BNX024H01L Datasheet BNX024H01L, BNX026H01L, BNX027H01L | P10-P12

Spec.No. JENF243H-9101A-01 P 10/ 13

MURATA MFG.CO.,LTD.

Reference Only

12.2. Note for Assembling

When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.

Products can only be soldered with reflow.

The use in flow soldering be reserved.

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and products

surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way

that the temperature difference is limited to 100 °C max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

12.3. Attention Regarding P.C.B. Bending

The following shall be considered when designing P.C.B.'s and laying out products.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

〔Products direction〕

Products shall be locatedin the sideways

direction (Length:a

<b) to the mechanical

stress.

(2) Products location on P.C.B. near seam for separation.

Products (A,B,C,D) shall be located carefully

so that products are not subjected to the

mechanical stress due to warping the board.

Because they may be subjecte the mechanical

stress in order of A > C > B ≅ D.

12.4. Attention Regarding P.C.B. Design

< The Arrangement of Products >

P.C.B. shall be designed so that products are

far from the portion of perforation.

The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the

case of P.C.B. separation.

Products shall not be arranged on the line

of a series of holes when there are big

holes in P.C.B.

(Because the stress concentrate on the

line of holes.)

< Products Placing >

Support pins shall be set under P.C.B .

to prevent causing a warp to P.C.B.

during placing the products on the other

side of P.C.B.

Seam

Slit

Lengh:a<b

〈

Poor example

〉

〈

Good example

〉

Product

P.C.B.

Hole

○

Pick up nozzle

P.C.B.

Support pin

○

P.C.B.

Portion of

Perforation

Portion of

Perforation

Product

Spec.No. JENF243H-9101A-01 P 11/ 13

MURATA MFG.CO.,LTD.

Reference Only

< P.C.B. Separation >

P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

12.5. Standard Land Dimensions

2.3

2.8

5.3

6.2

7.1

9.6

9.9

10.2

12.5

3.8 5.8 10.3 13.2 13.7

17.5

Copper foil pattern

Copper foil pattern+Resist

Etchedarea

Through hole

（in ：

）

PSG

(1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered

substrate ).

(2) This product is designed to meet large current.

Please design PCB pattern which is connected to this product not to become too hot by applied large current.

(3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered

substrate) with through holes as shown above.

It is recommended to take the ground area as wide as possible.

(4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit

board wide.

(5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land

pads for CG should be designed as wide as possible.

12.6. Reflow Soldering

1) Solder paste printing for reflow soldering

· Standard thickness of solder paste should be 150 to 200 µm.

Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up

the terminal, being possible to lead to not enough connection between terminals and lands on the circuit

board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual

use condition.

· For the solder paste printing pattern, use standard land dimensions.

· For the resist and copper foil pattern, use standard land dimensions.

· Use Sn-3.0Ag-0.5Cu solder

Spec.No. JENF243H-9101A-01 P 12/ 13

MURATA MFG.CO.,LTD.

Reference Only

2) Soldering Conditions

Standard soldering profile and the limit soldering profile is as follows.

The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration

of product quality.

Standard Profile Limit Profile

Pre-heating 150°C ~ 180°C , 90s ± 30s

Heating above 220°C , 30s ~ 60s above 230°C , 60s max.

Peak temperature 250°C ± 3°C 260°C , 10s

Cycle of reflow 2 times 2 times

12.7. Reworking with Soldering iron

· The following conditions shall be strictly followed when using a soldering iron.

Soldering iron : 100W max.

Tip temperature/ Soldering time : 450°C ± 5°C, 5s

Note : Do not touch the products directly with the tip of the soldering iron.

12.8. Cleaning Conditions

Avoid cleaning product due to non-waterproof construction.

Please contact us for details, then use.

12.9．Moisture-proof coat material

Moisture–proof coating is made on inner parts of this product.

The Moisture–proof coat material might appear on the surface of product,which doesn’t affect on the product

performance.

12.10. Resin coating

The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of

resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to

use, please make the reliability evaluation with the product mounted in your application set.

1211. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

Limit Profile

Standard Profile

90s±30s

230°C

260°C

245°C±3°C

220°C

30s

～

60s

60s max.

180

150

Temp.

Time.(s)

(°C)

P1-P3 P4-P6 P7-P9 P10-P12 P13-P13

BNX024H01L

Mfr. #:

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Manufacturer:

Murata Electronics

Description:

EMI Filter Circuits 100M Ohm 15A SMD

Lifecycle:

New from this manufacturer.

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BNX024H01L

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