NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 4.1 — 25 July 2017
COMPANY PUBLIC 276341 46 / 55
14 Bare die outline
(1) X-scribe line width: 15 μm
(2) Y-scribe line width: 15 μm
(3) Chip step, X-length: 555 μm
(4) Chip step, Y-length: 558 μm
(5) Bump to bump distance X (LA - LB): 430 μm
(6) Bump to bump distance Y (LB - TEST): 371.5 μm
(7) Distance GND bump to nitride edge X: 45 μm
(8) Distance GND bump to nitride edge Y: 45 μm
(9) Distance LA bump to nitride edge X: 55 μm
(10) Bump to bump distance X (GND - TEST): 450 μm
Bump size LA and LB (X × Y): 80 μm × 80 μm
Bump size TEST and GND (X × Y): 60 μm × 60 μm
Figure 8. Wafer SL2S2602FUD/BG bare die layout
NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 4.1 — 25 July 2017
COMPANY PUBLIC 276341 47 / 55
15 Abbreviations
Table 86. Abbreviations
Acronym Description
AFI Application Family Identifier
CRC Cyclic Redundancy Check
DSFID Data Storage Format Identifier
EAS Electronic Article Surveillance
EEPROM Electrically Erasable Programmable Read Only Memory
EOF End Of Frame
IC Integrated Circuit
LCR Inductance, Capacitance, Resistance
LSB Least Significant Byte/Bit
MSB Most Significant Byte/Bit
RF Radio Frequency
SOF Start Of Frame
UID Unique IDentifier
NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 4.1 — 25 July 2017
COMPANY PUBLIC 276341 48 / 55
16 References
[1]
ISO Standard
ISO/IEC 15693 - Identification cards - Contactless integrated circuit cards - Vicinity cards.
[2]
ISO Standard
ISO/IEC 15693-2 -Identification cards - Contactless integrated circuit cards - Vicinity
cards - Part 2: Air interface and initialization.
[3]
ISO Standard
ISO/IEC 15693-3 -Identification cards - Contactless integrated circuit cards - Vicinity
cards - Part 3: Anticollision and transmission protocol.
[4]
ISO Standard
ISO/IEC 18000-3 - Information technology - Radio frequency identification for item
management - Part 3: Parameters for air interface communications at 13.56 MHz.
[5]
ISO Standard
ISO/IEC 7816-6 - Identification cards - Integrated circuit cards - Part 6: Interindustry data
elements for interchange.
[6]
General specification for 8" wafer on UV-tape with electronic fail die marking
Delivery type description – BU-ID document number: 1093**
1
.
[7]
Certicom Research. SEC 2
Recommended Elliptic Curve Domain Parameters, version 2.0, January 2010.
[8]
Application Note
AN3660 - ICODE SLIX2 Recommended operating conditions when using 100% ASK.
[9]
Contactless smart card module specification MOA8
Delivery Type Description, BU-ID Document number 1636**1.
1 ** ... document version number

SL2S2602FUDZ

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders ICODE SLIX2
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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