ADRF5160BCPZ

ADRF5160 Data Sheet
Rev. 0 | Page 10 of 12
TYPICAL APPLICATION CIRCUIT
Generate the evaluation PCB used in the typical application
circuit shown in Figure 17 with proper RF circuit design
techniques. Signal lines at the RF port must have a 50 Ω
impedance, and the package ground leads and backside ground
slug must connect directly to the ground plane. The evaluation
board shown in Figure 16 is available from Analog Devices, Inc.,
upon request.
16518-012
600-01533-00-2
RFC
GND
VDD
RF2
RF1
VCTL
THRU CAL
12
34
4 3
2
1
4
3
21
J3
J2
J1
R1
TP2
TP1TP3
C2
C4
C3
C1
Figure 16. ADRF5160-EVALZ Evaluation Board Component Placement
Table 6. Bill of Materials for the ADRF5160-EVALZ Evaluation Board
Reference Designator Description
C1 to C3 24 pF, 200 V ultralow, effective series resistance (ESR) capacitors, 0402
package
C4 0.3 pF, 200 V ultralow ESR capacitor, 0402 package
TP1, TP2, TP3 Test point connectors
R1 0 Ω resistor, 0402 package
J1, J2, J3 PCB mount, SubMiniature Version A (SMA) connectors
U1 ADRF5160 SPDT switch
PCB
1
ADRF5160-EVALZ
2
evaluation PCB
1
The circuit board material is Roger 4350 or Arlon 25FR.
2
Reference to this evaluation board number when ordering the complete evaluation board.
Data Sheet ADRF5160
Rev. 0 | Page 11 of 12
ADRF5160
GN
D
V
CTL
C3C1
C2
RFC
C4
R1
V
DD
RF1
RF2
GND
GND
RF2
G
N
D
GN
D
GND
GND
GND
GND
GND
RF1
GND
GND
GND
GND
GND
GND
GND
RFC
GND
GND
GND
GND
GND
GND
GND
V
DD
V
CT
L
GND
GND
GND
32 31 30 29 28
2
7 2
6 2
5
9
1
2
3
4
5
6
7
8
24
23
2
2
21
20
19
18
17
10
11
12 13
14 15
16
16518-011
Figure 17. Typical Application Circuit
ADRF5160 Data Sheet
Rev. 0 | Page 12 of 12
OUTLINE DIMENSIONS
03-09-2017-B
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.90
0.85
0.80
0.45
0.40
0.35
0.20 MIN
3.80
3.70 SQ
3.60
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.
PKG-004898
3.50 REF
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 18. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.85 mm Package Height
(HCP-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description Package Option
ADRF5160BCPZ −40°C to +105°C MSL3 32-lead Lead Frame Chip Scale Package [LFCSP] HCP-32-1
ADRF5160BCPZ-R7 −40°C to +105°C MSL3 32-lead Lead Frame Chip Scale Package [LFCSP] HCP-32-1
ADRF5160-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
2
See the Absolute Maximum Ratings section for additional information.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16518-0-5/18(0)

ADRF5160BCPZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs Low insertion loss,SPDT,3.5GHz,40W avg
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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