LTM9002
22
9002f
APPLICATIONS INFORMATION
exceed ±50mV. The internal 1000pF capacitor provides a
corner frequency of 64kHz when used with the 2.5k ex-
ternal resistor. An additional 0.1μF bypass capacitor may
be required at the SENSE pin.
The auxiliary DACs can be used without an external ref-
erence in applications that are not sensitive to close-in
phase noise such as CCD imaging or oversampling of low
amplitude signals. Without an external reference, the DAC
step size will be 366μV at the SENSE pin which results in
a 18μV step for the input span. In this case, the SENSE
pin may be bypassed with 0.1μF capacitor.
The auxiliary DACs must be subsequently set each time
the LTM9002 is powered up.
Driving the Clock Inputs
The CLK inputs can be driven directly with a CMOS or TTL
level signal. A sinusoidal clock can also be used along with a
low-jitter squaring circuit before the CLK pin (Figure 9).
The noise performance of the ADC can depend on the clock
signal quality as much as on the analog input. Any noise
present on the CLK signal will result in additional aperture
jitter that will be RMS summed with the inherent ADC
aperture jitter. In applications where jitter is critical, such
as when digitizing high input frequencies, use as large an
amplitude as possible. Also, if the ADC is clocked with a
sinusoidal signal, fi lter the CLK signal to reduce wideband
noise and distortion products generated by the source.
Figure 8. Using an External Reference
REF
BUFFER
10k
1.25V
1V (OPEN CIRCUIT,
4k THEVENIN
RESISTANCE)
10k
1000pF
2.5k
SENSE
RANGE
SELECT
REF
1.5V
REFERENCE
LTM9002
9002 F08
DAC
SDI
CS/LD
SCK
Figure 9. Sinusoidal Single-Ended CLK Driver
CLK
50Ω
0.1μF
0.1μF
4.7μF
1k
1k
FERRITE
BEAD
CLEAN
SUPPLY
SINUSOIDAL
CLOCK
INPUT
9002 F09
NC7SVU04
LTM9002
LTM9002
23
9002f
APPLICATIONS INFORMATION
Figure 10. CLK Driver Using an LVDS or PECL to CMOS Converter Figure 11. LVDS or PECL CLK Driver Using a Transformer
It is recommended that CLKA and CLKB are shorted
together and driven by the same clock source. If a small
time delay is desired between when the two channels
sample the analog inputs, CLKA and CLKB can be driven
by two different signals. If this time delay exceeds 1ns,
the performance of the part may degrade. CLKA and CLKB
should not be driven by asynchronous signals.
Figure 10 and Figure 11 show alternatives for converting
a differential clock to the single-ended CLK input. The use
of a transformer provides no incremental contribution
to phase noise. The LVDS or PECL to CMOS translators
provide little degradation below 70MHz, but at 140MHz will
degrade the SNR compared to the transformer solution.
The nature of the received signals also has a large bear-
ing on how much SNR degradation will be experienced.
For high crest factor signals such as WCDMA or OFDM,
where the nominal power level must be at least 6dB to
8dB below full-scale, the use of these translators will have
a lesser impact.
The transformer in the example may be terminated with
the appropriate termination for the signaling in use. The
use of a transformer with a 1:4 impedance ratio may
be desirable in cases where lower voltage differential
signals are considered. The center tap may be bypassed
to ground through a capacitor close to the ADC if the
differential signals originate on a different plane. The
use of a capacitor at the input may result in peaking, and
depending on transmission line length may require a 10Ω
to 20Ω series resistor to act as both a lowpass fi lter for
high frequency noise that may be induced into the clock
line by neighboring digital signals, as well as a damping
mechanism for refl ections.
Maximum and Minimum Conversion Rates
The maximum conversion rate for the LTM9002-AA is
125Msps and the LTM9002-LA is 65Msps. The lower
limit of the sample rate is determined by the droop of the
sample-and-hold circuits. The pipelined architecture of
this ADC relies on storing analog signals on small valued
capacitors. Junction leakage will discharge the capaci-
tors. The specifi ed minimum operating frequency for the
LTM9002 is 1Msps.
CLK
5pF TO
30pF
ETC1-1T
0.1μF
V
CM
FERRITE
BEAD
DIFFERENTIAL
CLOCK
INPUT
9002 F11
LTM9002
CLK
100Ω
0.1μF
4.7μF
FERRITE
BEAD
CLEAN
SUPPLY
IF LVDS USE FIN1002 OR FIN1018.
FOR PECL, USE AZ1000ELT21 OR SIMILAR
9002 F10
LTM9002
LTM9002
24
9002f
APPLICATIONS INFORMATION
Clock Duty Cycle Stabilizer
An optional clock duty cycle stabilizer circuit ensures high
performance even if the input clock has a non 50% duty
cycle. Using the clock duty cycle stabilizer is recommended
for most applications. To use the clock duty cycle stabilizer,
the MODE pin should be connected to 1/3V
DD
or 2/3V
DD
using external resistors.
This circuit uses the rising edge of the CLK pin to sample
the analog input. The falling edge of CLK is ignored and
the internal falling edge is generated by a phase-locked
loop. The input clock duty cycle can vary from 40% to
60% and the clock duty cycle stabilizer will maintain a
constant 50% internal duty cycle. If the clock is turned off
for a long period of time, the duty cycle stabilizer circuit
will require a hundred clock cycles for the PLL to lock
onto the input clock.
For applications where the sample rate needs to be changed
quickly, the clock duty cycle stabilizer can be disabled. If
the duty cycle stabilizer is disabled, care should be taken to
make the sampling clock have a 50% (±5%) duty cycle.
DIGITAL OUTPUTS
Table 6 shows the relationship between the analog input
voltage, the digital data bits, and the overfl ow bit. Note that
OF is high when an overfl ow or underfl ow has occurred
on either channel A or channel B.
Table 6. Output Codes vs Input Voltage, 100mV Input Span
IN
+
– IN
(SENSE = V
DD
)OF
D13 - D0
(OFFSET BINARY)
D13 - D0
(2’S COMPLEMENT)
≥ 50mV 1
0
0
11 1111 1111 1111
11 1111 1111 1111
11 1111 1111 1110
01 1111 1111 1111
01 1111 1111 1111
01 1111 1111 1110
0.000000V
0
0
0
0
10 0000 0000 0001
10 0000 0000 0000
01 1111 1111 1111
01 1111 1111 1110
00 0000 0000 0001
00 0000 0000 0000
11 1111 1111 1111
11 1111 1111 1110
≤ –50mV 0
0
1
00 0000 0000 0001
00 0000 0000 0000
00 0000 0000 0000
10 0000 0000 0001
10 0000 0000 0000
10 0000 0000 0000
Digital Output Modes
Figure 12 shows an equivalent circuit for a single output
buffer. Each buffer is powered by O
VDD
and OGND, isolated
from the ADC power and ground. The additional N-channel
transistor in the output driver allows operation down to
low voltages. The internal resistor in series with the output
makes the output appear as 50Ω to external circuitry and
may eliminate the need for external damping resistors.
As with all high speed/high resolution converters the digital
output loading can affect the performance. The digital
outputs of the ADC should drive a minimal capacitive load
to avoid possible interaction between the digital outputs
and sensitive input circuitry. For full-speed operation, the
capacitive load should be kept under 10pF.
Lower OV
DD
voltages will also help reduce interference
from the digital outputs.
Figure 12. Digital Output Buffer
LTM9002
9002 F12
OV
DD
V
DD
V
DD
0.1μF
43Ω
TYPICAL
DATA
OUTPUT
OGND
OV
DD
0.5V
TO 3.6V
PREDRIVER
LOGIC
DATA
FROM
LATCH
OE

LTM9002IV-LA#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 12-bit, Dual IF/Baseband Receiver Module, 65Msps, DC-25MHz LPF, 8dB/20dB gain, no trim DAC
Lifecycle:
New from this manufacturer.
Delivery:
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