MPC9351
MOTOROLA TIMING SOLUTIONS10
Figure 12. Propagation delay (t
PD
, static phase
offset) test reference
Figure 13. Propagation delay (t
PD
) test reference
Figure 14. Output Duty Cycle (DC) Figure 15. Output–to–output Skew t
SK(O)
The pin–to–pin skew is defined as the worst case difference
in propagation delay between any similar delay path within a
single device
The time from the PLL controlled edge to the non controlled
edge, divided by the time between PLL controlled edges,
expressed as a percentage
V
CC
V
CC
2
GND
V
CC
V
CC
2
GND
t
SK(O)
V
CC
V
CC
2
GND
t
P
T
0
DC = t
P
/T
0
x 100%
V
CC
V
CC
2
GND
V
CC
V
CC
2
GND
t
()
TCLK
Ext_FB
V
CC
V
CC
2
GND
t
()
PCLK
Ext_FB
PCLK
V
CMR
V
CMR
Figure 16. Cycle–to–cycle Jitter Figure 17. Period Jitter
The variation in cycle time of a signal between adjacent cycles, over a
random sample of adjacent cycle pairs
The deviation in cycle time of a signal with respect to the ideal period over
a random sample of cycles
T
N
T
JIT(CC)
= |T
N
–T
N+1
|
T
N+1
T
JIT(P)
= |T
N
–1/f
0
|
T
0
t
F
t
R
V
CC
=3.3V V
CC
=2.5V
2.4 1.8V
0.55 0.6V
Figure 18. I/O Jitter Figure 19. Transition Time Test Reference
T
JIT()
= |T
0
–T
1
mean|
TCLK
Ext_FB
The deviation in t
0
for a controlled edge with respect to a t
0
mean in a
random sample of cycles
(PCLK)
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MPC9351
TIMING SOLUTIONS 11 MOTOROLA
OUTLINE DIMENSIONS
FA SUFFIX
LQFP PACKAGE
CASE 873A-02
ISSUE A
DETAIL Y
A
S1
VB
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
DF
METAL
SECTION AE–AE
G
SEATING
PLANE
R
Q
W
K
X
0.250 (0.010)
GAUGE PLANE
E
C
H
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
MIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
B 7.000 BSC 0.276 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC 0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M 12 REF 12 REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC 0.016 BSC
Q 1 5 1 5
R 0.150 0.250 0.006 0.010
V 9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
DETAIL AD
A1
B1
V1
4X
S
4X
B1 3.500 BSC 0.138 BSC
A1 3.500 BSC 0.138 BSC
S 9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
9
–T–
–Z–
–U–
T–U0.20 (0.008) Z
AC
T–U0.20 (0.008) ZAB
0.10 (0.004) AC
–AC–
–AB–
M
8X
–T–, –U–, –Z–
T–U
M
0.20 (0.008) ZAC
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MPC9351
MOTOROLA TIMING SOLUTIONS12
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guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application
or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages.
“Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual
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MPC9351/D
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MPC9351FA

Mfr. #:
Manufacturer:
IDT
Description:
Clock Drivers & Distribution FSL1-9 LVCMOS/LVPECL LVCMOS PLL Clk Gen
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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