73S8009C-32IMR/F Datasheet 73S8009C-32IMR/F, 73S8009C-32IM/F | P13-P15

DS_8009C_025 73S8009C Data Sheet

Rev. 1.5 13

Symbol Parameter Condition Min Nom Max Unit

Interface Requirements – Data Signals: I/O, AUX1, AUX2, and host interfaces: I/OUC, AUX1UC,

AUX2UC, DP, DM. I

SHORTL

, I

SHORTH

, and V

INACT

requirements do not pertain to I/OUC, AUX1UC, AUX2UC

V

OH

Output level, high (I/O,

AUX1, AUX2)

I

OH

=0 0.9 * V

CC

–

V

CC

+0.1 V

V

OH

Output level, high (I/OUC,

AUX1UC, AUX2UC)

I

OH

= -40 µA

0.75 V

CC

–

V

CC

+0.1 V

I

OH

=0 0.9 V

DD

–

V

DD

+0.1 V

V

OL

Output level, low (I/O,

AUX1, AUX2)

I

OH

= -40 µA

0.75 V

DD

–

V

DD

+0.1 V

I

OL

=1 mA

–

0.15 *V

CC

V

OL

Output level, low (I/OUC,

AUX1UC, AUX2UC)

I

OL

=1 mA

–

0.3 V

V

IH

Input level, high (I/O,

AUX1, AUX2)

0.6 * V

CC

–

V

CC

+0.30 V

V

IH

Input level, high (I/OUC,

AUX1UC, AUX2UC)

0.6 * V

DD

–

V

DD

+0.30 V

V

IL

Input level, low (I/O,

AUX1, AUX2)

-0.15

–

0.2 * V

CC

V

IL

Input level, low (I/OUC,

AUX1UC, AUX2UC)

-0.15

–

0.2 * V

DD

V

INACT

Output voltage when

outside of session

I

OL

= 0

–

0.1 V

I

OL

= 1 mA

–

0.3 V

I

LEAK

Input leakage

V

IH

= V

CC

–

10

µA

I

IL

Input current, low (I/O,

AUX1, AUX2)

V

IL

= 0

–

0.65 mA

I

IL

Input current, low (I/OUC,

AUX1UC, AUX2UC)

V

IL

= 0

–

0.7 mA

I

SHORTL

Short circuit output

current

For output low, shorted to

V

CC

through 33 Ω

–

15 mA

I

SHORTH

Short circuit output

current

For output high, shorted to

ground through 33 Ω

–

15 mA

t

R

, t

F

Output rise time, fall

times

For I/O, AUX1, AUX2,

C

L

= 80pF, 10% to 90%.

For I/OUC, AUX1UC,

AUX2UC, CL=50Pf, 10%

to 90%.

–

100 ns

t

IR

, t

IF

Input rise, fall times

–

1

µs

R

PU

Internal pull-up resistor Output stable for >200ns 8 11 14

kΩ

FD

MAX

Maximum data rate – – 1

MHz

T

FDIO

Delay, I/O to I/OUC, AUX1

to AUX1UC, AUX2 to

AUX2UC,I/OUC to I/O,

AUX1UC to AUX1, AUX2UC

to AUX2 (respectively falling

edge to falling edge and

rising edge to rising edge)

Edge from master to

slave, measured at 50%

60 100 200 ns

T

RDIO

– 15 – ns

C

IN

Input capacitance

–

10 pF

73S8009C Data Sheet DS_8009C_025

14 Rev. 1.5

Symbol

Parameter

Condition

Min

Nom

Max

Unit

Reset and Clock for card interface, RST, CLK

V

OH

Output level, high

I

OH

=-200 µA

0.9 * V

CC

–

V

CC

V

OL

Output level, low

I

OL

=200 µA

0

–

0.15

*V

CC

V

INACT

Output voltage when

outside of session

I

OL

= 0

–

0.1 V

I

RST_LIM

Output current limit, RST

–

30 mA

I

CLK_LIM

Output current limit, CLK

–

70 mA

t

R

, t

F

Output rise time, fall time C

L

= 35pF for CLK, 10% to

90%

–

12 ns

C

L

= 200pF for RST, 10% to

90%

–

100 ns

δ

Duty cycle for CLK

C

L

=35pF, F

CLK

≤ 20 MHz,

CLKIN duty cycle is 48% to

52%.

45

–

55

%

2.4 Digital Signals Characteristics

Table 5 lists the 73S8009C digital signals characteristics.

Table 5: Digital Signals Characteristics

Symbol

Parameter

Condition

Min

Nom

Max

Unit

Digital I/O

(except for I/OUC, AUX1UC, AUX2UC; see

Smart Card Interface Requirements

for those specifications)

V

IL

Input Low Voltage -0.3

–

0.8 V

VIL

OFFACK

Input low voltage for

OFF_ACK pin

OFF_REQ pin = VDD -0.3

–

0.7 V

V

IH

Input High Voltage 1.8

–

V

DD

+ 0.3 V

V

OL

Output Low Voltage I

OL

= 2 mA

–

0.45 V

V

OH

Output High Voltage I

OH

= -1 mA V

DD

- 0.45

–

V

R

OUT

Pull-up resistor;

OFF,

RDY

14

20

26

kΩ

R

ACK

Resistor between

OFF_REQ and 0FF_ACK

70 100 130

kΩ

|I

IL1

| Input Leakage Current GND < V

IN

< V

DD

–

5 μA

t

SL

Time from CS goes high to

interface active

50

–

ns

t

DZ

Time from CS goes low to

interface inactive, Hi-Z

50

–

ns

t

IS

Set-up time, control

signals to CS rising edge

50

–

ns

t

SI

Hold time, control signals

from CS rising edge

–

50

ns

t

ID

Set-up time, control

signals to CS fall

50

–

ns

t

DI

Hold time, control signals

from CS fall

–

50 ns

DS_8009C_025 73S8009C Data Sheet

Rev. 1.5 15

2.5 DC Characteristics

Table 6 lists the DC characteristics.

Table 6: DC Characteristics

Symbol

Parameter

Condition

Min

Nom

Max

Unit

V

DD

V

DD

Supply Voltage 2.7v < VPC < 6.5v, I

VDDEXT

<

40 mA.

3.0 3.3 3.6 V

I

DDEXT

V

DD

Current to External

Load

– – 40 mA

I

VPC

Supply Current

Vpc = 2.7V, V

CC

off, I

DD

= 0

–

1.7

–

mA

Vpc = 3.3V, V

CC

off, I

DD

= 0

–

1.1

–

mA

Vpc = 5.0V, V

CC

off, I

DD

= 0 – 0.7 – mA

OFF mode – 0.01 1 µA

VBUS

ON

VBUS detection

threshold

V

DD

=3.3 V 3.5 3.9 4.3 V

VBUS

IDIS

VBUS discharge

current

0.5 1.0 3 mA

VBUS

STBY

VBUS standby current

370 500

µA

2.6 Voltage / Temperature Fault Detection Circuits

Table 7 lists the voltage / temperature fault detection circuits.

Table 7: Voltage / Temperature Fault Detection Circuits

Symbol

Parameter

Condition

Min

Nom

Max

Unit

IV

Pmax

V

P

over-current fault

–

150 mA

I

CCF

Card overcurrent fault 80

–

150 mA

I

CCF1P8

Card overcurrent fault V

CC

= 1.8 V 60

–

130 mA

2.7 Thermal Characteristics

Table 8 lists the thermal characteristics.

Table 8: Thermal Characteristics

Symbol

Parameter

Condition

Min

Nom

Max

Unit

Tj Junction temperature

–

– 125

°C

θ ja

Thermal Resistance,

Junction-to-Ambient

–

70

–

°C/W

θ jc

Thermal Resistance,

Junction-to-case

–

6

–

°C/W

73S8009C-32IMR/F

73S8009C-32IMR/F

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