DAC8143
–4–
REV. C
PIN CONNECTIONS
16-Lead Epoxy Plastic DIP
16-Lead SOIC
TOP VIEW
(Not to Scale)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
I
OUT1
R
FB
DAC8143
I
OUT2
V
REF
AGND
V
DD
STB
1
CLR
LD
1
DGND
SRO
STB
4
SRI
STB
3
STB
2
LD
2
ABSOLUTE MAXIMUM RATINGS
(T
A
= +25°C, unless otherwise noted.)
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V
V
REF
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V
V
RFB
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . V
DD
+ 0.3 V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . V
DD
+ 0.3 V
Digital Input Voltage Range . . . . . . . . . . . . . . . –0.3 V to V
DD
Output Voltage (Pin 1, Pin 2) . . . . . . . . . . . . . . –0.3 V to V
DD
Operating Temperature Range
FP/FS Versions . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type
JA
*
JC
Units
16-Lead Plastic DIP 76 33 °C/W
16-Lead SOIC 92 27 °C/W
*θ
JA
is specified for worst case mounting conditions, i.e., θ
JA
is specified for
device in socket for P-DIP package; θ
JA
is specified for device soldered to
printed circuit board for SOIC package.
CAUTION
1. Do not apply voltage higher than V
DD
or less than DGND po-
tential on any terminal except V
REF
(Pin 15) and R
FB
(Pin 16).
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to packaged devices.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device.
ORDERING GUIDE
Gain Temperature Package Package
Model Nonlinearity Error Range Descriptions Options
DAC8143FP ±1 LSB ±2 LSB –40°C to +85°C 16-Lead Plastic DIP N-16
DAC8143FS ±1 LSB ±2 LSB –40°C to +85°C 16-Lead SOIC R-16W
Die Size: 99 × 107 mil, 10,543 sq. mils.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8143 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
