REVISION D 03/25/16 7 2-OUTPUT CK420BQ DERIVATIVE
9SQL4952 DATASHEET
Electrical Characteristics–DIF Low-Power HCSL Outputs
TA = T
AMB;
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Scope avera
g
in
g
on, fast settin
g
23.14
V/ns
2,3
Scope averaging, slow setting 1 2.2 3
V/ns
2,3
Crossing Voltage (abs) Vcross_abs Scope averaging off 250 376.5 550 mV 1,4,5
Crossing Voltage (var)
Δ
-Vcross Scope averaging off 13.8 140 mV 1,4,9
Avg. Clock Period Accuracy
T
PERIOD_AVG
-50 +2550
ppm
2,10,13
Absolute Period
T
PERIOD_ABS
Includes jitter and Spread Spectrum Modulation 9.847 10.203
ns
2,6
Jitter, Cycle to cycle t
j
c
y
c-c
y
c
23 50 ps 2
Voltage High V
HIGH
660 797 850 1
Voltage Low V
LOW
-150 10 150 1
Absolute Max Volta
g
e Vmax 822 1150 1,7,15
Absolute Min Voltage Vmin -300 -101 1,8,15
Duty Cycle t
DC
45 50 55 % 2
Slew rate matching
Δ
Trf 6 20
%
1,14
Skew, Output to Output t
sk3
Averaging on, V
T
= 50% 24 50 ps 2
2
Measured from differential waveform.
8
Defined as the minimum instantaneous voltage including undershoot.
15
At default SMBus amplitude settings.
mV
Slew rate Trf
mV
14
Matching applies to rising edge rate for REFCLK+ and falling edge rate for REFCLK-. It is measured using a ±75 mV window centered on
the median cross point where REFCLK+ rising meets REFCLK- falling. The median cross point is used to calculate the voltage thresholds
the oscilloscope is to use for the edge rate calculations. The Rise Edge Rate of REFCLK+ should be compared to the Fall Edge Rate of
REFCLK-; the maximum allowed difference should not exceed 20% of the slowest edge rate.
1
Measured from sin
g
le-ended waveform.
3
Measured from -150 mV to +150 mV on the differential waveform (derived from REFCLK+ minus REFCLK-). The signal must be monotonic
through the measurement region for rise and fall time. The 300 mV measurement window is centered on the differential zero crossing.
4
Measured at crossing point where the instantaneous voltage value of the rising edge of REFCLK+ equals the falling edge of REFCLK-.
5
Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points
for this measurement.
6
Defines as the absolute minimum or maximum instantaneous period. This includes cycle to cycle jitter, relative PPM tolerance, and spread
spectrum modulation.
7
Defined as the maximum instantaneous volta
g
e includin
g
overshoot.
9
Defined as the total variation of all crossing voltages of Rising REFCLK+ and Falling REFCLK-. This is the maximum allowed variance in
V
CROSS
for any particular system.
10
Refer to Section 4.3.7.1.1 of the PCI Express Base Specification, Revision 3.0 for information regarding PPM considerations.
11
System board compliance measurements must use the test load. REFCLK+ and REFCLK- are to be measured at the load capacitors CL.
Single ended probes must be used for measurements requiring single ended measurements. Either single ended probes with math or
differential probe can be used for differential measurements. Test load CL = 2 pF.
12
T
STABLE
is the time the differential clock must maintain a minimum ±150 mV differential voltage after rising/falling edges before it is allowed
to droo
p
back into the VRB ±100 mV differential ran
g
e.
13
PPM refers to parts per million and is a DC absolute period accuracy specification. 1 PPM is 1/1,000,000th of 100.000000 MHz exactly or
100 Hz. For 300 PPM, then we have an error budget of 100 Hz/PPM * 300 PPM = 30 kHz. The period is to be measured with a frequency
counter with measurement window set to 100 ms or greater. The ±300 PPM applies to systems that do not employ Spread Spectrum
Clocking, or that use common clock source. For systems employing Spread Spectrum Clocking, there is an additional 2,500 PPM nominal
shift in maximum period resulting from the 0.5% down spread resulting in a maximum average period specification of +2,800 PPM.
2-OUTPUT CK420BQ DERIVATIVE 8 REVISION D 03/25/16
9SQL4952 DATASHEET
Electrical Characteristics–Phase Jitter Parameters
Electrical Characteristics–Current Consumption
TA = T
AMB;
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
IND.
LIMIT
UNITS Notes
t
jp
hPCIeG1
PCIe Gen 1 17 30 86 ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
0.5 0.9 3
ps
(rms)
1,2
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
1.0 1.5
3.1
ps
(rms)
1,2
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.32 0.40
1
ps
(rms)
1,2
QPI & SMI
(4.8Gb/s, 6.4Gb/s 12UI, CDR=17.04M)
0.26 0.35 1
ps
(rms)
1,4
QPI & SMI
(4.8Gb/s, 6.4Gb/s 12UI, CDR=7.8M)
0.15 0.25 0.5
ps
(rms)
1,4
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.12 0.2 0.3
ps
(rms)
1,4
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.10 0.15 0.2
ps
(rms)
1,4
t
jphSAS12G
SAS 12G (only applies with SSC Off) 0.40 0.45 1.3
ps
(rms)
1,4,5
1
Guaranteed by design and characterization, not 100% tested in production.
5
Applies only when SSC is off
Phase Jitter
t
jphPCIeG2
t
jphQPI_SMI
2
See http://www.pcisig.com for complete specs
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
Calculated from Intel-supplied Clock Jitter Tool v 1.6.6
TA = T
AMB;
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
I
DDAOP
VDDA, All outputs active @100MHz 13 16 mA
I
DDOP
All VDD, except VDDA, All outputs active
@100MHz
21 30 mA
I
DDAP
D
VDDA, DIF outputs off, REF output running 0.70 1 mA 1
I
DDPD
All VDD, except VDDA,
DIF out
p
uts off, REF out
p
ut runnin
g
9.41mA1
I
DDAP
D
VDDA, all outputs off 0.72 1 mA
I
DDPD
All VDD, except VDDA, all outputs off 3.9 8 mA
1
This is the current required to have the REF output running in Wake-on-LAN mode (Byte 3, bit 5 = 1)
Powerdown Current
(Power down state and
Byte 3, bit 5 = '0')
Operating Supply Current
Wake-on-LAN Current
(Power down state and
Byte 3, bit 5 = '1')
REVISION D 03/25/16 9 2-OUTPUT CK420BQ DERIVATIVE
9SQL4952 DATASHEET
Electrical Characteristics– REF
TA = T
AMB;
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Notes
Long Accuracy ppm see Tperiod min-max values ppm 1,2
Clock period T
p
eriod
25 MHz output 40 ns 2
Output High Voltage V
IH
I
OH
= -2mA 0.8xV
DDRE
F
V
Output Low Voltage V
IL
I
OL
= 2mA 0.2xV
DDRE
F
V
Rise/Fall Slew Rate t
rf1
Byte 3 = 1F, V
OH
= VDD-0.45V, V
OL
= 0.45V 0.5 0.8 1.2 V/ns 1
Rise/Fall Slew Rate t
rf1
Byte 3 = 5F, V
OH
= VDD-0.45V, V
OL
= 0.45V 1.0 1.5 2.0 V/ns 1,3
Rise/Fall Slew Rate t
rf1
Byte 3 = 9F, V
OH
= VDD-0.45V, V
OL
= 0.45V 1.5 2.2 2.8 V/ns 1
Rise/Fall Slew Rate t
rf1
Byte 3 = DF, V
OH
= VDD-0.45V, V
OL
= 0.45V 2.2 2.9 3.5 V/ns 1
Duty Cycle d
t1X
V
T
= VDD/2 V 45 49.8 55 % 1,4
Duty Cycle Distortion d
tcd
V
T
= VDD/2 V -0.5 0.0 +0.5 % 1,5
Jitter, cycle to cycle t
j
c
y
c-c
y
c
V
T
= VDD/2 V 81 250 ps 1,4
Noise floor t
j
dBc1k
1kHz offset -120 dBc 1,4
Noise floor t
j
dBc10k
10kHz offset to Nyquist -130 dBc 1,4
Jitter, phase t
jp
hRE
F
12kHz to 5MHz, DIF SSC Off 0.3 ps (rms) 1,4
Jitter, phase t
jphREF
12kHz to 5MHz, DIF SSC On 1 ps (rms) 1,4
1
Guaranteed by design and characterization, not 100% tested in production.
3
Default SMBus Value
4
When driven by a crystal.
5
When driven by an external oscillator via the X1 pin, X2 should be floating.
2
All Lon
g
Term Accuracy and Clock Period specifications are
g
uaranteed assumin
g
that REF is trimmed to 25.00 MHz
0

9SQL4952BNLGI8

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer 2 O/P CK420BQ Lite OEM
Lifecycle:
New from this manufacturer.
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