AD8108/AD8109 Data Sheet
Rev. C | Page 8 of 27
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter Rating
Supply Voltage 12.0 V
Internal Power Dissipation
1
AD8108/AD8109 80-Lead Plastic LQFP (ST) 2.6 W
Input Voltage ±V
S
Output Short-Circuit Duration
Observe power
derating curves
Storage Temperature Range
2
−65°C to +125°C
1
Specification is for device in free air (T
A
= 25°C). 80-lead plastic LQFP (ST):
θ
JA
= 48°C/W.
2
Maximum reflow temperatures are to JEDEC industry standard J-STD-020.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8108/AD8109 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 125°C. Temporar ily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 125°C for an extended
period can result in device failure.
While the AD8108/AD8109 are internally short-circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (125°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 5.
AMBIENT TEMPERATURE (
°C)
5.0
MAXIMUM POWER DISSIPATION (Ω
)
4.0
0
–
50 80–
40 –30
–20 –10 0 10 20 30
40
50 60
70
3.0
2.0
1.0
T
J
= 125
°C
90
01068-004
Figure 5. Maximum Power Dissipation vs. Temperature
ESD CAUTION
