LTC6268/LTC6269
16
62689f
For more information www.linear.com/LTC6268
APPLICATIONS INFORMATION
High Impedance Buffer
The very high input impedance of the LTC6268 makes it
ideal for buffering high impedance or capacitive sources.
The circuit of Figure 10 shows the LTC6268 applied as a
buffer, after a simple RC filter. The RLC network after the
buffer acts as an absorptive filter to avoid excessive time
domain reflections of the ADC glitches. The 2.048V refer
-
ence establishes
a midpoint inputzero” reference voltage.
The LT1395 high speed current feedback amplifier and its
associated resistor network attenuate the buffered signal
and render it differential by forcing the common mode
to virtual ground (the V
CM
voltage provided by the ADC).
Figure 10. LTC6268 as a High-Z Buffer Driving an LT1395 as
a Single-Ended to Differential Converter Into a 16-Bit ADC
A
IN
+
A
IN
LTC2269
1.8V
D15
D0
V
DD
1.8V
OV
DD
• • •
LTC2269 16-BIT 20 Msps ADC
6268 F10
V
CM
10MHz
CLOCK
CLOCK
CONTROL
OUTPUT
DRIVERS
OGNDGND
S/H
16-BIT
ADC CORE
LTC6655-2.048
V
IN
V
OUT_s
V
OUT_F
GND
SHDN
V
IN
V
IN
= 2.048V
±1.7V FS
V
REF
R2
75Ω
R1
49.9Ω
R6
100Ω
R7
100Ω
R4
49.9Ω
R10
75Ω
R16
49.9Ω
R17
49.9Ω
R15
402Ω
R13
825Ω
R18
49.9Ω
R11
75Ω
R8
200Ω
L4
100nH
L3
100nH
C5
.01µF
R14
402Ω
R12
825Ω
R5
49.9Ω
R9
200Ω
C2
10pF
C3
10pF
C4
100µF
C
IN
0.1µF
C4
0.1µF
L1
100nH
L2
100nH
+V
+V
R3
10M
C1
22pF
U1
+
LTC6268
LT1395
U2
+V
+V = 5V
–V = –5V
–V
+
+
+
LTC6268/LTC6269
17
62689f
For more information www.linear.com/LTC6268
Figure 11. Sampled Time Domain
Response of the Circuit of Figure 10
APPLICATIONS INFORMATION
Figure 11 shows the time domain response of a 10.101MHz
3V
P-P
input square wave, sampled at 10Msps, just 1ns
slower than the waveform rate. At this rate, the waveform
appears reconstructed at a rate of 1ns per sample, allowing
for a more immediate view of the settling characteristics,
even though each sample is really 100ns later.
Maintaining Ultralow Input Bias Current
Leakage currents into high impedance signal nodes can
easily degrade measurement accuracy of fA signals. High
temperature applications are especially susceptible to these
issues. For humid environments, surface coating may be
necessary to provide a moisture barrier.
There are several factors to consider in a low input bias
current circuit. At the femtoamp level, leakage sources can
come from unexpected sources including adjacent signals
on the PCB, both on the same layer and from internal
layers, any form of contamination on the board from the
assembly process or the environment, other components
on the signal path and even the plastic of the device pack
-
age. Care taken in the design of the system can mitigate
these sources and achieve excellent performance.
Figure 12. Example Layout of Inverting Amplifier
(or Trans-Impedance) with Leakage Guard Ring
(a)
(b)
HIGH-Z
SENSOR
(R
IN
)
LOW IMPEDANCE
NODE ABSORBS
LEAKAGE CURRENT
GUARD RING
LEAKAGE
CURRENT
NC
+IN
NC
–IN
V
+
V
SD
OUT
NO LEAKAGE CURRENT. V
–IN
= V
GRD
§
AVOID DISSIPATING SIGNIFICANT AMOUNTS OF POWER IN THIS RESISTOR.
IT WILL GENERATE THERMAL GRADIENTS WITH RESPECT TO THE INPUT PINS
AND LEAD TO THERMOCOUPLE-INDUCED ERROR.
V
BIAS
V
–IN
R
F
§
6268 F12
LTC6268
S8
NO SOLDER
MASK OVER
GUARD RING
+
GUARD RING
LTC6268
LEAKAGE
CURRENT
LEAKAGE CURRENT IS ABSORBED BY GROUND INSTEAD OF
CAUSING A MEASUREMENT ERROR.
V
OUT
V
+
V
HIGH-Z SENSOR
R
F
V
BIAS
+
V
IN
R
IN
The choice of device package should be considered because
although each has the same die internally, the pin spacing
and adjacent signals influence the input bias current. The
LTC6268/LTC6269 is available in SOIC, MSOP, DFN and
SOT-23 packages. Of these, the SOIC has been designed
as the best choice for low input bias current. It has the
largest lead spacing which increases the impedance of
the package plastic and the pinout is such that the two
input pins are isolated on the far side of the package from
the other signals. The gull-wing leads on this package
also allow for better cleaning of the PCB and reduced
contamination-induced leakage. The other packages have
advantages in size and pin count but do so by reducing
the input isolation. Leadless packages such as the DFN
offer the minimum size but have the smallest pin spacing
and may trap contaminants under the package.
TIME (10ns/DIV)
6268 F11
f
S
= 10Msps
f
IN
= 10.101MHz
0
ADC OUTPUTS (COUNTS)
60k
52k
56k
36k
44k
48k
40k
4k
8k
12k
16k
20k
24k
28k
32k
64k
440 460 480 520 540 560 580500
LTC6268/LTC6269
18
62689f
For more information www.linear.com/LTC6268
APPLICATIONS INFORMATION
The material used in the construction of the PCB can
sometimes influence the leakage characteristics of the
design. Exotic materials such as Teflon can be used to
improve leakage performance in specific cases but they
are generally not necessary if some basic rules are applied
in the design of conventional FR4 PCBs. It is important to
keep the high impedance signal path as short as possible
on the board. A node with high impedance is susceptible
to picking up any stray signals in the system so keeping it
as short as possible reduces this effect. In some cases, it
may be necessary to have a metallic shield over this por
-
tion of
the circuit. However, metallic shielding increases
capacitance.
Another technique for avoiding leakage paths
is to cut slots in the PCB. High impedance circuits are also
susceptible to electrostatic as well as electromagnetic ef
-
fects. The static charge carried by a person walking by the
cir
cuit can induce an interference on the order of 100’s of
femtoamps. A metallic shield can reduce this effect as well.
The layout of a high impedance input node is very important.
Other signals should be routed well away from this signal
path
and there should be no internal power planes under
it. The best defense from coupling signals is distance and
this includes vertically as well as on the surface. In cases
where the space is limited, slotting the board around the
high impedance input nodes can provide additional isola
-
tion and reduce the effect of contamination. In electrically
noisy environments the use of driven guard rings around
these nodes can be effective (see Figure 12). Adding any
additional components such as filters to the high imped
-
ance input node can increase leakage. The leakage current
of
a ceramic capacitor is orders of magnitude larger than
the bias current of this device. Any filtering will need to
be done after this first stage in the signal chain.
Low Input Offset Voltage
The LTC6268 has a maximum offset voltage of ±2.5mV
(PNP region) over temperature. The low offset voltage is
essential for precision applications. There are 2 different
input stages that are used depending on the input common
mode voltage. To increase the versatility of the LTC6268, the
offset voltages are trimmed for both regions of operation.
Rail-to-Rail Output
The LTC6268 has a rail-to-rail output stage that has ex
-
cellent output drive capability. It is capable of delivering
over ±40mA of output drive current over temperature.
Furthermore, the output can reach within 200mV of either
rail while driving ±10mA. Attention must be paid to keep
the junction temperature of the IC below 150°C.
Input Protection
To prevent breakdown of internal devices in the input stage,
the two op amp inputs should NOT be separated by more
than 2.0V. To help protect the input stage, internal circuitry
will engage automatically if the inputs are separated by
>2.0V and input currents will begin to flow. In all cases,
care should be taken so that these currents remain less
than 1mA. Additionally, if only one input is driven, inter
-
nal cir
cuitry will prevent any breakdown condition under
transient
conditions. The worst-case differential input
voltage usually occurs when the +input is driven and the
output is accidentally shorted to ground while in a unity
gain configuration.

LTC6269IDD#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Operational Amplifiers - Op Amps 2x 500MHz Ultra-L Bias C FET In Op Amp
Lifecycle:
New from this manufacturer.
Delivery:
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