I
OL
-10 +10 μA
Hysteresis (SD pad only) V
HYSC
250 350 mV V
IN
= VDD33
(Note 5-1)
Supply Current Unconfigured
Hi-Speed Host
I
CCINTHS
40 45 mA
Supply Current
Hi-Speed Host, each additional
downstream port
I
CCINTFS
35 40 mA Note 5-8
Supply Current
Hi-Speed Host, 1 downstream port
I
HCH1
47 58 mA Note 5-8
Supply Current
Hi-Speed Host, 2 downstream ports
I
HCH2
70 89
mA
Note 5-8
Supply Current
Full-Speed Host, 1 downstream port
I
FCC1
29 40 mA Note 5-8
Supply Current
Full-Speed Host, 2 downstream ports
I
FCC2
35 45 mA Note 5-8
Supply Current Suspend I
CSBY
425 Note 5-
6
μA
Supply Current Reset I
CRST
300 Note 5-
7
μA
TABLE 5-2: PIN CAPACITANCE
Limits
Parameter Symbol MIN TYP MAX Unit Test Condition
Clock Input Capacitance C
XTAL
6 pF All pins except USB pins and the pins
under the test tied to AC ground.
Input Capacitance C
IN
6 pF Capacitance T
A
= 25°C
fc = 1 MHz
VDD33 = 3.3 V
Output Capacitance C
OUT
6 pF The maximum capacitance values include
the full length of the pin pad.
TABLE 5-1: DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Parameter Symbol MIN TYP MAX Units Comments
