Package and PCB thermal data VND5050J-E / VND5050K-E
24/37 Doc ID 12266 Rev 7
4 Package and PCB thermal data
4.1 PowerSSO-12™ thermal data
Figure 31. PowerSSO-12™ PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70μm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 32. R
thj-amb
vs PCB copper area in open box free air condition (one channel
on)
30
35
40
45
50
55
60
65
70
0246810
RTHj_amb(°C/ W)
PCB Cu heatsink area (cm^2)