1. General description
The PX1011A/PX1012A is a high-performance, low-power, single-lane PCI Express
electrical PHYsical layer (PHY) that handles the low level PCI Express protocol and
signaling. The PX1011A/1012A PCI Express PHY is compliant to the
PCI Express Base
Specification, Rev. 1.0a
, and
Rev. 1.1
. The PX1011A/1012A includes features such as
clock and data recovery (CDR), data serialization and de-serialization, 8b/10b encoding,
analog buffers, elastic buffer and receiver detection, and provides superior performance to
the Media Access Control (MAC) layer devices.
The PX1011A/1012A is a 2.5 Gbit/s PCI Express PHY with 8-bit data PXPIPE interface.
Its PXPIPE interface is a superset of the PHY Interface for the PCI Express (PIPE)
specification, enhanced and adapted for off-chip applications with the introduction of a
source synchronous clock for transmit and receive data. The 8-bit data interface operates
at 250 MHz with SSTL_2 signaling. The SSTL_2 signaling is compatible with the I/O
interfaces available in FPGA products.
The PX1011A/1012A PCI Express PHY supports advanced power management
functions. The PX1011AI/PX1012AI is for the industrial temperature range (40 °C to
+85 °C).
2. Features
2.1 PCI Express interface
n Compliant to
PCI Express Base Specification 1.1
n Single PCI Express 2.5 Gbit/s lane
n Data and clock recovery from serial stream
n Serializer and De-serializer (SerDes)
n Receiver detection
n 8b/10b coding and decoding, elastic buffer and word alignment
n Supports loopback
n Supports direct disparity control for use in transmitting compliance pattern
n Supports lane polarity inversion
n Low jitter and Bit Error Rate (BER)
2.2 PHY/MAC interface
n Based on Intel PHY Interface for PCI Express architecture v1.0 (PIPE)
n Adapted for off-chip with additional synchronous clock signals (PXPIPE)
n 8-bit parallel data interface for transmit and receive at 250 MHz
n 2.5 V SSTL_2 class I signaling
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
Rev. 02 — 18 May 2006 Product data sheet
PX1011A_PX1012A_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 18 May 2006 2 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
2.3 JTAG interface
n JTAG (IEEE 1149.1) boundary scan interface
n Built-In Self Test (BIST) controller tests SerDes and I/O blocks at speed
n 3.3 V CMOS signaling
2.4 Power management
n Dissipates < 300 mW in L0 normal mode
n Support power management of L0, L0s and L1
2.5 Clock
n 100 MHz external reference clock with ±300 ppm tolerance
n Supports spread spectrum clock to reduce EMI
n On-chip reference clock termination
2.6 Miscellaneous
n LFBGA81 lead or lead free package
n Operating ambient temperature
u Commercial: 0 °C to +70 °C
u Industrial: 40 °C to +85 °C
n ESD protection voltage for Human Body Model (HBM): 2000 V
3. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
DDD1
digital supply voltage 1 for JTAG I/O 3.0 3.3 3.6 V
V
DDD2
digital supply voltage 2 for SSTL_2 I/O 2.3 2.5 2.7 V
V
DDD3
digital supply voltage 3 for core 1.2 1.25 1.3 V
V
DD
supply voltage for high-speed
serial I/O and PVT
1.15 1.2 1.25 V
V
DDA1
analog supply voltage 1 for serializer 1.2 1.25 1.3 V
V
DDA2
analog supply voltage 2 for serializer 3.0 3.3 3.6 V
f
clk(ref)
reference clock frequency 99.97 100 100.03 MHz
T
amb
ambient temperature operating
commercial 0 - +70 °C
industrial 40 - +85 °C
PX1011A_PX1012A_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 18 May 2006 3 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
4. Ordering information
5. Marking
[1] Industrial temperature range.
Table 2. Ordering information
Type number Solder process Package
Name Description Version
PX1011A-EL1 SnPb solder ball
compound
LFBGA81 plastic low profile fine-pitch ball grid array package;
81 balls; body 9 × 9 × 1.05 mm
SOT643-1
PX1011A-EL1/G Pb-free (SnAgCu
solder ball compound)
LFBGA81 plastic low profile fine-pitch ball grid array package;
81 balls; body 9 × 9 × 1.05 mm
SOT643-1
PX1011AI-EL1/G Pb-free (SnAgCu
solder ball compound)
LFBGA81 plastic low profile fine-pitch ball grid array package;
81 balls; body 9 × 9 × 1.05 mm
SOT643-1
PX1012A-EL1/G Pb-free (SnAgCu
solder ball compound)
LFBGA81 plastic low profile fine-pitch ball grid array package;
81 balls; body 9 × 9 × 1.05 mm
SOT643-1
PX1012AI-EL1/G Pb-free (SnAgCu
solder ball compound)
LFBGA81 plastic low profile fine-pitch ball grid array package;
81 balls; body 9 × 9 × 1.05 mm
SOT643-1
Table 3. Leaded package marking
Line Marking Description
A PX1011A-EL1 full basic type number
B xxxxxxx diffusion lot number
C 2PNyyww manufacturing code:
2 = diffusion site
P = assembly site
N = leaded
yy = year code
ww = week code
Table 4. Lead-free package marking
Line Marking Description
A PX1011A-EL1/G
PX1012A-EL1/G
PX1011AI-EL1/G
[1]
PX1012AI-EL1/G
[1]
full basic type number
B xxxxxxx diffusion lot number
C 2PGyyww manufacturing code:
2 = diffusion site
P = assembly site
G = lead-free
yy = year code
ww = week code

PX1011A-EL1/G,557

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC PCI-EXPRESS X1 PHY 81-LFBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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