19
FN8085.8
September 12, 2008
A system to implement temperature compensation would
consist of the ISL1208, a temperature sensor, and a
microcontroller. These devices may already be in the system
so the function will just be a matter of implementing software
and performing some calculations. Fairly accurate
temperature compensation can be implemented just by
using the crystal manufacturer’s specifications for the
turnover temperature T
0
and the drift coefficient (β). The
formula for calculating the oscillator adjustment necessary is
Equation 3:
Once the temperature curve for a crystal is established, then
the designer should decide at what discrete temperatures
the compensation will change. Since drift is higher at
extreme temperatures, the compensation may not be
needed until the temperature is greater than +20°C from T
0
.
A sample curve of the ATR setting vs Frequency Adjustment
for the ISL1208 and a typical RTC crystal is given in
Figure 18. This curve may vary with different crystals, so it is
good practice to evaluate a given crystal in an ISL1208
circuit before establishing the adjustment values.
This curve is then used to figure what ATR and DTR settings
are used for compensation. The results would be placed in a
lookup table for the microcontroller to access.
Note that the ATR register affects the F
OUT
frequency
directly. Also, the DTR setting will affect the F
OUT
frequency
for all but the 32.768Khz setting, due to the clock correction
in the divider chain.
Layout Considerations
The crystal input at X1 has a very high impedance, and
oscillator circuits operating at low frequencies such as
32.768kHz are known to pick up noise very easily if layout
precautions are not followed. Most instances of erratic
clocking or large accuracy errors can be traced to the
susceptibility of the oscillator circuit to interference from
adjacent high speed clock or data lines. Careful layout of the
RTC circuit will avoid noise pickup and insure accurate
clocking.
Figure 19 shows a suggested layout for the ISL1208 device
using a surface mount crystal. Two main precautions should
be followed:
1. Do not run the serial bus lines or any high speed logic
lines in the vicinity of the crystal. These logic level lines
can induce noise in the oscillator circuit to cause
misclocking.
2. Add a ground trace around the crystal with one end
terminated at the chip ground. This will provide
termination for emitted noise in the vicinity of the RTC
device.
In addition, it is a good idea to avoid a ground plane under
the X1 and X2 pins and the crystal, as this will affect the load
capacitance and therefore the oscillator accuracy of the
circuit. If the IRQ
/FOUT pin is used as a clock, it should be
routed away from the RTC device as well. The traces for the
V
BAT
and V
CC
pins can be treated as a ground, and should
be routed around the crystal.
Battery Backup Considerations
The ISL1208 device provides a V
BAT
pin which is used for a
battery backup input. The battery voltage can vary from 1.8V
up to 5.5V, independent of the V
DD
supply voltage. An
internal switch automatically connects the VBAT supply to
the to the internal power node when V
DD
power goes away,
and switches back to V
DD
when power returns.
Since this battery switch draws power from the battery, it is
very low power and not very fast. If the V
DD
drops too
quickly to 0V, there is not enough time for the switch to
connect the V
BAT
source to the internal power node, and the
SRAM contents can be lost or corrupted. It is a good idea to
keep power-down ramps longer than 50us to insure data
retention.
Battery drain can be minimized by using the LPMODE
option. Since normally the V
BAT
and V
DD
need to be
monitored in order to switch at the lower voltage, two
comparator function are needed during battery backup.
LPMODE shuts off one of the comparators and just
compares V
DD
to V
BAT
to activate switchover. This saves
about 500nA of VBAT current at 3.0V. Do not use LPMODE
when V
BAT
V
DD
- 0.2V, to avoid permanently placing the
device in battery backup mode.
Adjustment(ppm) T T
0
()
2
=
β
(EQ. 3)
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
0 5 10 15 20 25 30 35 40 45 50 55 60
ATR SETTING
PPM ADJUSTMENT
FIGURE 18. ATR SETTING vs OSCILLATOR FREQUENCY
ADJUSTMENT
FIGURE 19. SUGGESTED LAYOUT FOR ISL1208 AND
CRYSTAL
ISL1208
20
FN8085.8
September 12, 2008
Another consideration is systems with either ground bounce
or power supply transients that cause the V
DD
pin to drop
below ground for more than a few nanoseconds. This type of
power glitch can override the V
BAT
backup and reset or
corrupt the SRAM. If these transient glitches are present in a
system with the ISL1208, or the device is experiencing
unexplained loss of data when returning from V
BAT
mode, a
protection circuit should be added. Figure 20 shows a circuit
which effectively isolates the V
DD
input from negative
glitches. The Schottky diode is needed to for low voltage
drop and effective protection from the negative transient.
Note that this circuit will also help if the V
DD
fall time is less
than 50us as CIN holds up the V
DD
pin during the transient.
There is also a shunt shown between the battery and the
V
BAT
pin. This is for quick disconnect if there is a situation
where a transient has latched the device and it will not
communicate on the I2C bus. If ground bounce is a problem,
then a second Schottky diode should be added between the
battery and the V
BAT
pin.
Super Capacitor Backup
A Super Capacitor can be used as an alternative to a battery
in cases where shorter backup times are required. Since the
battery backup supply current required by the ISL1208 is
extremely low, it is possible to get months of backup
operation using a Super Capacitor. Typical capacitor values
are a few µF to 1F or more depending on the application.
If backup is only needed for a few minutes, then a small
inexpensive electrolytic capacitor can be used. For extended
periods, a low leakage, high capacity Super Capacitor is the
best choice. These devices are available from such vendors
as Panasonic and Murata. The main specifications include
working voltage and leakage current. If the application is for
charging the capacitor from a +5V ±5% supply with a signal
diode, then the voltage on the capacitor can vary from ~4.5V
to slightly over 5.0V. A capacitor with a rated WV of 5.0V
may have a reduced lifetime if the supply voltage is slightly
high. The leakage current should be as small as possible.
For example, a Super Capacitor should be specified with
leakage of well below 1µA. A standard electrolytic capacitor
with DC leakage current in the microamps will have a
severely shortened backup time.
Below are some examples with equations to assist with
calculating backup times and required capacitance for the
ISL1208 device. The backup supply current plays a major
part in these equations, and a typical value was chosen for
example purposes. For a robust design, a margin of 30%
should be included to cover supply current and capacitance
tolerances over the results of the calculations. Even more
margin should be included if periods of very warm
temperature operation are expected.
Example 1. Calculating Backup Time Given
Voltages and Capacitor Value
In Figure 21, use C
BAT
= 0.47F and V
CC
= 5.0V. With
V
CC
= 5.0V, the voltage at V
BAT
will approach 4.7V as the
diode turns off completely. The ISL1208 is specified to
operate down to V
BAT
= 1.8V. The capacitance
charge/discharge equation (Equation 4) is used to estimate
the total backup time:
Rearranging gives:
C
BAT
is the backup capacitance and dV is the change in
voltage from fully charged to loss of operation. Note that
I
TOT
is the total of the supply current of the ISL1208 (I
BAT
)
plus the leakage current of the capacitor and the diode, I
LKG
.
In these calculations, I
LKG
is assumed to be extremely small
and will be ignored. If an application requires extended
operation at temperatures over +50°C, these leakages will
increase and hence reduce backup time.
Note that I
BAT
changes with V
BAT
almost linearly (see
Typical Performance Curves on page 7). This allows us to
make an approximation of I
BAT
, using a value midway
between the two endpoints. The typical linear equation for
I
BAT
vs V
BAT
is in Equation 6:
Using this equation to solve for the average current given 2
voltage points gives Equation 7:
FIGURE 20. POWER GLITCH PROTECTION CIRCUIT
2.7V TO 5.5V
V
DD
V
BAT
GND
+
BAT54
ISL1208
C
BAT
C
IN
BT1
3.0V
TO
3.6V
0.1µF
0.1µF
SHUNT
D
IN
FIGURE 21. SUPERCAPACITOR CHARGING CIRCUIT
2.7V TO 5.5V
V
DD
V
BAT
GND
1N4148
C
BAT
I = C
BAT
* dV/dT
(EQ. 4)
dT = C
BAT
* dV/I
TOT
to solve for backup time.
(EQ. 5)
I
BAT
= 1.031E-7*(V
BAT
) + 1.036E-7 Amps
(EQ. 6)
I
BATAVG
= 5.155E-8*(V
BAT2
+ V
BAT1
) + 1.036E-7 Amps
(EQ. 7)
ISL1208
21
FN8085.8
September 12, 2008
Combining with Equation 5 gives the equation for backup
time in Equation 8:
where:
C
BAT
= 0.47F
V
BAT2
= 4.7V
V
BAT1
= 1.8V
I
LKG
= 0 (assumed minimal)
Solving Equation 7 for this example, I
BATAVG
= 4.387E-7 A
T
BACKUP
= 0.47 * (2.9) / 4.38E-7 = 3.107E6 sec
Since there are 86,400 seconds in a day, this corresponds to
35.96 days. If the 30% tolerance is included for capacitor
and supply current tolerances, then worst case backup time
would be:
C
BAT
= 0.70 * 35.96 = 25.2 days
Example 2. Calculating a Capacitor Value for a
Given Backup Time
Referring to Figure 21 again, the capacitor value needs to be
calculated to give 2 months (60 days) of backup time, given
V
CC
= 5.0V. As in Example 1, the V
BAT
voltage will vary from
4.7V down to 1.8V. We will need to rearrange Equation 5 to
solve for capacitance in Equation 9:
Using the terms described above, this equation becomes
Equation 10:
where:
T
BACKUP
= 60 days * 86,400 sec/day = 5.18 E6 seconds
I
BATAVG
= 4.387 E-7 A (same as Example 1)
I
LKG
= 0 (assumed)
V
BAT2
= 4.7V
V
BAT1
= 1.8VSolving gives
C
BAT
= 5.18 E6 * (4.387 E-7)/(2.9) = 0.784F
If the 30% tolerance is included for tolerances, then worst
case capacitor value would be:
T
BACKUP
= C
BAT
* (V
BAT2
- V
BAT1
) / (I
BATAVG
+ I
LKG
)
(EQ. 8)
seconds
C
BAT
= dT*I/dV
(EQ. 9)
C
BAT
= T
BACKUP
* (I
BATAVG
+ I
LKG
)/(V
BAT2
– V
BAT1
)
(EQ. 10)
(EQ. 11)
C
BAT
1.3 0.784 1.02F=×=
ISL1208

ISL1208IRT8Z-TK

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Real Time Clock I2CAL TIME CLK/CLNDR 8LD 3X3
Lifecycle:
New from this manufacturer.
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