Pin Descriptions
The pin description table below is a comprehensive list of all possible pins for all DDR3
modules. All pins listed may not be supported on this module. See Pin Assignments for
information specific to this module.
Table 6: Pin Descriptions
Symbol Type Description
Ax Input Address inputs: Provide the row address for ACTIVE commands, and the column ad-
dress and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments table for density-specific ad-
dressing information.
BAx Input Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, or MR3) is loaded during the LOAD MODE command.
CKx,
CKx#
Input Clock: Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.
CKEx Input Clock enable: Enables (registered HIGH) and disables (registered LOW) internal circui-
try and clocks on the DRAM.
DMx Input Data mask (x8 devices only): DM is an input mask signal for write data. Input data
is masked when DM is sampled HIGH, along with that input data, during a write ac-
cess. Although DM pins are input-only, DM loading is designed to match that of the
DQ and DQS pins.
ODTx Input On-die termination: Enables (registered HIGH) and disables (registered LOW) termi-
nation resistance internal to the DDR3 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input
will be ignored if disabled via the LOAD MODE command.
Par_In Input Parity input: Parity bit for Ax, RAS#, CAS#, and WE#.
RAS#, CAS#, WE# Input Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.
RESET# Input
(LVCMOS)
Reset: RESET# is an active LOW asychronous input that is connected to each DRAM
and the registering clock driver. After RESET# goes HIGH, the DRAM must be reinitial-
ized as though a normal power-up was executed.
Sx# Input Chip select: Enables (registered LOW) and disables (registered HIGH) the command
decoder.
SAx Input Serial address inputs: Used to configure the temperature sensor/SPD EEPROM ad-
dress range on the I
2
C bus.
SCL Input Serial clock for temperature sensor/SPD EEPROM: Used to synchronize communi-
cation to and from the temperature sensor/SPD EEPROM on the I
2
C bus.
CBx I/O Check bits: Used for system error detection and correction.
DQx I/O Data input/output: Bidirectional data bus.
DQSx,
DQSx#
I/O Data strobe: Differential data strobes. Output with read data; edge-aligned with
read data; input with write data; center-aligned with write data.
2GB, 4GB (x72, ECC, SR) 240-Pin DDR3L RDIMM
Pin Descriptions
PDF: 09005aef83b2f73b
ksf9c256_512x72pz.pdf - Rev. I 7/15 EN
4
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