13
5194F–SEEPR–1/08
AT24C1024B
Notes: 1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
Ordering Information
Ordering Code Voltage Package Operation Range
AT24C1024B-PU (Bulk form only) 1.8 8P3
Lead-free/Halogen-free/
Industrial Temperature
(–40qC to 85qC)
AT24C1024B-PU25 (Bulk form only) 2.5 8P3
AT24C1024BN-SH-B
(1)
(NiPdAu Lead Finish) 1.8 8S1
AT24C1024BN-SH-T
(2)
(NiPdAu Lead Finish) 1.8 8S1
AT24C1024BN-SH25-B
(1)
(NiPdAu Lead Finish) 2.5 8S1
AT24C1024BN-SH25-T
(2)
(NiPdAu Lead Finish) 2.5 8S1
AT24C1024BW-SH-B
(1)
(NiPdAu Lead Finish) 1.8 8S2
AT24C1024BW-SH-T
(2)
(NiPdAu Lead Finish) 1.8 8S2
AT24C1024BW-SH25-B
(1)
(NiPdAu Lead Finish) 2.5 8S2
AT24C1024BW-SH25-T
(2)
(NiPdAu Lead Finish) 2.5 8S2
AT24C1024B-TH-B
(1)
(NiPdAu Lead Finish) 1.8 8A2
AT24C1024B-TH-T
(2)
(NiPdAu Lead Finish) 1.8 8A2
AT24C1024B-TH25-B
(1)
(NiPdAu Lead Finish) 2.5 8A2
AT24C1024B-TH25-T
(2)
(NiPdAu Lead Finish) 2.5 8A2
AT24C1024BY7-YH-T
(2)
(NiPdAu Lead Finish) 1.8 8Y7
AT24C1024BY7-YH25-T
(2)
(NiPdAu Lead Finish) 2.5 8Y7
AT24C1024BU4-UU-T
(2)
1.8 8U4-1
AT24C1024B-W-11
(3)
1.8 Die Sale Industrial Temperature
(–40qC to 85qC)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.200” Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y7 8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
8U4-1 8-ball, die Ball Grid Array Package (dBGA2)
Options
–1.8 Low-voltage (1.8V to 3.6V)
–2.5 Low-voltage (2.5V to 5.5V)
