Data Sheet ADRF5160
Rev. 0 | Page 9 of 12
APPLICATIONS INFORMATION
EVALUATION BOARD
The ADRF5160-EVA L Z can withstand high power levels and
temperatures at which the device operates.
The ADRF5160-EVA L Z evaluation board is constructed with
eight metal layers and dielectrics between each layer, as shown
in Figure 13. Each metal layer has a 1 oz (1.3 mil) copper
thickness, and the external layers are plated to 2 oz.
The top dielectric material is 10 mil Rogers RO4350, which
exhibits a low thermal coefficient, offering control over thermal
rise of the board. The dielectrics between other metal layers are
FR4. The overall board thickness is 62 mil.
W = 18mil
G = 13mil
T = 2.1 mil
TOTAL THICKNESS = 60mil
H = 10mil
1.5oz Cu (2.1mil)
RO4350 = 10mil
FR4
FR4
FR4
FR4
FR4
FR4
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1oz Cu (1.3mil)
1.5oz Cu (2.1mil)
1.5oz Cu (2.1mil) 1.5oz Cu (2.1mil)
16518-013
Figure 13. ADRF5160-EVALZ Evaluation Board Cross Sectional View
The top copper layer has all RF and dc traces. The other seven
layers provide sufficient ground and help handle the thermal
rise on the ADRF5160-EVA L Z . In addition, via holes are
provided around transmission lines and under the exposed pad
of package, as shown in Figure 15, for proper thermal
grounding. RF transmission lines on the board are of a coplanar
wave guide design with a width of 18 mils and ground spacing
of 13 mils.
To ensure maximum heat dissipation and to reduce thermal rise
on the board, some application considerations are essential. The
evaluation board must be attached to a copper support plate at
the bottom of the board. The ADRF5160-EVA L Z comes with
this support plate attachment. Attach this evaluation board with
its support plate to a heat sink using thermal grease during all
high power operations. Figure 14 shows the board temperature
vs. the RF power input tested with the preceding conditions and
precautions (the evaluation board and support plate are attached
to a heat sink). The temperature rise is less than 8°C up to
48 dBm of RF power input, which provides the required
thermal dissipation when operating at high power levels.
BOARD TEMPERATURE (°C)
RF POWER INPUT (dBm)
43.0 43.5 44.5 45.5 46.5 47.5
36
35
34
33
32
31
30
29
28
27
26
25
44.0 45.0 46.0 47.0 48.0
16518-014
Figure 14. ADRF5160-EVALZ Evaluation Board Temperature Rise
(Oven Temperature Set to 25°C)
16518-015
R1
TP2
TP1
TP3
C2
C4
C3
C1
Figure 15. ADRF5160-EVALZ Evaluation Board Layout
