CY14V256LA
Document Number: 001-76295 Rev. *D Page 19 of 22
Package Diagrams
Figure 13. 48-ball FBGA (6 × 10 × 1.2 mm) BA48B Package Outline, 51-85128
51-85128 *G
CY14V256LA
Document Number: 001-76295 Rev. *D Page 20 of 22
Acronyms Document Conventions
Units of Measure
Acronym Description
CE
chip enable
CMOS complementary metal oxide semiconductor
EIA electronic industries alliance
FBGA fine-pitch ball grid array
HSB
hardware store busy
I/O input/output
nvSRAM nonvolatile static random access memory
OE
output enable
SRAM static random access memory
RoHS restriction of hazardous substances
RWI Read and write inhibited
WE
write enable
Symbol Unit of Measure
°C degree Celsius
k kilohm
MHz megahertz
A microampere
F microfarad
s microsecond
mA milliampere
mm millimeter
ms millisecond
ns nanosecond
ohm
% percent
pF picofarad
V volt
W watt
CY14V256LA
Document Number: 001-76295 Rev. *D Page 21 of 22
Document History Page
Document Title: CY14V256LA, 256-Kbit (32 K × 8) nvSRAM
Document Number: 001-76295
Rev. ECN No.
Orig. of
Change
Submission
Date
Description of Change
** 3536107 GVCH 03/06/2012 New data sheet.
*A 3701497 GVCH 08/02/2012 Changed status from Summary to Final.
Updated DC Electrical Characteristics (Added V
VCAP
parameter and its details,
added Note 7 and referred the same note in V
VCAP
parameter, also referred
Note 8 in V
VCAP
parameter).
*B 3990042 GVCH 05/03/2013 Updated Maximum Ratings (Changed “Ambient temperature with power
applied” to “Maximum junction temperature”).
*C 4568158 GVCH 11/13/2014 Added related documentation hyperlink in page 1.
*D 4693449 GVCH 03/20/2015 Updated package diagram spec 51-85128 *F to 51-85128 *G

CY14V256LA-BA35XIT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
NVRAM 256Kb 35ns 32K x 8 nvSRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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