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PX1011A-EL1/G,557

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
PX1011A_PX1012A_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 18 May 2006 28 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
16. Revision history
Table 24. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PX1011A_PX1012A_2 20060518 Product data sheet - PX1011A-EL1_1
Modifications:
• changed data sheet status from “Preliminary data sheet” to “Product data sheet”
• Added basic part type PX1012A-EL1
• letter symbols and parameter descriptions modified to harmonize with Philips
Semiconductors new presentation and information standard
• Section 1 “General description”:
– added “single-lane” to first sentence
– added new second sentence
– third sentence: added ‘clock and data recovery (CDR)’
– 3rd paragraph: added second sentence.
• Section 2.1 “PCI Express interface”:
– first bullet: changed “Specification 1.0a” to “Specification 1.1”
– split (old) 4th bullet
– added (new) 7th and 8th bullets
• Section 2.2 “PHY/MAC interface”:
– deleted (old) 3rd and 4th bullets
– (new) 4th bullet changed from “SSTL_2 signaling” to “2.5 V SSTL_2 class I signaling
• Section 2.5 “Clock”, 1st bullet: added “with ±300 ppm tolerance”
• Added Section 2.6 “Miscellaneous”
• Table 1 “Quick reference data”:
– Parameter description for V
DDD1
modified (added “JTAG”)
– Min and Max values for V
DD4
added; deleted Table note [1]; changed symbol to “V
DD
”
– added condition “operating” for T
amb
– added industrial temperature range
• Table 2 “Ordering information”: added Type numbers PX1011A-EL1/G, PX1012A-EL1,
PX1012A-EL1/G; added industrial temperature range Type numbers PX1011AI-EL1 and
PX1012AI-EL1; added column “Soldering compound”
• Figure 1 “Block diagram” modified: changed “PX1011A-EL1” to “PCI Express PHY”
• Table 3:
– title changed from “Marking” to “Leaded package marking”
– Line C marking changed from “2Pyyww” to “2PNyyww” (N = leaded)
• Added (new) Table 4 “Lead-free package marking”
• Figure 2 “Pin configuration” modified (added new type numbers)
• changed (old) Table 5 “Pin allocation table” to Figure 3 “Ball mapping” for reader clarity;
changed the following pin names:
– from “V
DD1
” to “V
DDD1
”
– from “V
DD2
” to “V
DDD2
”
– from “V
DD3
” to “V
DDD3
”
– from “V
DD4
” to “V
DD
”
• Table 5 “PCI Express serial data lines”: added “with 50 Ω on-chip termination” to
descriptions; added Type and Signaling columns
• Table 6 through Table 9: modified titles and added Type and Signaling columns
PX1011A_PX1012A_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 18 May 2006 29 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
PX1011A_PX1012A_2 20060518 Product data sheet - PX1011A-EL1_1
Modifications: (continued)
• Table 8 “PXPIPE interface command signals”: modified descriptions for pins
RXDET_LOOPB, TXIDLE, TXCOMP, and RXPOL
• Table 9 “PXPIPE interface status signals”: modified all descriptions
• Table 10 “Clock and reference signals”: modified all descriptions
• Table 11: title changed (added “3.3 V”); added Type and Signaling columns
• Table 12 “PCI Express PHY power supplies”: added Type and Signaling columns;
descriptions modified
• Section 8 “Functional description”:
– 1st paragraph re-written
– (old) 2nd, 4th, 5th and 6th paragraphs deleted
– (new) 2nd paragraph modified from “The PX1011A-EL1 interface between the MAC and
PHY ...” to “The PXPIPE interface between the MAC and PX1011A/1012A ...”
– (new) 3rd paragraph added
– removed “(×1 configuration)” from last paragraph
• Section 8.1 “Receiving data”:
– 1st paragraph, 2nd sentence: deleted phrase “before they go into the SerDes”
– 2nd paragraph: changed “valid data stream” to “valid stream of data”
• Section 8.2 “Transmitting data”:
– 1st paragraph: 3rd sentence re-written
– 2nd paragraph: last sentence re-written
– 3rd paragraph rewritten
– deleted (old) 4th, 5th, and 6th paragraphs
• Section 8.3 “Clocking”: re-written
• Figure 4 “Reset” modified
• Section 8.5 “Power management”:
– 1st paragraph, 1st sentence: changed “minimize power consumption” to “manage power
consumption”
– 3rd paragraph: added (new) last sentence.
–
Table 13 replaced in its entirety
• Section 8.6 “Receiver detect”:
– 1st paragraph, 1st sentence: changed “is not actively transmitting” to “is in the P1 state”
– 1st paragraph: 3rd and 4th sentences re-written.
–
Figure 5 “Receiver detect - receiver present” modified
• Section 8.7 “Loopback” moved forward
– first sentence re-written
– 3rd and 4th bullets, and 3rd paragraph: changed “parallel interface” to “PXPIPE
interface”
–
Figure 6 “Loopback start” modified
– 7th paragraph deleted
• added new Section 8.8 “Electrical idle”
• Section 8.9 “Clock tolerance compensation”:
– 1st paragraph, 5th sentence: changed “using the RXSTATUS2 to RXSTATUS0 signals”
to “using the RXSTATUS signals”
– added 3rd paragraph and
Figure 10 “Clock correction - remove a SKP”
Table 24. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes
PX1011A_PX1012A_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 18 May 2006 30 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
PX1011A_PX1012A_2 20060518 Product data sheet - PX1011A-EL1_1
Modifications: (continued)
• Section 8.10 “Error detection”:
– 1st paragraph, 2nd sentence: changed “signals (RXSTATIS2 to RXSTATUS0).” to
“signals RXSTATUS.”
– 2nd paragraph: changed from “... at the point in the data stream across the parallel
interface closest ... ” to “... at the point closest ... “
• Section 8.10.1 “8b/10b decode errors”, 1st paragraph, 1st sentence: changed “EDB
symbol” to “EDB (EnD Bad) symbol”
• Section 8.11 “Polarity inversion”, 2nd sentence: changed “... 20 symbols of when RXPOL is
asserted.” to “... 20 symbols after RXPOL is asserted.”
• Section 8.13 “JTAG boundary scan interface”: deleted sentence 2 of 3rd paragraph; added
(new) 1st sentence of 4th paragraph and deleted (old) 2nd sentence; in last sentence,
changed “recommended to tie” to “recommended to pull down”
• Table 16 “Limiting values”:
– parameter description for V
DDD2
modified (appended “I/O”)
– symbol and parameter description for V
DD4
changed from “V
DD4
, supply voltage for
serial I/O” to “V
DD
, supply voltage”; moved “for high-speed serial I/O and PVT” to
Conditions column
– changed T
j(max)
from “+150 °C” to “+125 °C”
– added commercial and industrial ratings for T
amb
• Table 18 “PCI Express PHY characteristics”:
– under subsection “Supplies”, added Min and Max values for V
DDD2
, I
DDD1
, I
DDD2
, I
DDD3
,
I
DD
,I
DDA1
,I
DDA2
; added condition “no load” to I
DDD2
; changed typical value for I
DDD1
from
2 mA to 1 mA; changed typical value for I
DDD2
from 70 mA to 18 mA; changed maximum
value for I
DDA2
from 13 mA to 15 mA
– removed subsection “General”
– “Receiver” and “Transmitter” sections re-written
– deleted Table note [1]
• Table 19 “PXPIPE characteristics”: added characteristics f
RXCLK
, f
TXCLK
, V
VREFS
,
V
OH(SSTL2)
, V
OL(SSTL2)
, V
IH(SSTL2)
, and V
IL(SSTL2)
PX1011A-EL1_1
(9397 750 14914)
20050519 Preliminary data sheet - -
Table 24. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32

PX1011A-EL1/G,557

Mfr. #:
Buy PX1011A-EL1/G,557
Manufacturer:
NXP Semiconductors
Description:
IC PCI-EXPRESS X1 PHY 81-LFBGA
Lifecycle:
New from this manufacturer.
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