NXP Semiconductors
PBSS5260QA
60 V, 1.7 A PNP low VCEsat (BISS) transistor
PBSS5260QA All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 28 August 2013 3 / 17
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - -60 V
V
CEO
collector-emitter voltage open base - -60 V
V
EBO
emitter-base voltage open collector - -7 V
I
C
collector current - -1.7 A
I
CM
peak collector current t
p
≤ 1 ms; pulsed - -2.5 A
I
B
base current - -0.3 A
I
BM
peak base current t
p
≤ 1 ms; pulsed - -1 A
[1] - 325 mW
[2] - 600 mW
[3] - 740 mW
[4] - 540 mW
P
tot
total power dissipation T
amb
≤ 25 °C
[5] - 1000 mW
T
j
junction temperature - 150 °C
T
amb
ambient temperature -55 150 °C
T
stg
storage temperature -65 150 °C
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm
2
.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 6 cm
2
.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5]
Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm
2
.
NXP Semiconductors
PBSS5260QA
60 V, 1.7 A PNP low VCEsat (BISS) transistor
PBSS5260QA All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 28 August 2013 4 / 17
T
amb
(°C)
-75 17512525 75-25
aaa-007844
0.50
0.75
0.25
1.00
1.25
P
tot
(W)
0
(1)
(2)
(3)
(4)
(5)
(1) FR4 PCB, 4-layer copper, 1 cm
2
(2) FR4 PCB, single-sided copper, 6 cm
2
(3) FR4 PCB, single-sided copper, 1 cm
2
(4) FR4 PCB, 4-layer copper, standard footprint
(5) FR4 PCB, single-sided copper, standard footprint
Fig. 2. Power derating curves
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] - - 385 K/W
[2] - - 209 K/W
[3] - - 169 K/W
[4] - - 232 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
in free air
[5] - - 125 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm
2
.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 6 cm
2
.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5]
Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm
2
.
NXP Semiconductors
PBSS5260QA
60 V, 1.7 A PNP low VCEsat (BISS) transistor
PBSS5260QA All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 28 August 2013 5 / 17
aaa-007845
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, single-sided copper, standard footprint
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-007846
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
-1
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, single-sided copper, 1 cm
2
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

PBSS5260QAZ

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT 60V,1.7A PNP low VCE sat (BISS) transi
Lifecycle:
New from this manufacturer.
Delivery:
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