15 of 30 May 10, 2016
IDT 89HPES10T4G2 Data Sheet
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
(and also listed below).
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 13 (and also listed below).
Thermal Considerations
This section describes thermal considerations for the PES10T4G2 (19mm
2
CABGA324 package). The data in Table 17 below contains information
that is relevant to the thermal performance of the PES10T4G2 switch.
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
J(max)
value
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
JA
) for the worst case scenario must be
maintained below the value determined by the formula:
JA
= (T
J(max)
- T
A(max)
)/P
Given that the values of T
J(max)
, T
A(max)
, and P are known, the value of desired
JA
becomes a known entity to the system designer. How to
achieve the desired
JA
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
JC
(value
provided in Table 17), thermal resistance of the chosen adhesive (
CS
), that of the heat sink (
SA
), amount of airflow, and properties of the
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
Number of active
Lanes per Port
Core Supply
PCIe Analog
Supply
PCIe Analog
High Supply
PCIe Termin-
ation Supply
I/O Supply Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
2.5V
Max
2.75V
Typ
1.0V
Max
1.1V
Typ
3.3V
Max
3.465V
Typ
Power
Max
Power
4/2/2/2
(Full swing)
mA 531 781 402 484 194 275 207 238 3 4
Watts 0.53 0.86 0.40 0.53 0.49 0.76 0.21 0.26 0.01 0.02 1.64 2.43
2/2/2/2
(Full swing)
mA 440 550 320 352 138 165 108 117 3 4
Watts 0.44 0.61 0.32 0.39 0.25 0.45 0.11 0.13 .01 .02 1.23 1.6
Table 16 PES10T4G2 Power Consumption
Symbol Parameter Value Units Conditions
T
J(max)
Junction Temperature 125
o
CMaximum
T
A(max)
Ambient Temperature 70
o
CMaximum
JA(effective)
Effective Thermal Resistance, Junction-to-Ambient
23.6
o
C/W Zero air flow
16.8
o
C/W 1 m/S air flow
15.4
o
C/W 2 m/S air flow
JB
Thermal Resistance, Junction-to-Board 14.5
o
C/W
JC
Thermal Resistance, Junction-to-Case 7.6
o
C/W
P Power Dissipation of the Device 2.43 Watts Maximum
Table 17 Thermal Specifications for PES10T4G2, 19x19 mm CABGA324 Package
