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PCA24S08D,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25
PCA24S08_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 11 May 2010 16 of 25
NXP Semiconductors
PCA24S08
1024 × 8-bit CMOS EEPROM with access protection
10. EEPROM memory
Table 9. EEPROM memory specifications
Parameter Specification
data retention at operating temperature 10 years (minimum)
endurance per byte 100,000 cycles (minimum)
PCA24S08_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 11 May 2010 17 of 25
NXP Semiconductors
PCA24S08
1024 × 8-bit CMOS EEPROM with access protection
11. Package outline
Fig 13. Package outline SOT96-1 (SO8)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.028
0.024
0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96
-1
99-12-27
03-02-18
PCA24S08_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 11 May 2010 18 of 25
NXP Semiconductors
PCA24S08
1024 × 8-bit CMOS EEPROM with access protection
Fig 14. Package outline SOT505-1 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.70
0.35
6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1
99-04-09
03-02-18
w M
b
p
D
Z
e
0.25
14
8
5
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
T
SSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505
-1
1.1
pin 1 index
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PCA24S08D,118

Mfr. #:
Buy PCA24S08D,118
Manufacturer:
NXP Semiconductors
Description:
IC EEPROM 8K I2C 400KHZ 8SO
Lifecycle:
New from this manufacturer.
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