83026I-01 Data Sheet
©2015 Integrated Device Technology, Inc December 15, 20154
TABLE 4A. AC CHARACTERISTICS, V
DD
= 3.3V ± 5%, V
DDO
= 3.3V ± 5%, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
f
MAX
Output Frequency 350 MHz
t
PD
Propagation Delay; NOTE 1
ƒ 350MHz
1.3 1.9 2.5 ns
tsk(o) Output Skew; NOTE 2, 4 15 ps
tsk(pp) Part-to-Part Skew; NOTE 3, 4 900 ps
tjit
Buffer Additive Phase Jitter, RMS, refer to
Additive Phase Jitter Section
0.03 ps
t
R
/ t
F
Output Rise/Fall Time 20% to 80% 150 800 ps
odc Output Duty Cycle
ƒ 66MHz
48 52 %
67MHz ƒ 166MHz
45 55 %
167MHz ƒ 350MHz
40 60 %
NOTE 1: Measured from the differential input crossing point to V
DDO
/2 of the output.
NOTE 2: Defi ned as skew between outputs at the same supply voltage and with equal load conditions.
Measured at V
DDO
/2.
NOTE 3: Defi ned as skew between outputs on different devices operating at the same supply voltages and with
equal load conditions. Using the same type of inputs on each device, the outputs are measured at V
DDO
/2.
NOTE 4: This parameter is defi ned in accordance with JEDEC Standard 6.
TABLE 3D. DIFFERENTIAL DC CHARACTERISTICS, V
DD
= 3.3V ± 5%, V
DDO
= 1.71V TO 3.465V, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
I
IH
Input High Current
nCLK V
IN
= V
DD
= 3.465V 150 µA
CLK V
IN
= V
DD
= 3.465V 150 µA
I
IL
Input Low Current
nCLK V
IN
= 0V, V
DD
= 3.465V -150 µA
CLK V
IN
= 0V, V
DD
= 3.465V -5 µA
V
PP
Peak-to-Peak Input Voltage; NOTE 1 0.15 1.3 V
V
CMR
Common Mode Input Voltage; NOTE 2, 3 GND + 0.5 V
DD
- 0.85 V
NOTE 1: V
PP
can exceed 1.3V provided that there is suffi cient offset level to keep V
IL
> 0V.
NOTE 2: For single ended applications, the maximum input voltage for CLK, nCLK is V
DD
+ 0.3V.
NOTE 3: Common mode voltage is defi ned as V
IH
.
83026I-01 Data Sheet
©2015 Integrated Device Technology, Inc December 15, 20155
TABLE 4B. AC CHARACTERISTICS, V
DD
= 3.3V ± 5%, V
DDO
= 2.5V ± 5%, TA = -40°C TO 85°C
TABLE 4C. AC CHARACTERISTICS, V
DD
= 3.3V ± 5%, V
DDO
= 1.8V ± 5%, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
f
MAX
Output Frequency 350 MHz
t
PD
Propagation Delay; NOTE 1
ƒ 350MHz
1.5 2.0 2.6 ns
tsk(o) Output Skew; NOTE 2, 4 15 ps
tsk(pp) Part-to-Part Skew; NOTE 3, 4 750 ps
tjit
Buffer Additive Phase Jitter,
RMS, refer to Additive Phase
Jitter Section
0.03 ps
t
R
/ t
F
Output Rise/Fall Time 20% to 80% 150 800 ps
odc Output Duty Cycle
ƒ 66MHz
48 52 %
67MHz ƒ 166MHz
46 54 %
167MHz ƒ 350MHz
40 60 %
NOTE 1: Measured from the differential input crossing point to V
DDO
/2 of the output.
NOTE 2: Defi ned as skew between outputs at the same supply voltage and with equal load conditions.
Measured at V
DDO
/2.
NOTE 3: Defi ned as skew between outputs on different devices operating at the same supply voltages and with
equal load conditions. Using the same type of inputs on each device, the outputs are measured at V
DDO
/2.
NOTE 4: This parameter is defi ned in accordance with JEDEC Standard 65.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
f
MAX
Output Frequency 350 MHz
t
PD
Propagation Delay; NOTE 1
ƒ 350MHz
1.9 2.5 3.1 ns
tsk(o) Output Skew; NOTE 2, 4 15 ps
tsk(pp) Part-to-Part Skew; NOTE 3, 4 600 ps
tjit
Buffer Additive Phase Jitter,
RMS, refer to Additive Phase
Jitter Section
0.03 ps
t
R
/ t
F
Output Rise/Fall Time 20% to 80% 200 900 ps
odc Output Duty Cycle
ƒ 66MHz
48 52 %
67MHz ƒ 166MHz
43 57 %
167MHz ƒ 350MHz
40 60 %
NOTE 1: Measured from the differential input crossing point to V
DDO
/2 of the output.
NOTE 2: Defi ned as skew between outputs at the same supply voltage and with equal load conditions.
Measured at V
DDO
/2.
NOTE 3: Defi ned as skew between outputs on different devices operating at the same supply voltages and with
equal load conditions. Using the same type of inputs on each device, the outputs are measured at V
DDO
/2.
NOTE 4: This parameter is defi ned in accordance with JEDEC Standard 65.
83026I-01 Data Sheet
©2015 Integrated Device Technology, Inc December 15, 20156
ADDITIVE PHASE JITTER
Input/Output Additive
Phase Jitter at 155.52MHz
= 0.03ps typical
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
1k 10k 100k 1M 10M 100M
The spectral purity in a band at a specifi c offset from the fun-
damental compared to the power of the fundamental is called
the dBc Phase Noise. This value is normally expressed using
a Phase noise plot and is most often the specifi ed plot in many
applications. Phase noise is defi ned as the ratio of the noise
power present in a 1Hz band at a specifi ed offset from the fun-
damental frequency to the power value of the fundamental. This
ratio is expressed in decibels (dBm) or a ratio of the power in the
As with most timing specifi cations, phase noise measurements
have issues. The primary issue relates to the limitations of the
equipment. Often the noise fl oor of the equipment is higher
than the noise fl oor of the device. This is illustrated above. The
1Hz band to the power in the fundamental. When the required
offset is specifi ed, the phase noise is called a dBc value, which
simply means dBm at a specifi ed offset from the fundamental.
By investigating jitter in the frequency domain, we get a better
understanding of its effects on the desired application over the
entire time record of the signal. It is mathematically possible to
calculate an expected bit error rate given a phase noise plot.
device meets the noise fl oor of what is shown, but can actually
be lower. The phase noise is dependant on the input source and
measurement equipment.
OFFSET FROM CARRIER FREQUENCY (HZ)
SSB PHASE NOISE dBc/HZ

83026BMI-01LFT

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer 1-to-2 Differential to LVCMOS Fanout Buf
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