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SL2S2602FUDZ
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P55
NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
Rev. 4.1 — 25 July 2017
COMPANY PUBLIC
276341
43 / 55
12
Marking
12.1
Marking SOT1122
Table 85. Marking SOT1122
Type number
Marking code
SL2S2602FTB
26
NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
Rev. 4.1 — 25 July 2017
COMPANY PUBLIC
276341
44 / 55
13
Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1122
MO-252
sot1122_po
Unit
mm
max
nom
min
0.50
0.04
0.55
0
.425
0.30
0.25
0.22
0.35
0.30
0.27
A
(1)
Dimensions
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
SOT1122
A
1
D
1.50
1.45
1.40
1.05
1.00
0.95
E
e
e
1
0.55
0.50
0.47
0.45
0.40
0.37
b
b
1
L
L
1
09-10-09
XSON3: plastic extremely thin small outl
ine p
ackage; no leads; 3 terminals; body 1 x 1.45 x 0
.5 mm
D
E
e
1
e
A
1
b
1
L
1
L
e
1
0
1
2 mm
scale
3
1
2
b
4×
(2)
4×
(2)
A
pin 1 indication
type code
terminal 1
index area
Figure 6. Package outline SOT1122
NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
Rev. 4.1 — 25 July 2017
COMPANY PUBLIC
276341
45 / 55
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT500-4
- - -
- - -
- - -
sot500-4_po
11-02-18
Unit
mm
max
nom
min
0.26
35.05
35.00
34.95
A
(1)
Dimensions
Note
1. Total package thickness, exclusive punching burr.
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-4
D
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
0
10
20 mm
scale
X
D
detail X
A
Figure 7. Package outline SOT500-4
For more details on the contactless MOA8 module see
Ref. 9
.
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P55
SL2S2602FUDZ
Mfr. #:
Buy SL2S2602FUDZ
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders ICODE SLIX2
Lifecycle:
New from this manufacturer.
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SL2S2602FUDZ