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www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron, the Micron logo, and TwinDie are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
4Gb: x4, x8 TwinDie DDR3 SDRAM
Package Dimensions
PDF: 09005aef83188bab/Source: 09005aef83169de6 Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT41J1G4_64M_32M_twindie.fm - Rev. F 11/09 EN
14 ©2008 Micron Technology, Inc. All rights reserved.
Figure 7: 78-Ball FBGA Package Dimensions – Rev. D
Note: All dimensions are in millimeters.
Ball A1 ID
Seating
plane
0.12
A
A
0.8 ±0.1
1.2 MAX
0.25 MIN
9 ±0.15
Ball A1 ID
9.6
CTR
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.35
SMD ball pads.
78X Ø0.45
11.5 ±0.15
0.8 TYP
0.8 TYP
6.4 CTR
9 8 7 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
