LTC6268/LTC6269
15
62689f
For more information www.linear.com/LTC6268
With some extra layout techniques to reduce feedback
capacitance, the bandwidth can be increased. Note that
we are increasing the effective “bandwidth” of the 499kΩ
resistance. One of the main ways to reduce capacitance is
to increase the distance between the plates, in this case the
plates being the two endcaps of the component resistor.
For that reason, it will serve our purposes to go to a longer
resistor. An 0805 is longer than an 0603, but its endcaps are
also larger in area, increasing capacitance again. However,
increasing distance between the endcaps is not the only way
to decrease capacitance, and the extra distance between
the resistor endcaps also allows the easy application of
another technique to reduce feedback capacitance. A very
powerful method to reduce plate to plate capacitance is to
shield the E field paths that give rise to the capacitance. In
this particular case, the method is to place a short ground
trace between the resistor pads, near the TIA output end.
APPLICATIONS INFORMATION
Figure 8. A Normal Layout at Left and a Field-Shunting Layout at Right. Simply Adding a Ground Trace Under the Feedback Resistor
Does Much to Shunt Field Away from the Feedback Side and Dumps It to Ground. Note That the Dielectric Constant of Fr4 and Ceramic
Is Typically 4, so Most of the Capacitance Is in the Solids and Not Through the Air. (Reduced Pad Size On Right Is Not Shown.)
CERAMIC R SUBSTRATE
RESISTIVE
ELEMENT
E FIELD ⇒ C
ENDCAP
K
A
G
–2.5
FR4
I
PD
V
OUT
+
–
LTC6268
E E
CERAMIC R SUBSTRATE
RESISTIVE
ELEMENT
EXTRA GND
TRACE UNDER
RESISTOR
TAKE E FIELD TO GND,
MUCH LOWER C
ENDCAP
6268 F08
K
A
G
–2.5
FR4
I
PD
V
OUT
+
–
LTC6268
Such a ground trace shields the output field from getting
to the summing node end of the resistor and effectively
shunts the field to ground instead. Keeping the trace close
to the output end increases the output load capacitance
very slightly. See Figure 8 for a pictorial representation.
Figure 9 shows the dramatic increase in bandwidth simply
by careful attention to low capacitance methods around
the feedback resistance. Bandwidth was raised from
2.5MHz to 11.2MHz, a factor greater than 4. Methods
implemented were two:
1) Minimal pad sizing. Check with your board assembler
for minimum acceptable pad sizing, or assemble this
resistor using other means, and
2) Shield the feedback capacitance using a ground trace
under the feedback resistor near the output side.
Figure 7. Frequency Response of 499kΩ TIA without
Extra Effort to Reduce Feedback Capacitance is 2.5MHz
Figure 9. LTC6268 in a 499kΩ TIA with extra Layout Effort
to Reduce Feedback Capacitance Achieves 11.2MHz BW